V6203644 VID

REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Make clarification to 1.2.2. Add dimension L and
make corrections to the L1 dimensions for both
case outlines as specified under figure 1. - ro
09-02-11
R. HEBER
Prepared in accordance with ASME Y14.24
Vendor item drawing
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PMIC N/A
PREPARED BY
RICK OFFICER
Original date of drawing
YY-MM-DD
CHECKED BY
TOM HESS
03-08-11
TITLE
MICROCIRCUIT, LINEAR, LOW POWER,
VOLTAGE REGULATOR, MONOLITHIC SILICON
APPROVED BY
RAYMOND MONNIN
SIZE
A
REV
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
CODE IDENT. NO.
DWG NO.
V62/03644
16236
A
PAGE
1
OF
14
5962-V026-09
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance low power voltage regulator microcircuit, with
an operating temperature range of -40C to +85C.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/03644
-
Drawing
number
01
X
E
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Device type
Generic
01
02
03
04
Circuit function
TPS79101-EP
TPS79118-EP
TPS79133-EP
TPS79147-EP
Voltage
Low power voltage regulator
Low power voltage regulator
Low power voltage regulator
Low power voltage regulator
1.2 V to 5.5 V
1.8 V
3.3 V
4.7 V
1.2.2 Case outline(s). The case outline(s) are as specified herein.
Outline letter
Number of pins
X
Y
5
6
JEDEC PUB 95
Package style
MO-178-AA
MO-178-AB
Plastic small outline
Plastic small outline
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture:
Finish designator
A
B
C
D
E
Z
DEFENSE SUPPLY CENTER, COLUMBUS
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Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/03644
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2
1.3 Absolute maximum ratings.
1/
Input voltage range .................................................................................................... -0.3 V to 6 V 2/
Voltage range at EN .................................................................................................
Voltage on OUT .........................................................................................................
Peak output current ....................................................................................................
ESD rating, HBM ........................................................................................................
ESD rating, CDM ........................................................................................................
Continuous total power dissipation (PD) .....................................................................
-0.3 V to VI +0.3 V
-0.3 V to 6 V
Internally limited
2 kV
500 V
See dissipation rating table
Operating virtual junction temperature range (TJ) ...................................................... -40C to +150C
Operating free-air temperature range (TA) ................................................................. -40C to +85C
Storage temperature range (TSTG) ............................................................................ -65C to 150C
1.4 Recommended operating conditions. 3/
Input voltage range (VI) .............................................................................................. 2.7 V to 5.5 V 4/
Continuous output current (IO) ................................................................................... 0 mA to 100 mA 5/
Operating junction temperature (TJ) ........................................................................... -40C to +125C
Board
Case
RJC
RJA
outlines
1/
2/
3/
4/
5/
6/
7/
Derating factor
TA  25C
TA = 70C
TA = 85C
above TA = 25C
Power rating
Power rating
Power rating
Low K 6/
X, Y
63.75C/W
256C/W
3.906 mW/C
391 mW
215 mW
156 mW
High K 7/
X, Y
63.75C/W
178.3C/W
5.609 mW/C
561 mW
308 mW
224 mW
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
All voltage values are with respect to network terminal ground.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.
To calculate the minimum input voltage for your maximum output current, use the following formula:
VI(min) = VO(max) + VDO (max load).
Continuous output current and operating junction temperature are limited by internal protection circuitry, but it is not
recommended that the device operate under conditions beyond those specified in this table extended periods of time.
The JEDEC low K (1s) board design used to derive this data was a 3-inch x 3-inch, two layer board with 2 ounce copper traces
on top of the board.
