V6210611 VID

REVISIONS
LTR
DESCRIPTION
A
Add paragraph 1.5, Thermal characteristics.
Update document paragraphs to current
requirements. - ro
DATE
APPROVED
16-02-09
C. SAFFLE
CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24
Vendor item drawing
REV
PAGE
REV
PAGE
REV STATUS
OF PAGES
REV
A
A
A
A
A
A
A
A
A
A
A
A
PAGE
1
2
3
4
5
6
7
8
9
10
11
12
PMIC N/A
PREPARED BY
RICK OFFICER
Original date of drawing
YY-MM-DD
CHECKED BY
RAJESH PITHADIA
10-06-22
TITLE
MICROCIRCUIT, LINEAR, 3.0 AMP LOW DROP
OUT VOLTAGE REGULATOR WITH
PROGRAMMABLE SOFT START, MONOLITHIC
SILICON
APPROVED BY
CHARLES F. SAFFLE
SIZE
A
REV
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
CODE IDENT. NO.
DWG NO.
V62/10611
16236
A
PAGE
1
OF
12
5962-V037-16
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a 3.0 amp low drop out voltage regulator with programmable soft
start microcircuit, with an operating temperature range of -55C to +125C.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/10611
-
Drawing
number
01
X
E
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Device type
Generic
01
TPS74401-EP
Circuit function
3.0 amp low drop out voltage regulator with
programmable soft start
1.2.2 Case outline(s). The case outline(s) are as specified herein.
Outline letter
Number of pins
X
20
JEDEC PUB 95
Package style
MO-220
Plastic quad flat pack
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture:
Finish designator
A
B
C
D
E
Z
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
2
1.3 Absolute maximum ratings.
1/ 2/
Input voltage range (VIN, VBIAS) ................................................................................ -0.3 V to +6 V
Enable voltage range (VEN) ....................................................................................... -0.3 V to +6 V
Power good (PG) voltage range (VPG) ...................................................................... -0.3 V to +6 V
PG sink current (IPG) ................................................................................................. 0 mA to +1.5 mA
Soft start (SS) pin voltage range (VSS) ...................................................................... -0.3 V to +6 V
Feedback (FB) pin voltage range (VFB) ..................................................................... -0.3 V to +6 V
Output voltage range (VOUT) ..................................................................................... -0.3 V to VIN + 0.3 V
Power dissipation (PD) ............................................................................................... 3/
Maximum output current (IOUT) ................................................................................. Internally limited
Output short circuit duration ....................................................................................... Indefinite
Storage junction temperature range (TSTG) ............................................................... -65C to +150C
Operating junction temperature range (TJ) ................................................................ -55C to +125C
1.4 Recommended operating conditions. 4/
Operating junction temperature range (TJ) ................................................................ -55C to +125C
1.5 Thermal characteristics.
Thermal metric 5/ 6/
Symbol
Case X
Unit
JA
36.3
C/W
JC(TOP)
34.3
C/W
Thermal resistance, junction-to-board
JB
10.8
C/W
Characterization parameter, junction-to-top
JT
0.3
C/W
Characterization parameter, junction-to-board
JB
11.9
C/W
Thermal resistance, junction-to-case (bottom)
JC(BOTTOM)
2.4
C/W
Thermal resistance, junction-to-ambient
Thermal resistance, junction-to-case (top)
1/
2/
3/
4/
5/
6/
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
All voltages are respect to GND.
Depending on input voltage and load conditions, power dissipation can be calculated by PD = ( VIN - VOUT ) x IOUT.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.
For information about traditional and new thermal metrics, contact the manufacturer.
