REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET 15 16 17 18 19 20 REV STATUS OF SHEETS REV PMIC N/A PREPARED BY Steve L. Duncan STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A SHEET 1 2 3 4 5 DRAWING APPROVAL DATE 15-05-20 REVISION LEVEL 7 9 10 11 12 13 http://www.landandmaritime.dla.mil/ MICROCIRCUIT, HYBRID, CMOS, LINEAR, ANALOG MULTIPLEXER, 64 CHANNEL, +3.3 TO +5 VOLT SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 8 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 CHECKED BY Greg Cecil APPROVED BY Charles F. Saffle 6 5962-11240 1 OF 20 5962-E215-15 14 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 H Federal stock class designator \ RHA designator (see 1.2.1) 11240 01 K X C Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 RHD8540 02 RHD8541 Circuit function 64 channel analog multiplexer, 32 channels voltage, 32 channels voltage and current 64 channel analog multiplexer 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator X See figure 1 Terminals Package style 96 Ceramic quad flat pack 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) .................................................................. Digital input overvoltage range (VEN ,VA) .................................... Analog input overvoltage range ................................................. Power dissipatation (PD): Device type 01........................................................................ Device type 02........................................................................ Thermal resistance junction-to-case (θJC) .................................. Storage temperature .................................................................. Lead temperature (soldering, 10 seconds) ................................ +7.0 V dc (< VCC + .4)V, (> GND - .4)V (< VCC + .4)V, (> GND - .4)V 33.6 mW 22.4 mW 10°C/W -65°C to +150°C +300°C 1.4 Recommended operating conditions. Supply voltage range (VCC) ....................................................... Maximum logic low level input voltage ...................................... Minimum logic high level input voltage ..................................... Case operating temperature range (TC)..................................... +3.0 V to +5.5 V dc .3 VCC .7 VCC -55°C to +125°C 1.5 Radiation features. 2/ Maximum Total Ionizing Dose (TID) ..(dose rate = 50 - 300 rad(Si)/s): In accordance with MIL-STD-883, method 1019, condition A. Enhanced Low Dose Rate Sensitivity (ELDRS) ......................... Single Event Latchup (SEL) ....................................................... 14 2 Neutron Displacement Damage (> 1 x 10 neutrons/cm ) ........ 1 Mrad(Si) 3/ 2 > 100 MeV-cm /mg 4/ 3/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ See section 4.3.5 for the manufacturer's radiation hardness assurance analysis and testing. 3/ Not tested, Immune by 100 percent CMOS technology. 4/ Single Event Latchup (SEL) immunity is accomplished by double, fully enclosing, guard rings in the CMOS design layout. The guard rings eliminate the parasitic pnpn structure that is responsible for latchup in CMOS circuits. This limit is guaranteed by design or process, but not tested. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 3 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3. 3.2.4 Switching test waveform(s). The switching test waveform(s) shall be as specified on figure 4. 3.2.5 Block diagram. The block diagram(s) shall be as specified on figure 5. 3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Supply currents 1/ +ICC +ISBY Address input 1/ currents IAL (A0-A3) Group A subgroups Conditions -55°C ≤ TC ≤ +125°C VCC = +5 V unless otherwise specified VEN = .3 VCC 1,2,3 VEN = .7 VCC 1,2,3 1 2 1 VA = .3 VCC 2 1 2 1 2 1 2 1 2 VA = .7 VCC IAH (B0-B3) Enable input 1/ currents ����) (EN IENL ���� EN(0-15) ����(16-31) EN IENL ���� EN(32-47) ���� EN(48-63) IENH ���� EN(0-15) ���� EN(16-31) 1 VA = .3 VCC 1 2 1 2 1 VA = .7 VCC IINLK5 IINLK0 1 VIN = +5 V, VEN = .7 VCC, output and all unused MUX inputs under test = 0 V 02 3.2 01 1.2 mA 800 20 200 10 µA -20 -200 -10 -100 -10 -100 100 10 100 -20 -200 -10 -100 -10 -100 20 200 10 100 10 100 -5 5 -50 50 -10 10 -100 -5 -50 -5 100 5 50 5 -50 50 -10 -100 -5 -50 10 100 5 50 -5 5 -50 50 -5 5 -50 50 02 01 02 01,02 01 02 01,02 01,02 01 02 01,02 01 02 01,02 2 1 VIN = 0 V, VEN = .7 VCC, output and all unused MUX inputs under test = +5 V Max 4.8 2 1 2 1 2 Unit 01 2 IENH ����(32-47) EN ����(48-63) EN Input leakage current (CH0-CH15) 1/ Limits Min IAL (B0-B3) IAH (A0-A3) Device types 01,02 2 mA nA nA nA nA nA nA nA nA nA nA nA nA nA nA See footnote at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Output leakge current (VOUT) 1/ IOUTLK Switch ON 1/ resistance RDSON Conditions -55°C ≤ TC ≤ +125°C VCC = +5 V unless otherwise specified Group A subgroups 1 VOUT = +5 V, VEN = .7 VCC, All inputs grounded except channel being tested 1 2 3 1 2 3 1 2 3 VIN = 0 V, VEN = .3 VCC, IOUT = +1 mA VIN = +5 V, VEN = .3 VCC, IOUT = -1 mA tAHL 01,02 2 VIN = +2.5 V, VEN = .3 VCC, IOUT = -0.6 mA Address to output delay Device types 01,02 10 tALH 9,11 RL = 10 kΩ, CL = 50 pF, See figure 4 01,02 10 Enable to output delay tONEN 9,11 RL = 1 kΩ, CL = 50 pF, See figure 4 01,02 10 tOFFEN 1/ 9,10,11 RL = 1 kΩ, CL = 50 pF, See figure 4 01,02 Unit Min Max -5 5 -50 50 nA 750 1000 500 750 1000 500 750 1000 500 01,02 9,11 RL = 10 kΩ, CL = 50 pF, See figure 4 Limits 10 150 10 200 10 150 10 200 10 150 10 200 10 200 Ω ns ns ns ns These devices have been tested to (1 Mrad(Si)) to Method 1019, condition A of MIL-STD-883 at +25°C for these parameters to assure the requirements of RHA designator level "H” (1Mrad(Si)) are met. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 6 FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 7 Case outline X - Continued. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 8 Case outline X - Continued. Inches Symbol Min Millimeters Max Min Max A .200 5.08 A1 .180 4.57 A2 .005 .011 0.13 0.28 b .0135 .0195 0.34 0.50 c .005 .008 0.13 0.20 D/E 1.287 1.313 32.69 33.35 D1 1.145 1.155 29.08 29.34 e .050 BSC 1.27 BSC F .200 TYP 5.08 TYP J .035 TYP 0.89 TYP L 2.490 2.510 L1 63.25 63.75 2.580 65.53 L2 1.700 1.740 43.18 44.20 L3 2.090 2.110 53.09 53.59 L4 .400 TYP 10.16 TYP N 96 96 S1 .030 TYP 0.76 TYP S2 .015 TYP 0.38 TYP NOTES: 1. Pin 1 is indicated by an ESD triangle on top of the package and by an index on the bottom of the package. 2. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 3. N equals 96, the total number of leads on the package. 4. Pin numbers are for reference only. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 9 Device type 01 Case outline Terminal number Terminal symbol Terminal number 1 A2 33 2 B2 3 A3 4 X Terminal symbol Terminal number Terminal symbol CH11 65 CH49 34 CH27 66 CH48 35 CH12 67 OUTPUT I(48-63) B3 36 CH28 68 OUTPUT V(48-63) 5 EN(0-15) 37 CH13 69 OUTPUT I(32-47) 6 EN(16-31) 38 CH29 70 OUTPUT V(32-47) 7 CH0 39 CH14 71 GND 8 CH16 40 CH30 72 GND 9 CH1 41 CH15 73 CH47 10 CH17 42 CH31 74 CH46 11 CH2 43 NC 75 CH45 12 CH18 44 VCC 76 CH44 13 CH3 45 NC 77 CH43 14 CH19 46 NC 78 CH42 15 CH4 47 NC 79 CH41 16 CH20 48 NC 80 CH40 17 CH5 49 NC 81 CH39 18 CH21 50 Case GND 82 CH38 19 CH6 51 CH63 83 CH37 20 CH22 52 CH62 84 CH36 21 CH7 53 CH61 85 CH35 22 CH23 54 CH60 86 CH34 23 GND 55 CH59 87 CH33 24 GND 56 CH58 88 CH32 25 OUTPUT V(0-15) 57 CH57 89 GND 26 OUTPUT V(16-31) 58 CH56 90 GND 27 CH8 59 CH55 91 EN(48-63) 28 29 CH24 CH9 60 61 CH54 CH53 92 93 EN(32-47) A0 30 31 CH25 CH10 62 63 CH52 CH51 94 95 B0 A1 32 CH26 64 CH50 96 B1 NOTE: NC is a no connect pin. NC pins should be grounded to eliminate or minimize electrostatic discharge (ESD) or static buildup. FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 10 Device type 02 Case outline Terminal number Terminal symbol Terminal number 1 A2 33 2 B2 3 A3 4 X Terminal symbol Terminal number Terminal symbol CH11 65 CH49 34 CH27 66 CH48 35 CH12 67 NC B3 36 CH28 68 OUTPUT V(48-63) 5 EN(0-15) 37 CH13 69 NC 6 EN(16-31) 38 CH29 70 OUTPUT V(32-47) 7 CH0 39 CH14 71 GND 8 CH16 40 CH30 72 GND 9 CH1 41 CH15 73 CH47 10 CH17 42 CH31 74 CH46 11 CH2 43 NC 75 CH45 12 CH18 44 VCC 76 CH44 13 CH3 45 NC 77 CH43 14 CH19 46 NC 78 CH42 15 CH4 47 NC 79 CH41 16 CH20 48 NC 80 CH40 17 CH5 49 NC 81 