The JEDEC high K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multi-layer board with 1 ounce internal
power and ground planes and 2 ounce copper traces on top and bottom of the board.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
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A
16236
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REV
A
PAGE
3
2. APPLICABLE DOCUMENTS
JEDEC PUB 95
–
Registered and Standard Outlines for Semiconductor Devices
(Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington,
VA 22201-3834 or online at http://www.jedec.org)
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
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A
16236
V62/03644
REV
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PAGE
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/
Temperature,
TA
Limits
Device
type
Min
Output voltage
VO
1.22 V  VO  5.2 V
0 A  IO  100 mA,
TJ = 25C
3/
01
-40C to +85C
Unit
Max
V
VO typical
0.98VO
1.02VO
1.22 V  VO  5.2 V
TJ = 25C
0 A  IO  100 mA,
02
1.8 typical
1.764
-40C to +85C
1.836
2.8 V  VI  5.5 V
TJ = 25C
0 A  IO  100 mA,
03
3.3 typical
3.234
-40C to +85C
3.366
4.3 V  VI  5.5 V
TJ = 25C
0 A  IO  100 mA,
04
4.7 typical
4.606
-40C to +85C
4.794
5.2 V  VI  5.5 V
Quiescent current
(GND current)
IQ
Load regulation
Output voltage
line regulation
4/
Output noise voltage
TJ = 25C
01,02,
-40C to +85C
03,04
0 A  IO  100 mA
170 typical
A
250
RLD
0 A  IO  100 mA
TJ = 25C
01,02,
03,04
5 typical
mV
VO/VO
VO + 1 V  VI  5.5 V
TJ = 25C
01,02,
0.05 typical
%/V
-40C to +85C
03,04
TJ = 25C
02
VON
C(byp) = 0.001 F, IO = 100 mA,
BW = 100 Hz to 100 kHz
0.12
32 typical
C(byp) = 0.0047 F, IO = 100 mA,
BW = 100 Hz to 100 kHz
17 typical
C(byp) = 0.01 F, IO = 100 mA,
BW = 100 Hz to 100 kHz
16 typical
C(byp) = 0.1 F, IO = 100 mA,
BW = 100 Hz to 100 kHz
15 typical
VRMS
See footnotes at end of table.
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5
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
Conditions 1/ 2/
Limits
Device
type
Temperature,
TA
Min
Time, start-up
C(byp) = 0.001 F,
03
TJ = 25C
Unit
Max
53 typical
s
RL = 33 , CO = 1 F
67 typical
C(byp) = 0.0047 F,
RL = 33 , CO = 1 F
98 typical
C(byp) = 0.01 F,
RL = 33 , CO = 1 F
Output current limit
VO = 0 V 3/
-40C to +85C
01,02,
03,04
285
600
mA
Under voltage lock
out (UVLO) threshold
VCC rising
-40C to +85C
01,02,
03,04
2.25
2.65
V
Under voltage lock
out (UVLO) hystersis
VCC rising
TJ = 25C
01,02,
03,04
100 typical
mV
Standby current
EN = VI, 2.7 V  VI  5.5 V
-40C to +85C
01,02,
03,04
1
A
High level enable
input voltage
2.7 V  VI  5.5 V
-40C to +85C
01,02,
03,04
Low level enable
input voltage
2.7 V  VI  5.5 V
-40C to +85C
01,02,
03,04
Input current ( EN )
EN = VI
-40C to +85C
01,02,
03,04
TJ = 25C
02
Power supply ripple
rejection
IO
PSRR
f = 100 Hz, IO = 10 mA
2
-1
V
0.7
V
1
A
80 typical
f = 100 Hz, IO = 100 mA
75 typical
f = 10 kHz, IO = 100 mA
72 typical
f = 100 kHz, IO = 100 mA
45 typical
03
f = 100 Hz, IO = 10 mA
dB
70 typical
f = 100 Hz, IO = 100 mA
75 typical
f = 10 kHz, IO = 100 mA
73 typical
f = 100 kHz, IO = 100 mA
37 typical
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
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SIZE
CODE IDENT NO.
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16236
V62/03644
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6
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
Conditions 1/ 2/
Limits
Device
type
Temperature,
TA
Min
Dropout voltage 5/
IO = 100 mA
03
TJ = 25C
Unit
Max
50 typical
mV
90
-40C to +85C
04
TJ = 25C
38 typical
70
-40C to +85C
1/
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over
the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters
may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization
and/or design.
2/
Unless otherwise specified, VI = VO(typ) + 1 V, IO = 1 mA, EN = 0 V, CO = 10 F, CO(byp) = 0.01 F, TJ = -40C to +125C.
3/
The minimum IN operating voltage is 2.7 V or VO(typ) + 1 V, whichever is greater. The maximum IN voltage is 5.5 V.
The maximum output current is 100 mA.
4/
If VO  1.8 V then VImin = 2.7 V, VImax = 5.5 V:
Line regulation (mV) = (%/V) x (VO(VImax – 2.7 V) / 100) x 1000.