For thermal estimates of this device based on printed circuit board (PCB) copper area, contact the manufacturer.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
3
2. APPLICABLE DOCUMENTS
JEDEC Solid State Technology Association
JEDEC PUB 95 –
Registered and Standard Outlines for Semiconductor Devices
(Copies of these documents are available online at http:/www.jedec.org or from JEDEC – Solid State Technology Association,
3103 North 10th Street, Suite 240–S, Arlington, VA 22201-2107).
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
4
TABLE I. Electrical performance characteristics. 1/
Test
Symbol
Input voltage range
Conditions 2/
Temperature,
TJ
Device
type
01
-55C to +125C
VIN
Limits
Unit
Min
Max
VOUT
5.5
V
+ VDO
Bias pin voltage range
VBIAS
-55C to +125C
01
2.375
5.25
V
Internal reference
(adjustment)
VREF
-55C to +125C
01
0.792
0.808
V
Output voltage range
VOUT
-55C to +125C
01
VREF
3.6
V
-55C to +125C
01
-1
+1
%
-55C to +125C
01
0.05
%/V
+25C
01
VIN = 5 V, IOUT = 1.5 A,
VBIAS = 5 V
Accuracy 3/
VOUT
2.97 V  VBIAS  5.25 V,
50 mA  IOUT  3.0 A
Line regulation
VOUT /
VOUT(NOM) + 0.3  VIN  5.5 V
VIN
Load regulation
VOUT /
IOUT
VIN dropout voltage 4/
VDO
0 mA  IOUT  50 mA
50 mA  IOUT  3.0 A
IOUT = 3.0 A,
0.013 typical
%/mA
0.03 typical
%/A
-55C to +125C
01
195
mV
1.62
V
6.0
A
VBIAS - VOUT(NOM)  1.62 V
VDO
IOUT = 3.0 A, VIN = VBIAS
-55C to +125C
01
Current limit
ICL
VOUT = 80% x VOUT(NOM)
-55C to +125C
01
Bias pin current
IBIAS
IOUT = 0 mA to 3.0 A
-55C to +125C
01
4
mA
Shutdown supply
current (VIN)
ISHDN
VEN  0.4 V
-55C to +125C
01
1
A
IFB
IOUT = 50 mA to 3.0 A
-55C to +125C
01
250
nA
PSRR
1 kHz, IOUT = 1.5 A, VIN = 1.8 V,
+25C
01
VBIAS dropout
voltage
Feedback pin
current
4/
5/
Power supply rejection
ratio
(VIN to VOUT)
3.7
-250
73 typical
dB
VOUT = 1.5 V
42 typical
800 kHz, IOUT = 1.5 A, VIN = 1.8 V,
VOUT = 1.5 V
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
5
TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TJ
Device
type
Limits
Min
Power supply rejection
ratio
(VBIAS to VOUT)
PSRR
1 kHz, IOUT = 1.5 A, VIN = 1.8 V,
01
+25C
Unit
Max
62 typical
dB
VOUT = 1.5 V
50 typical
800 kHz, IOUT = 1.5 A, VIN = 1.8 V,
VOUT = 1.5 V
Output noise voltage
Noise
100 Hz to 100 kHz, IOUT = 1.5 A,
+25C
01
16 x VOUT
typical
VRMS
+25C
01
4 typical
%VOUT
+25C
01
100 typical
s
-55C to +125C
01
0.5
1
A
CSS = 0.001 F
%VOUT droop during
load transient
VTRAN
IOUT = 100 mA to 3.0 A at 1 A/s,
Minimum startup time
tSTR
IOUT = 1.5 A, CSS = open
Soft-start charging
current
ISS
VSS = 0.4 V
Enable input high level
VEN, hi
-55C to +125C
01
1.1
5.5
V
Enable input low level
VEN, lo
-55C to +125C
01
0
0.4
V
Enable pin hysteresis
VEN,
hys
+25C
01
50 typical
mV
Enable pin deglitch
time
VEN, dg
+25C
01
20 typical
s
Enable pin current
IEN
VEN = 5 V
-55C to +125C
01
Power good (PG) trip
threshold
VIT
VOUT decreasing
-55C to +125C
01
PG trip hysteresis
VHYS
+25C
01
PG output low voltage
VPG, lo
IPG = 1 mA (sinking), VOUT  VIT
-55C to +125C
01
0.3
V
PG leakage current
IPG, lkg
VPG = 5.25 V, VOUT  VIT
-55C to +125C
01
1
A
COUT = 0 F
86
1
A
93.5
%/VOUT
3 typical
%/VOUT
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
6
TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Operating junction
temperature
TJ
Thermal shutdown
temperature
TSD
Conditions 2/
Temperature,
TA
Shutdown, temperature increasing
Device
type
+25C
Limits
Unit
Min
Max
01
-55
+125
01
+155 typical
Reset, temperature decreasing
C
C
+140 typical
1/
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over
the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters
may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization
and/or design.