CH39 18 CH21 50 Case GND 82 CH38 19 CH6 51 CH63 83 CH37 20 CH22 52 CH62 84 CH36 21 CH7 53 CH61 85 CH35 22 CH23 54 CH60 86 CH34 23 GND 55 CH59 87 CH33 24 GND 56 CH58 88 CH32 25 OUTPUT V(0-15) 57 CH57 89 GND 26 OUTPUT V(16-31) 58 CH56 90 GND 27 28 CH8 59 CH55 91 EN(48-63) 29 CH24 CH9 60 61 CH54 CH53 92 93 EN(32-47) A0 30 31 CH25 CH10 62 63 CH52 CH51 94 95 B0 A1 32 CH26 64 CH50 96 B1 NOTE: NC is a no connect pin. NC pins should be grounded to eliminate or minimize electrostatic discharge (ESD) or static buildup. FIGURE 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 11 Truth table (CH0-CH15) and (CH16-CH31) B3 X L L L L L L L L H H H H H H H H 1/ 2/ B2 X L L L L H H H H L L L L H H H H B1 X L L H H L L H H L L H H L L H H B0 X L H L H L H L H L H L H L H L H EN(0-15) H L L L L L L L L L L L L L L L L "ON" Channel 1/ None CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 CH12 CH13 CH14 CH15 EN(16-31) H L L L L L L L L L L L L L L L L "ON" Channel 2/ None CH16 CH17 CH18 CH19 CH20 CH21 CH22 CH23 CH24 CH25 CH26 CH27 CH28 CH29 CH30 CH31 Between (CH0-CH15) and OUTPUT(0-15). Between (CH16-CH31) and OUTPUT(16-31). Truth table (CH32-CH47) and (CH48-CH63) 1/ 2/ A3 A2 A1 A0 EN(32-47) "ON" Channel 1/ EN(48-63) "ON" Channel 2/ X L L L L L L L L H H H H H H H H X L L L L H H H H L L L L H H H H X L L H H L L H H L L H H L L H H X L H L H L H L H L H L H L H L H H L L L L L L L L L L L L L L L L None CH32 CH33 CH34 CH35 CH36 CH37 CH38 CH39 CH40 CH41 CH42 CH43 CH44 CH45 CH46 CH47 H L L L L L L L L L L L L L L L L None CH48 CH49 CH50 CH51 CH52 CH53 CH54 CH55 CH56 CH57 CH58 CH59 CH60 CH61 CH62 CH63 Between (CH32-CH47) and OUTPUT(32-47) and CURRENT(32-47). Between (CH48-CH63) and OUTPUT(48-63) and CURRENT(48-63). FIGURE 3. Truth table(s). (Device type 01) STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 12 Truth table (CH0-CH15) and (CH16-CH31) B3 X L L L L L L L L H H H H H H H H 1/ 2/ B2 X L L L L H H H H L L L L H H H H B1 X L L H H L L H H L L H H L L H H B0 X L H L H L H L H L H L H L H L H EN(0-15) H L L L L L L L L L L L L L L L L "ON" Channel 1/ None CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11 CH12 CH13 CH14 CH15 EN(16-31) H L L L L L L L L L L L L L L L L "ON" Channel 2/ None CH16 CH17 CH18 CH19 CH20 CH21 CH22 CH23 CH24 CH25 CH26 CH27 CH28 CH29 CH30 CH31 Between (CH0-CH15) and OUTPUT(0-15). Between (CH16-CH31) and OUTPUT(16-31). Truth table (CH32-CH47) and (CH48-CH63) 1/ 2/ A3 A2 A1 A0 EN(32-47) "ON" Channel 1/ EN(48-63) "ON" Channel 2/ X L L L L L L L L H H H H H H H H X L L L L H H H H L L L L H H H H X L L H H L L H H L L H H L L H H X L H L H L H L H L H L H L H L H H L L L L L L L L L L L L L L L L None CH32 CH33 CH34 CH35 CH36 CH37 CH38 CH39 CH40 CH41 CH42 CH43 CH44 CH45 CH46 CH47 H L L L L L L L L L L L L L L L L None CH48 CH49 CH50 CH51 CH52 CH53 CH54 CH55 CH56 CH57 CH58 CH59 CH60 CH61 CH62 CH63 Between (CH32-CH47) and OUTPUT(32-47). Between (CH48-CH63) and OUTPUT(48-63). FIGURE 3. Truth table(s). (Device type 02) STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 13 FIGURE 4. Switching test waveform(s). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 14 FIGURE 5. Block diagram. (Device Type 01) STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 15 FIGURE 5. Block diagram - Continued. (Device Type 02) STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 16 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1,9 Final electrical parameters 1*,2,3,9,10,11 Group A test requirements 1,2,3,9,10,11 Group C end-point electrical parameters 1,2,3,9,10,11 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices 1 * PDA applies to subgroup 1. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 17 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as specified herein. See table IIIA and table IIIB. Table IIIA. Radiation Hardness Assurance Method Table. RHA method employed Total Dose Testing RHA level "H" (1 Mrad) Worst Case Analysis Performed Element level Hybrid device level Tested at (1 Mrad) Tested at (1 Mrad) (See 4.3.5.1.1) End point electricals after total dose Includes Combines Combines total End-of-life Element level Hybrid device temperature temperature dose and level effects and radiation displacement effects effects No No No No TC = +25°C TC = +25°C Table IIIB. Hybrid level and element level test table. Total Dose Low Dose Rate High Dose Rate (LDR) (HDR) CMOS IC G Tested (1 Mrad) (See 4.3.5.1.1) ELDRS G Radiation Test Heavy Ion SET SEL (transient) (latch-up) Not Tested G 100 MeV2 cm /mg Proton Neutron Low High SEE Displacement Energy Energy (upset) Damage (DD) Not Not Not Tested Tested Tested G NOTE: G = Guaranteed by design or process STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 18 4.3.5.1 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime -VQ) approved plan and with MIL-PRF-38534, Appendix G. a. The hybrid device manufacturer shall establish procedures controlling component radiation testing, and shall establish radiation test plans used to implement component lot qualification during procurement. Test plans and test reports shall be filed and controlled in accordance with the manufacturer's configuration management system. b. The hybrid device manufacturer shall designate a RHA program manager to oversee component lot qualification, and to monitor design changes for continued compliance to RHA requirements. 4.3.5.1.1 Hybrid level RHA qualification. Hybrid level and element level testing are the same for the devices on this Standard Microcircuit Drawing (SMD) since the active element is accessible to the device leads for test. 4.3.5.1.1.1 Qualification by similarity. The devices on this SMD contain multiple of a common active element (that are accessible to the package leads for test), therefore the device types on this SMD are considered similar for the purpose of RHA qualification. The part number 5962H1024301KXC was RHA tested, therefore the device types 01 and 02 on this SMD are considered qualified by similarity. The package used for (5962H1024301KXC) is the same package construction and material as this drawing except for size and pin count. Internal Gas Analysis data demonstrates that the hydrogen level between the two packages is negligible. 4.3.5.1.2 Element level qualification. 4.3.5.1.2.1 Total ionizing dose irradiation testing. A minimum of 5 biased devices of the active element used will be tested every wafer lot. These active elements will be tested at HDR in accordance with condition A of method 1019 of MIL-STD-883 to 1 Mrad(Si) for the device parameters as specified in table I herein. 4.3.5.1.2.1.1 Accelerated annealing test. Accelerated annealing tests shall be performed on all devices requiring a RHA level greater than 5k rads (Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the pre-irradiation end-point electrical parameter limit at 25°C ±5°C. Testing shall be performed at initial qualification and after any design or process changes which may affect the RHA response of the device. 4.3.5.2. Total Ionizing Dose (TID). See paragraph 4.3.5.1.2.1 and 4.3.5.1.2.1.1 herein. 4.3.5.2.1 Radiation Lot Acceptance Testing (RLAT). Every wafer diffusion lot of integrated circuits used in this hybrid microcircuit device will be Radiation Lot Acceptance Testing (RLAT) tested at HDR in accordance with condition A (dose rate of 50 - 300 rad(Si)/s) of method 1019 of MIL-STD-883. A minimum of 5 samples under worst case biased conditions will be tested. 0.9000/90% statistics are applied to the device parameters as specified in table I herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 19 6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-11240 A REVISION LEVEL SHEET 20 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 15-05-20 Approved sources of supply for SMD 5962-11240 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE Vendor similar PIN 2/ 5962-1124001KXC 5962H1124001KXC 88379 88379 RHD8540-201-1S RHD8540-901-1S 5962-1124002KXC 5962H1124002KXC 88379 88379 RHD8541-201-1S RHD8541-901-1S 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number Vendor name and address 88379 Aeroflex Plainview Incorporated, (Aeroflex Microelectronic Solutions) 35 South Service Road Plainview, NY 11803 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.