REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. 1.2.2, device type 01, change the generic number to ACT5028-201. 09-03-30 Joseph D. Rodenbeck B Added device type 03. Replaced figure 6. Changed paragraph 6.8 to include the device type 03 and make corrections. -sld 10-09-14 Charles F. Saffle C Table I; Added footnote 2 to the Input capacitance test (CIN) and separated the device type 03 from device type 01 and 02 with a max limit of 120 ns for CW/CCW, RIPPLE, B1-B16 rise and fall time test. sld 10-10-27 Charles F. Saffle D Added radiation hardness assurance requirements. Paragraph 1.3; Added Power Dissipation (PD) rating. Corrected Maximum junction temperature from "135°C" to "150°C". Table I; Added "Operating Supply Current (ISC)" test. Corrected the subgroups from "1,2,3" to "4,5,6" and added footnote 4 for the VCO frequency (fVCO) test. Table II; Added subgroup 1 for Interim electrical parameters. -sld 12-12-17 Charles F. Saffle REV SHEET REV D D D D D D D D D D D D D D D D D SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Steve Duncan STANDARD MICROCIRCUIT DRAWING CHECKED BY Raymond Monnin THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raymond Monnin AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil/ MICROCIRCUIT, LINEAR, RESOLVER-TODIGITAL CONVERTER, 16-BIT, TRACKING, MONOLITHIC SILICON DRAWING APPROVAL DATE 04-10-01 REVISION LEVEL D SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-04235 31 5962-E411-12 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 Federal stock class designator \ H RHA designator (see 1.2.1) 04235 03 Device type (see 1.2.2) / K Device class designator (see 1.2.3) X Case outline (see 1.2.4) X Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 03 Circuit function ACT5028-201 ACT5028-202 RDC5028-301 Resolver-to-digital converter, tracking, 16-bit Resolver-to-digital converter, tracking, 16-bit Resolver-to-digital converter, tracking, 16-bit 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Descriptive designator See figure 1 Terminals Package style 52 Ceramic, quad flat package 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Positive supply voltage range (VCC and VDD).............................. .................. Analog output current (Output shorted to GND)......................... .................. Digital output current (Output shorted to GND) ............................................. Analog input voltage range ........................................................................... Digital input voltage range ............................................................................ Power dissipation (PD), TC = -55°C to +125°C .............................................. Thermal resistance, junction-to-case (θJC) .................................................... Junction temperature (TJ)......................................................... ..................... Storage temperature ..................................................................................... Lead temperature (soldering, 10 seconds) ................................................... -0.5 V dc to +7.0 V dc 32 mA 18.6 mA -0.3 V to (VCC + .3 V) -0.3 V to (VDD + .3 V) 200 mW 1.25°C/W +150°C -65°C to +150°C +300°C 1.4 Recommended operating conditions. Operating voltage range (VCC and VDD) .......................................................... Operating current (ICC + IDD) ........................................................................... Ambient operating temperature range (TA)..................................................... +4.5 V dc to +5.5 V dc 23 mA -55°C to +125°C 1.5 Radiation features. 2/ Total Ionizing Dose (TID) ...... (dose rate = 50 - 300 rad(Si)/s): In accordance with MIL-STD-883, method 1019, condition A.................... Enhanced Low Dose Rate Sensitvity (ELDRS)............................................. Single event phenomenon (SEP) effective linear energy transfer (LET): No SEL ...................................................................................................... 