2/
Unless otherwise specified, VEN = 1.1 V, VIN = VOUT + 0.3 V, CIN = CBIAS = 0.1 F, COUT = 10 F, IOUT = 50 mA,
and VBIAS = 5.0 V.
3/
Adjustable devices tested at 0.8 V; external resistor tolerance is not taken into account.
4/
Dropout is defined as the voltage from the input to VOUT when VOUT is 2% below nominal.
5/
IFB current flow is out of the device.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
7
Case X
FIGURE 1. Case outline.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
8
Case X - continued.
Dimensions
Inches
Symbol
Millimeters
Min
Max
Min
Max
A
0.031
0.039
0.80
1.00
A1
0.00
0.001
0.00
0.05
A2
0.007 REF
0.20 REF
b
0.009
0.014
0.23
0.38
D
0.190
0.202
4.85
5.15
E
0.190
0.202
4.85
5.15
e
0.025 BSC
0.65 BSC
e1
0.102 BSC
2.60 BSC
L
0.017
0.025
0.45
0.65
NOTES:
1. Controlling dimensions are millimeter, inch dimensions are given for reference only.
2. The package thermal pad must be soldered to the board for thermal and mechanical performance.
3. Falls within reference to JEDEC MO-220.
FIGURE 1. Case outline - Continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
9
Device type
01
Case outline
X
Terminal number
Terminal
symbol
1
OUT
2
NC
3
NC
4
NC
5
IN
6
IN
7
IN
8
IN
9
PG
10
BIAS
11
EN
12
GND
13
NC
14
NC
15
SS
16
FB / SNS
17
NC
18
OUT
19
OUT
20
OUT
FIGURE 2. Terminal connections.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
10
Terminal symbol
Description
IN
Unregulated input to the device.
EN
Enable pin. Driving this pin high enables the regulator. Driving this
pin low puts the regulator into shutdown mode. This pin must not be
left floating.
SS
Soft start pin. A capacitor connected on this pin to ground sets the
start up time. If this pin is left floating, the regulator output soft start
ramp time is typically 100 s.
BIAS
Bias input voltage for error amplifier, reference, and internal control
circuits.
PG
Power good (PG) is an open drain, active high output that indicates
the status of VOUT. When VOUT exceeds the PG trip threshold, the
PG pin goes into a high impedance state. When VOUT is below this
threshold, the pin is driven to a low impedance state. A pull up
resistor from 10 k to 1 M should be connected from this pin to a
supply up to 5.5 V. The supply can be higher than the input voltage.
Alternatively, the PG pin can be left floating if output monitoring is not
necessary.
FB
OUT
NC
GND
PAD / TAB
This pin is the feedback connection to the center tap of an external
resistor divider network that sets the output voltage. This pin must
not be left floating.
Regulated output voltage. No capacitor is required on this pin for
stability.
No connection. This pin can be left floating or connected to GND to
allow better thermal contact to the top side plane.
Ground.
Should be soldered to the ground plane for increased thermal
performance.
FIGURE 2. Terminal connections - Continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
11
4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all
current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Vendor item drawing
administrative control
number 1/
Device
manufacturer
CAGE code
Packaging 2/ 3/
Top side marking
Vendor part number
V62/10611-01XE
01295
Reel of 3,000
TPS74401EP
TPS74401MRGWREP
1/ The vendor item drawing establishes an administrative control number for identifying the item on the
engineering documentation.
2/
For the most current package and ordering information, see the package option addendum at the
end of the manufacturer’s data sheet or contact the manufacturer.
3/
Package drawings, standard packaging quantities, thermal data, symbolization, and printed
circuit board (PCB) design guidelines are available from the manufacturer.
CAGE code
01295
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Source of supply
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/10611
PAGE
12