If VO  2.5 V then VImin = VO +1 V, VImax = 5.5 V;
Line regulation (mV) = (%/V) x (VO(VImax – (VO +1 V)) / 100) x 1000
5/
IN voltage equals VO(typ) – 100 mV; device type 02 dropout voltage is limited by the input voltage range limitations.
DEFENSE SUPPLY CENTER, COLUMBUS
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CODE IDENT NO.
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16236
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7
Case X
FIGURE 1. Case outlines.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
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A
16236
V62/03644
REV
A
PAGE
8
Case X – continued.
Dimensions
Symbol
Inches
Millimeters
Min
Max
Min
Max
A
.037
.057
0.95
1.45
A1
.001
---
0.05
---
b
.011
.019
0.30
0.50
c
.005 nominal
0.15 nominal
D
.110
.118
2.80
3.00
E
.059
.066
1.50
1.70
E1
.102
.118
2.60
3.00
e
L
.037 BSC
.013
0.95 BSC
.021
0.35
0.55
L1
.009 nominal
0.25 nominal
n
5
5
NOTES:
1. Controlling dimensions are millimeter, inch dimensions are given for reference only.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not
exceed 0.15 mm (0.006 inch) per end.
4. Falls within reference to JEDEC MO-178-AA.
FIGURE 1. Case outlines – continued.
DEFENSE SUPPLY CENTER, COLUMBUS
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CODE IDENT NO.
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Case Y
FIGURE 1. Case outlines – continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
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A
16236
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REV
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Case Y – continued.
Dimensions
Symbol
Inches
Millimeters
Min
Max
Min
Max
A
.037
.057
0.95
1.45
A1
.001
---
0.05
---
b
.009
.019
0.25
0.50
c
.005 nominal
0.15 nominal
D
.110
.118
2.80
3.00
E
.059
.066
1.50
1.70
E1
.102
.118
2.60
3.00
e
L
L1
.037 BSC
.013
0.95 BSC
.021
0.35
.009 nominal
n
0.55
0.25 nominal
6
6
NOTES:
1. Controlling dimensions are millimeter, inch dimensions are given for reference only.
2. This drawing is subjected to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not
exceed 0.15 mm (0.006 inch) per end.
4. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation.
5. Falls within reference to JEDEC MO-178-AB, except minimum lead width.
FIGURE 1. Case outlines - Continued.
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Device types
01, 02, 03, 04
Case outlines
X
Terminal
number
Terminal symbol
Y
Terminal symbol
1
IN
IN
2
GND
GND
3
EN
EN
4
BYPASS
BYPASS
5
OUT
FB
6
---
OUT
I/O
Description
An external bypass capacitor, connected to this terminal, in conjunction
with an internal resistor, creates a low-pass filter to further reduce
regulator noise.
BYPASS
The EN terminal is an input which enables or shuts down the device.
EN
I
When EN is a logic high, the device will be in shutdown mode.
When EN is a logic low, the device will be enabled.
FB
I
GND
This terminal is the feedback input voltage for the adjustable device.
Regulator ground
IN
I
The IN terminal is the input to the device.
OUT
O
The OUT terminal is the regulated output of the device.
FIGURE 2. Terminal connections.
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FIGURE 3. Logic diagram.
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4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item.
Vendor item drawing
administrative control
number 1/ 2/
Device
manufacturer
CAGE code
Top side
marking
Vendor part number 3/ 4/
V62/03644-01YE
01295
PEUE
TPS79101DBVREP
V62/03644-02XE
01295
PERE
TPS79118DBVREP
V62/03644-03XE
01295
PESE
TPS79133DBVREP
V62/03644-04XE
5/
PETE
TPS79147DBVREP
1/ The vendor item drawing establishes an administrative control number for identifying
the item on the engineering documentation.
2/ For the most current package and ordering information, see the package option addendum
at the end of the manufacturer’s data sheet , or use website www.ti.com.
3/ The DBVR indicates tape and reel of 3000 parts.
4/ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
5/ This device is not available from an approved source of supply.
CAGE code
01295
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Source of supply
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
Point of contact: U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
SIZE
CODE IDENT NO.
DWG NO.
A
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REV
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PAGE
14