1 Mrad(Si) CMOS Immune 2 < 100 MeV-cm /mg 3/ 4/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. _________ 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ See section 4.3.5 for the manufacturer's radiation hardness assurance analysis and testing. 2 3/ Single event testing was performed at 100 MeV-cm /mg with no latch-up exhibited. 4/ See table IB. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 3 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM F 1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Functional Block diagram. The functional block diagram shall be as specified on figure 4. 3.2.5 Transfer function diagram. The transfer function diagram shall be as specified on figure 5. 3.2.6 Timing diagram(s). The timing diagram(s) shall be as specified on figure 6. 3.2.7 Radiation exposure circuits. The radiation exposure circuits shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table IA. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 4 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime - VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 5 TABLE IA. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C VCC = VDD = +5 V dc unless otherwise specified Group A subgroups Device types Limits Min Unit Max DC PARAMETERS Operating Supply Current 2/ ISC VCC = VDD = +5.5 V dc 1,2,3 All 35 mA Accuracy 2/ 3/ ACC Add 1 LSB for total error 1,2,3 All ±5 Minutes 1,2,3 All 1 LSB 1,2,3 All Repeatability Resolution per LSB, 2/ (see paragraph 6.8) RES 10 Bit Mode 12 Bit Mode 14 Bit Mode 16 Bit Mode 10 Bit Mode 12 Bit Mode 14 Bit Mode 16 Bit Mode Maximum tracking rate 2/ 10 Bit Mode 12 Bit Mode 14 Bit Mode 16 Bit Mode SC1 SC2 Bits used 0 0 B1 - B10 0 1 B1 - B12 1 0 B1 - B14 1 1 B1 - B16 1,2,3 0.35 0.09 0.022 0.0055 Degrees 21.1 5.27 1.32 0.33 Minutes All 1024 256 64 16 RPS 1.05 MHz VCO frequency 4/ ANALOG INPUTS fVCO 4,5,6 All Voltage between ± analog signal inputs, ±SIN, ±COS, ±REF 2/ 4/ VSIN,VCOS, VREF 4,5,6 All 1.0 1.5 Vrms Reference input frequency, ±REF 4/ fREF 4,5,6 All 45 30K Hz Input impedance 4/ ZIN TA = +25°C and +125°C 1,2 All 2.5 Input capacitance 4/ CIN TA = +25°C 1 All DC voltage bias on -SIN, and -COS VB 1,2,3 All Input bias current 2/ IB 1 All 2 MΩ 15 pF 2.0 2.5 V dc -100 +100 -1000 +1000 nA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 6 TABLE IA. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C VCC = VDD = +5 V dc unless otherwise specified Group A subgroups Device types Limits Min Unit Max DC PARAMETERS - CONTINUED, DIGITAL INPUTS ENABLE, DATA LOAD, INH, SC1, and SC2 Input low voltage 4/ VIL 1,2,3 All Input high voltage 4/ VIH 1,2,3 All 2.0 Input leakage current 2/ ILI 1 All -200 +200 nA -2000 +2000 nA 2 Input impedance 2/ ZIN TA = +25°C and +125°C Input capacitance 4/ CIN 0.8 V dc V dc 1,2 All 2.5 TA = +25°C 1 All 15 pF 0.3 V dc MΩ DIGITAL OUTPUTS BUSY, RIPPLE, and CW / CCW Output low voltage 2/ VOL IOL = 1.6 mA 1,2,3 All Output high voltage 2/ VOH IOH = -1.6 mA 1,2,3 All VLI/O - .8 V dc DIGITAL I/O, B1 - B16 5/ Input low voltage 4/ VIL 1,2,3 All Input high voltage 4/ VIH 1,2,3 All Output low voltage 2/ VOL IOL = 1.6 mA 1,2,3 All Output high voltage 2/ VOH IOH = -1.6 mA 1,2,3 All VLI/O - .8 Input leakage current 2/ ILI 1 All -200 +200 nA -2000 +2000 nA -200 +200 nA -2000 +2000 nA 2 High-Z leakage current 4/ IZ 1 2 All 0.8 V dc 2.0 V dc 0.3 V dc V dc See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 7 TABLE IA. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C VCC = VDD = +5 V dc unless otherwise specified Group A subgroups Device types Limits Min Unit Max AC TIMING, DIGITAL OUTPUT, CL = 50 pF BUSY rise and fall time 2/ tLH, tHL See figure 6 9,10,11 All 85 ns CW / CCW, RIPPLE, B1 − B16 rise and fall time tLH, tHL See figure 6 9,10,11 01, 02 100 ns 03 120 2/ BUSY pulse width 2/ tBPW See figure 6 9,10,11 All BUSY to data stable 4/ tBDS ENABLE = low, See figure 6 9,10,11 All RIPPLE pulse width 2/ tRPW See figure 6 9,10,11 All BUSY to RIPPLE 4/ tBR See figure 6 9,10,11 300 600 ns 350 ns 300 ns All 150 ns 140 READ DATA, ENABLE and INH are tied together , DATA LOAD = log ic Hi, CL = 50 pF ENABLE low to data stable 4/ tELDS See figure 6 9,10,11 All 70 ns ENABLE high to data Hi − Z 4/ tEHZ See figure 6 9,10,11 All 70 ns INH low to data stable 4/ tILDS See figure 6 9,10,11 All 400 ns INH high to data change 4/ tIHZ See figure 6 9,10,11 All 150 ns WRITE DATA, ENABLE and INH = log ic Hi, CL = 50 pF DATA LOAD pulse width 4/ tDLPW See figure 6 9,10,11 All 200 ns Data setup to DATA LOAD 4/ tWDS See figure 6 9,10,11 All 60 ns Data hold 4/ tWDH See figure 6 9,10,11 All 10 ns See foonotes at top of next page. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 8 TABLE IA. Electrical performance characteristics - Continued. 1/ For radiation features see paragraph 1.5 herein. 2/ This device has been tested to (1.5 Mrad(Si)) to ensure RHA designator level "H" (1 Mrad(Si)) of Method 1019, condition A of MIL-STD-883 at +25°C for these parameters. This device will be re-tested after design or process changes that can affect RHA response of this device 3/ Accuracy applies over the full operating power supply voltage range, Full operating temperature range, reference frequency range, 10 percent signal amplitude variation, and 10 percent reference harmonic distortion. 4/ Parameter shall be tested as part of device characterization and after design and process changes. Thereafter, parameters shall be guaranteed to the limits specified in table IA. 5/ All unused inputs shall be tied to ground. Bit 1 is always the MSB. TABLE IB. SEP test limits. 1/ Device type SEP Temperature (TC) Effective linear energy transfer (LET) 03 No SEL (Destructive) +125°C ≤ 100 MeV-cm /mg 2 1/ For SEP test conditions, see 4.3.5.1.2.2 herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 9 Symbol A A1 A2 b b1 c D/E D1/E1 e L Millimeters Min Max 2.54 1.42 1.78 0.20 REF 0.58 TYP 0.43 TYP 0.13 0.20 24.28 15.11 15.37 1.27 TYP 6.30 6.40 Inches Min Max .100 .056 .070 .008 REF .023 TYP .017 TYP .005 .008 .956 .595 .605 .050 TYP .248 .252 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is indicated by the ESD triangle marked on top of the package. FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 10 Device types 01, 02, and 03 Terminal number 1 Terminal symbol Terminal number DATA LOAD 19 Terminal symbol AGND Terminal number 37 Terminal symbol BIT 9 2 VLI/O 20 N/C 38 BIT 10 3 AGND 21 -SIN 39 BIT 11 4 VCC or +5 VA 22 +SIN 40 BIT 12 5 VCOIN 23 AGND 41 BIT 13 6 INTIN2 24 -COS 42 BIT 14 7 N/C 25 +COS 43 BIT 15 8 INTIN1 26 DGND 44 BIT 16 (LSB) 9 INT1 27 VDD or +5 VD 45 ENABLE 10 INT2 28 BIT 1 (MSB) 46 N/C 11 +REF 29 BIT 2 47 INH 12 -REF 30 BIT 3 48 SC2 13 AC2 31 BIT 4 49 SC1 14 AC1 32 BIT 5 50 BUSY 15 BPF2 33 N/C 51 CW/CCW 16 BPF1 34 BIT 6 52 RIPPLE 17 DEMOD1 35 BIT 7 18 DEMOD2 36 BIT 8 FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 11 FIGURE 3. Block diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 12 FIGURE 4. Functional block diagram. FIGURE 5. Transfer function diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 13 FIGURE 6. Timing diagram(s). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 14 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1 Final electrical parameters 1*, 2, 3, 9, 10, 11 Group A test requirements 1, 2, 3, 9, 10, 11 Group C end-point electrical parameters 1, 2, 3, 9, 10, 11 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices 1 * PDA applies to subgroup 1. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8A, and 8B shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 15 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as specified herein. See table IIIA and table IIIB. Table IIIA. Radiation Hardness Assurance Method Table. RHA method employed Testing at 1.5X rated total dose Element Level Hybrid Device Level Yes Yes (See 4.3.5.1.1) Worst Case Analysis Performed No Includes Combines temperature temperature and effects radiation effects N/A N/A Combines End-of-life total dose and displacement effects N/A N/A End points after dose is achieved includes minimum maximum, and room temperatures Element Hybrid device level Level No No Table IIIB. Hybrid level and element level test table. Low Dose Rate CMOS IC NOTES: X = G = (N) = N/A = G Total Dose High Dose Rate (HDR) X (1.5 Mrad) (See 4.3.5.1.1) ELDRS G Radiation Test Heavy Ion SEU SEL (upset) (latch-up) +125°C (N) X (100 MeV2 cm /mg) Proton Low High Energy Energy (N) (N) SEE (upset) Neutron Displacement Damage (DD) (N) (N) Radiation testing done (Level) Guaranteed by design or process Not yet tested Not applicable for this SMD STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 16 4.3.5.1 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime -VQ) approved plan and with MIL-PRF-38534, Appendix G. a. The hybrid device manufacturer shall establish procedures controlling component radiation testing, and shall establish radiation test plans used to implement component lot qualification during procurement. Test plans and test reports shall be filed and controlled in accordance with the manufacturer's configuration management system. b. The hybrid device manufacturer shall designate a RHA program manager to oversee component lot qualification, and to monitor design changes for continued compliance to RHA requirements. 4.3.5.1.1 Hybrid level RHA qualification. Hybrid level and element level testing are the same for the device on this (SMD) since the active element is accessible to the device leads for test. 4.3.5.1.2 Element level qualifcation. 4.3.5.1.2.1 Total ionizing dose irradiation testing. Every wafer lot of the active element used will be tested at HDR in accordance with condition A of method 1019 of MIL-STD-883 to 1.5 Mrad(Si). A minimum of 5 biased samples which were determined to be worst case will be tested. 0.9000/90% statistics are applied to the device parameters as specified in table IA herein. 4.3.5.1.2.2 Single Event Phenomena (SEP). A minimum of four samples of device type 03 is characterized for SEP response at initial qualification and after any design or process changes which may affect the RHA response of the device. Testing shall be performed in accordance with ASTM F 1192. Test conditions for SEP are as follows: a. The ion beam angle of incidence shall be normal to the die surface at 46 degrees. No shadowing of the ion beam due to fixturing is allowed. b. The fluence shall be ≥ 1x10 particles/cm . c. The flux shall be between 10 and 10 ions/cm /s. d. The particle range shall be ≥ 35 micron in silicon. e. The characterization is performed at maximum recommended voltages, input 5KHz constantly rotating angles, 16-bit configuration and the test temperature shall be +125°C ± 10°C in air. 7 2 2 5 2 4.3.5.2 RHA Lot Acceptance. Each wafer lot of the active element shall be evaluated for acceptance in accordance with MILPRF-38534 and herein. 4.3.5.2.1 Total ionizing dose. See paragraph 4.3.5.1.2.1 herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 17 4.3.5.2.2 Enhanced Element Evaluation. Enhanced Element Evaluation per Table IV herein including 45 devices subjected to Group C2, 1000 hours life testing, is required only for those devices with the RHA designator as specified herein. Table IV. Enhanced Element Evaluation For Microcircuit Die. Subgroup Class K 2 X 1 3 4 Test MIL-STD-883 Method Condition 2010 X X X Element visual Assembled into package as specified in 1.2.4 herein. Element electrical Internal visual Temperature cycling X Constant acceleration 2001 X Burn-in 1015 X X Interim electrical Burn-in 1015 X X Post burn-in Final Electrical, Group A Steady-state life 1005 5 X X Final electrical Wire bond evaluation 3/ 2011 6 X SEM 2018 Quantity (accept number) 100 percent 100 percent 100 percent 100 percent 2017 1010 C Reference Paragraph 1/ C.3.3.2 C.3.3.1 C.5.5 C.3.3.3 100 percent 3000g’s, Y1 direction 160 hours minimum at +125°C C.5.6 C.3.3.4.3 160 hours minimum at +125°C C.5.10 1000 hours minimum at +125°C 45(0) 2/ 10(0) wires or 20(1) wires See method 2018 of MIL-STD-883 C.3.3.4.3 C.3.3.3 C.3.3.5 C.3.3.6 1/ See MIL-PRF-38534. 2/ Die shall be traceable to the wafer and wafer lot. The sample size shall consist of a minimum of 3 die from each wafer and a minimum of 45 die from each wafer lot. 3/ This device herein is manufactured with aluminum wires and aluminum bond sites on the IC. No bimetallic bonds. 4.3.5.3 Technologies not tested. The active element in this device is RHA tested. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 18 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime -VA and have agreed to this drawing. 6.7 Pin functions. Microcircuits conforming to this drawing shall have the pin functions as specified in table V herein. 6.8 Additional information. When applicable, a copy of the following additional data shall be maintained and available from the device manufacturer: a. RHA upset levels. b. Test conditions (SEP). c. Occurrence of latchup (SEP). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 19 Table V. Pin functions. SIGNAL DIRECTION PIN SIGNAL DESCRIPTION +SIN -SIN INPUT 22 21 Analog Sine input from Synchro or Resolver. 1.3 V rms nominal +COS -COS INPUT 25 24 Analog Cosine input from Synchro or Resolver. 1.3 V rms nominal +REF -REF INPUT 11 12 Analog Reference input BIT 1 (MSB) BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7 BIT 8 BIT 9 BIT 10 BIT 11 BIT 12 BIT 13 BIT 14 BIT 15 BIT 16 (LSB) BIDIR 28 29 30 31 32 34 35 36 37 38 39 40 41 42 43 44 Digital angle data. Parallel format. Natural binary positive logic. Bit 1, most significant bit = 180°, Bit 2 = 90°, Bit 3 = 45° and so on. SC1 SC2 INPUT 49 48 Digital input. Sets the resolution. SC1 SC2 Resolution 0 0 10 bit 0 1 12 bit 1 0 14 bit 1 1 16 bit ENABLE INPUT 45 Logic 0 enables digital angle output. Otherwise it is high impedance. INH INPUT 47 Logic 0 freezes the digital angle output so that it can be safely read. DATA LOAD INPUT 1 Logic 0 enables the digital angle lines to be inputs to preset the angle. Logic 1 is for normal digital angle output. BUSY OUTPUT 50 A logic 1 pulse when the digital angle changes by 1 LSB. CW/CCW OUTPUT 51 For turns counting. Logic 1 = counting up (CW), logic 0 = counting down (CCW). RIPPLE OUTPUT 52 Ripple clock for turns counting. A logic 0 pulse = a 0° transition in either direction. In the 10 bit mode, Bit 10 is the LSB. Bits 11-16 are 0s. In the 12 bit mode, Bit 12 is the LSB. Bits 13-16 are 0s. In the 14 bit mode, Bit 14 is the LSB. Bits 15-16 are 0s. In the 16 bit mode, Bit 16 is the LSB. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 20 Table V. Pin functions - Continued. SIGNAL DIRECTION PIN SIGNAL DESCRIPTION AC1 AC2 OUTPUT 14 13 Differential AC error output BPF1 BPF2 INPUT 16 15 Differential AC error input to demodulator OUTPUT 17 18 Differential DC error output INPUT 8 6 Differential DC input to differential velocity integrator OUTPUT 9 10 Differential velocity output INPUT 5 Input to Voltage Controlled Oscillator POWER 4 27 Analog Power In Digital Power In A GND D GND POWER 3,19,23 26 VLi/o POWER 2 DEMOD1 DEMOD2 INTIN1 INTIN2 INT1 INT 2 VCOIN VCC or +5 VA VDD or +5 VD STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Analog Power ground Digital Power ground Digital input/output DC power supply. Sets logic 1 level. +3V to +5V SIZE 5962-04235 A REVISION LEVEL D SHEET 21 6.9 Die anomalies. The first anomoly exists only for device types 01 and 02. The first anomaly is the instability at 360° and 180° input angles. This problem only occurs in the 16-bit mode when rotating in the clockwise direction and has been observed on 100 percent of the parts at 25°C. It occurs 100 percent of the time at 360° and approximately 76 percent at 180°. At 360° the problem occurs when the counter passes from FFFF to 0000 then reverse rotation counter clockwise back to FFFF. At 180° the problem occurs when the counter passes from 7FFF to 8000 then reverse rotation counter clockwise back to 7FFF. Two different failure modes have been observed for this anomaly and are as follows: 1). The output latch locks to a value with the most significant bit (MSB) inverted giving indication that the part is 180° out phase, the part exhibits zero error. This condition remains indefinitely until the resolver rotates in either direction by one count. At which time, the part responds to the 180° error which takes less than 150 milliseconds to correct. 2). The part sees an immediate error of 180° and begins to correct this error which takes less than 150 milliseconds. In some cases it has been observed that the MSB is fine but the next bit gets inverted which provides a 90° error. In this case the time required for the part to correct itself is less than 75 milliseconds. The recommended actions to avoid this problem are as follows: 1). Use the 10, 12, or 14-bit mode. For device type 02 only, the ambient operating temperature range for 10 and 12-bit mode is -55°C to +125°C, for 14-bit mode is -40°C to +125°C. 2). Insure hysteresis of at least one bit to prevent this anomaly when rotating very slowly. 3). Avoid reversing direction at 360° and 180° when rotating in the clockwise direction. 4). If the resolver stops within two counts of 360° or 180° wait 150 milliseconds after motion resumes before reading the parts output. The second anomaly for device types 01, 02, and 03 is correcting the Integral Nonlinearity Error . The following information is provided to address the constant Integral Nonlinearity (INL) that exists at each angle of the part. The error is repeatable from part to part and table VI of offsets is included herein that must be added to the output of the part to get the correct angle. Figure 7 shows the error in minutes that exist at 2° increments for the full 360°. The INL error from 0° to 180° is basically the same error between 180° to 360°. Table VI has the angle correction factor (in minutes) that must be added to zero out the INL error. A simple calculation can be performed to derive a correction factor for angles that fall between the angles listed in table VI herein. AL AS CL CS NA NCF = = = = = = Larger Angle Smaller Angle Correction factor associated with Larger Angle Correction factor associated with Smaller Angle New Angle New Correction Factor Formula: NCF = CS + ((( NA - AS) / (AL - AS)) * (CL - CS)) Example: Require the correction factor at 15° NCF = 23.4009 + (((15 -14) / (16 - 14)) * (24.0326 - 23.4009)) NCF = 23.4009 + (((1) / (2)) * .6137 NCF = 23.4009 + (.5 * .6137) NCF = 23.4009 + .31585 NCF = 23.71675 minutes STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 22 Device type 01. FIGURE 7. Anomaly 2, Angle Error Chart. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 23 Device type 02. FIGURE 7. Anomaly 2, Angle Error Chart - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 24 Device type 03. FIGURE 7. Anomaly 2, Angle Error Chart - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 25 Table VI. Anomaly 2, Correction Factor (minutes) for device type 01. Angle 0 Correction Factor Angle Correction Factor Angle Correction Factor Angle Correction Factor 0.125244141 90 0.415283203 180 0.145019531 270 0.474609375 2 1.911621094 92 1.153564453 182 1.997314453 272 1.206298828 4 4.073730469 94 1.977539062 184 3.981445312 274 1.970947266 6 5.715087891 96 2.537841797 186 5.754638672 276 2.577392578 8 6.868652344 98 2.814697266 188 6.822509766 278 2.649902344 10 8.411132812 100 3.071777344 190 8.411132813 280 3.150878906 12 9.241699219 102 2.735595703 192 9.221923828 282 2.794921875 14 10.17114258 104 2.656494141 194 10.19750977 284 2.682861328 16 11.11376953 106 2.478515625 196 11.09399414 286 2.564208984 18 11.54882812 108 1.885253906 198 11.44995117 288 1.858886719 20 11.94433594 110 1.285400391 200 11.97729492 290 1.562255859 22 11.99707031 112 0.837158203 202 12.01025391 292 0.626220703 24 11.91137695 114 -0.243896484 204 11.88500977 294 -0.171386719 26 12.26733398 116 -0.626220703 206 12.19482422 296 -0.652587891 28 11.85205078 118 -1.621582031 208 12.10913086 298 -1.496337891 30 11.77954102 120 -2.168701172 210 11.82568359 300 -2.083007812 32 11.97070312 122 -2.814697266 212 11.92456055 302 -2.649902344 34 11.64770508 124 -3.460693359 214 11.64111328 304 -3.618896484 36 11.26538086 126 -4.548339844 216 11.22583008 306 -4.403320313 38 10.90942383 128 -4.871337891 218 10.89624023 308 -4.95703125 40 10.16455078 130 -5.945800781 220 10.13818359 310 -5.879882812 42 9.683349609 132 -6.842285156 222 9.650390625 312 -6.723632813 44 9.030761719 134 -7.48828125 224 8.984619141 314 -7.461914063 46 8.002441406 136 -8.582519531 226 7.969482422 316 -8.450683594 48 7.237792969 138 -9.043945313 228 7.218017578 318 -8.918701172 50 6.545654297 140 -9.887695313 230 6.492919922 320 -9.755859375 52 5.6953125 142 -10.31616211 232 5.682128906 322 -10.29638672 54 5.174560547 144 -10.73144531 234 5.174560547 324 -10.81054687 56 4.198974609 146 -11.15332031 236 4.185791016 326 -11.29174805 58 3.487060547 148 -11.43017578 238 3.520019531 328 -11.3972168 60 2.939941406 150 -11.32470703 240 2.887207031 330 -11.44995117 62 2.241210938 152 -11.64770508 242 2.181884766 332 -11.57519531 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 26 Table VI. Anomaly 2, Correction Factor (minutes) for device type 01 - Continued. Angle 64 Correction Factor Angle Correction Factor Angle Correction Factor Angle Correction Factor 1.614990234 154 -11.70043945 244 1.588623047 334 -11.65429688 66 1.087646484 156 -11.71362305 246 1.114013672 336 -11.62792969 68 0.131835938 158 -11.5949707 248 0.171386719 338 -11.62792969 70 -0.547119141 160 -11.58837891 250 -0.573486328 340 -11.56201172 72 -1.0546875 162 -11.1862793 252 -1.074462891 342 -11.12036133 74 -1.549072266 164 -10.79077148 254 -1.502929687 344 -10.81713867 76 -1.641357422 166 -9.861328125 256 -1.628173828 346 -9.834960938 78 -1.977539063 168 -8.971435547 258 -1.984130859 348 -8.978027344 80 -1.944580078 170 -7.929931641 260 -1.957763672 350 -7.883789063 82 -1.766601563 172 -6.512695313 262 -1.713867188 352 -6.473144531 84 -1.753417969 174 -5.510742187 264 -1.694091797 354 -5.444824219 86 -1.0546875 176 -3.697998047 266 -1.034912109 356 -3.684814453 88 -0.250488281 178 -1.680908203 268 -0.283447266 358 -1.654541016 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 27 Table VI. Anomaly 2, Correction Factor (minutes) for device type 02 - Continued. Angle 0 Correction Factor Angle Correction Factor Angle Correction Factor Angle Correction Factor 0.2037804 90 0.388944 180 0.1926492 270 0.1494676 2 1.2011235 92 0.4250145 182 1.3023937 272 0.4663943 4 2.7046554 94 1.0290481 184 2.6543247 274 1.0246463 6 3.7896351 96 1.0549836 186 3.5417379 276 1.1382954 8 4.4210134 98 0.985566 188 4.4124454 278 1.1587672 10 5.2155666 100 1.3049934 190 5.203492 280 1.0999234 12 5.8344789 102 0.9052019 192 5.8037239 282 0.6942761 14 6.3655715 104 0.6187665 194 6.3895613 284 0.6348358 16 6.9555728 106 0.3392372 196 6.9176556 286 0.4454498 18 7.2150137 108 -0.175559 198 7.1084421 288 -0.177215 20 7.668033 110 -0.406551 200 7.7189463 290 -0.454718 22 8.0207217 112 -0.999534 202 8.0275228 292 -0.889493 24 7.9337942 114 -1.499164 204 7.8880027 294 -1.403421 26 8.2323065 116 -1.844624 206 8.1449399 296 -1.843685 28 8.1783179 118 -2.397679 208 8.1387855 298 -2.293495 30 8.0459945 120 -2.881544 210 8.08097 300 -3.028745 32 8.3625996 122 -3.236345 212 8.2928404 302 -3.32441 34 8.1656155 124 -3.826773 214 8.137597 304 -3.956229 36 7.8536486 126 -4.4022 216 7.8531124 306 -4.509103 38 7.8015315 128 -4.68487 218 7.7737084 308 -4.688704 40 7.3359658 130 -5.328598 220 7.2755348 310 -5.187046 42 7.2219005 132 -5.670543 222 7.2015871 312 -5.509263 44 7.0820345 134 -5.974115 224 7.0049554 314 -5.88838 46 6.4602993 136 -6.658819 226 6.3980315 316 -6.480666 48 6.093604 138 -6.661897 228 6.0267529 318 -6.814285 50 5.6270972 140 -7.094022 230 5.5584493 320 -6.980524 52 5.2254441 142 -7.603145 232 5.1655597 322 -7.525344 54 4.7990496 144 -7.436118 234 4.7743379 324 -7.475306 56 4.3314519 146 -7.735451 236 4.3005015 326 -7.830463 58 3.6928435 148 -7.941762 238 3.677129 328 -7.845085 60 3.4616901 150 -7.955999 240 3.3761744 330 -7.737209 62 2.9175922 152 -8.046982 242 2.842719 332 -7.950106 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 28 Table VI. Anomaly 2, Correction Factor (minutes) for device type 02 - Continued. Angle Correction Factor 64 Angle Correction Factor Angle Correction Factor Angle Correction Factor 2.3965424 154 -7.808906 244 2.3611981 334 -8.023122 66 2.2065613 156 -7.518633 246 2.219188 336 -7.690546 68 1.5534788 158 -7.694355 248 1.3174688 338 -7.719087 70 1.0493304 160 -7.452276 250 1.0260607 340 -7.438014 72 0.5976757 162 -6.973083 252 0.5846875 342 -6.895998 74 0.206093 164 -6.728264 254 0.2573653 344 -6.759761 76 0.0199815 166 -6.19136 256 0.0243755 346 -6.141721 78 -0.21906 168 -5.698378 258 -0.199283 348 -5.697088 80 -0.54652 170 -5.196078 260 -0.576188 350 -5.132956 82 -0.576408 172 -4.228528 262 -0.53484 352 -4.203093 84 -0.61473 174 -3.402853 264 -0.531974 354 -3.33512 86 -0.399631 176 -2.508138 266 -0.387925 356 -2.453571 88 0.1805842 178 -1.065913 268 0.1435904 358 -1.041203 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 29 Table VI. Anomaly 2, Correction Factor (minutes) for device type 03 - Continued. Angle Correction Factor Angle Correction Factor Angle Correction Factor Angle Correction Factor 0 0.02039 90 0.55724 180 0.01869 270 0.53516 2 2.01363 92 2.25318 182 2.04761 272 2.24299 4 3.86417 94 3.86757 184 3.92363 274 3.86417 6 5.64675 96 5.34264 186 5.67903 276 5.35623 8 5.95127 98 5.37024 188 5.96316 278 5.41101 10 6.09779 100 5.31119 190 6.14026 280 5.36046 12 6.32756 102 4.96163 192 6.05064 282 4.98202 14 5.61783 104 4.28418 194 5.64161 284 4.33175 16 5.10687 106 3.54386 196 5.11196 286 3.57275 18 4.91700 108 3.06688 198 4.92380 288 3.09577 20 5.08052 110 3.00444 200 5.09411 290 3.02653 22 5.37484 112 2.93690 202 5.36805 292 2.98107 24 5.85605 114 2.82179 204 5.53326 294 2.86426 26 5.76133 116 2.78992 206 5.75114 296 2.84089 28 6.31389 118 2.75806 208 5.98940 298 2.83621 30 5.40878 120 2.01095 210 5.40029 300 2.07551 32 4.77720 122 1.09225 212 4.76871 302 1.18060 34 4.06068 124 0.22282 214 4.06237 304 0.31796 36 3.46307 126 -0.47841 216 3.47157 306 -0.38497 38 2.81110 128 -1.18305 218 2.82130 308 -1.06413 40 2.33922 130 -1.69741 220 2.34602 310 -1.58528 42 2.45856 132 -1.73267 222 2.48064 312 -1.58996 44 2.46747 134 -1.81210 224 2.47936 314 -1.67959 46 2.35406 136 -1.95779 226 2.38124 316 -1.83547 48 2.30011 138 -1.98626 228 2.30520 318 -1.86054 50 2.33280 140 -1.87711 230 2.32601 320 -1.75479 52 1.84903 142 -2.40166 232 1.83713 322 -2.29293 54 1.18856 144 -3.07912 234 1.17157 324 -2.97718 56 0.52300 146 -4.01311 236 0.49752 326 -3.61556 58 -0.33114 148 -4.43062 238 -0.34473 328 -4.32699 60 -1.21076 150 -5.13696 240 -1.22435 330 -5.04352 -1.92219 152 -5.72437 242 -1.94088 332 -5.62413 62 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 30 Table VI. Anomaly 2, Correction Factor (minutes) for device type 03 - Continued. Angle Correction Factor Angle Correction Factor Angle Correction Factor Angle Correction Factor 64 -1.89799 154 -5.51329 244 -1.92687 334 -5.40795 66 -1.87039 156 -5.30390 246 -1.89418 336 -5.20707 68 -1.94813 158 -5.13530 248 -1.97361 338 -5.06734 70 -2.01057 160 -4.91062 250 -2.02926 340 -4.86136 72 -2.05603 162 -4.76070 252 -2.07132 342 -4.70974 74 -2.50413 164 -4.99474 254 -2.52961 344 -4.92339 76 -3.23255 166 -5.51759 256 -3.26992 346 -5.45983 78 -3.90830 168 -5.92152 258 -3.94058 348 -5.90113 80 -4.26466 170 -6.03663 260 -4.29014 350 -6.02644 82 -4.31011 172 -5.87312 262 -4.32540 352 -5.86972 84 -4.22645 174 -5.57369 264 -4.25703 354 -5.57199 86 -2.72929 176 -3.78432 266 -2.75308 356 -3.78602 -1.10131 178 -1.88282 268 -1.11321 358 -1.89811 88 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-04235 A REVISION LEVEL D SHEET 31 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 12-12-17 Approved sources of supply for SMD 5962-04235 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-0423501KXA 5962-0423501KXC 3/ 3/ ACT5028-201-2S ACT5028-201-1S 5962-0423502KXA 5962-0423502KXC 3/ 3/ ACT5028-202-2S ACT5028-202-1S 5962-0423503KXA 5962H0423503KXA 5962-0423503KXC 5962H0423503KXC 88379 88379 88379 88379 RDC5028-301-2S RDC5028-931-2S RDC5028-301-1S RDC5028-931-1S 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source. Vendor CAGE number 88379 Vendor name and address Aeroflex Plainview Incorporated, (Aeroflex Microelectronic Solutions) 35 South Service Road Plainview, NY 11803-4193 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.