REVISIONS LTR DESCRIPTION DATE APPROVED A Make clarification to 1.2.2. Add dimension L and make corrections to the L1 dimensions for both case outlines as specified under figure 1. - ro 09-02-11 R. HEBER Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV A A A A A A A A A A A A A A PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER Original date of drawing YY-MM-DD CHECKED BY TOM HESS 03-08-11 TITLE MICROCIRCUIT, LINEAR, LOW POWER, VOLTAGE REGULATOR, MONOLITHIC SILICON APPROVED BY RAYMOND MONNIN SIZE A REV AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 CODE IDENT. NO. DWG NO. V62/03644 16236 A PAGE 1 OF 14 5962-V026-09 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance low power voltage regulator microcircuit, with an operating temperature range of -40C to +85C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/03644 - Drawing number 01 X E Device type (See 1.2.1) Case outline (See 1.2.2) Lead finish (See 1.2.3) 1.2.1 Device type(s). Device type Generic 01 02 03 04 Circuit function TPS79101-EP TPS79118-EP TPS79133-EP TPS79147-EP Voltage Low power voltage regulator Low power voltage regulator Low power voltage regulator Low power voltage regulator 1.2 V to 5.5 V 1.8 V 3.3 V 4.7 V 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins X Y 5 6 JEDEC PUB 95 Package style MO-178-AA MO-178-AB Plastic small outline Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator A B C D E Z DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Material Hot solder dip Tin-lead plate Gold plate Palladium Gold flash palladium Other SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 2 1.3 Absolute maximum ratings. 1/ Input voltage range .................................................................................................... -0.3 V to 6 V 2/ Voltage range at EN ................................................................................................. Voltage on OUT ......................................................................................................... Peak output current .................................................................................................... ESD rating, HBM ........................................................................................................ ESD rating, CDM ........................................................................................................ Continuous total power dissipation (PD) ..................................................................... -0.3 V to VI +0.3 V -0.3 V to 6 V Internally limited 2 kV 500 V See dissipation rating table Operating virtual junction temperature range (TJ) ...................................................... -40C to +150C Operating free-air temperature range (TA) ................................................................. -40C to +85C Storage temperature range (TSTG) ............................................................................ -65C to 150C 1.4 Recommended operating conditions. 3/ Input voltage range (VI) .............................................................................................. 2.7 V to 5.5 V 4/ Continuous output current (IO) ................................................................................... 0 mA to 100 mA 5/ Operating junction temperature (TJ) ........................................................................... -40C to +125C Board Case RJC RJA outlines 1/ 2/ 3/ 4/ 5/ 6/ 7/ Derating factor TA 25C TA = 70C TA = 85C above TA = 25C Power rating Power rating Power rating Low K 6/ X, Y 63.75C/W 256C/W 3.906 mW/C 391 mW 215 mW 156 mW High K 7/ X, Y 63.75C/W 178.3C/W 5.609 mW/C 561 mW 308 mW 224 mW Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network terminal ground. Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. To calculate the minimum input voltage for your maximum output current, use the following formula: VI(min) = VO(max) + VDO (max load). Continuous output current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that the device operate under conditions beyond those specified in this table extended periods of time. The JEDEC low K (1s) board design used to derive this data was a 3-inch x 3-inch, two layer board with 2 ounce copper traces on top of the board. The JEDEC high K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multi-layer board with 1 ounce internal power and ground planes and 2 ounce copper traces on top and bottom of the board. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 3 2. APPLICABLE DOCUMENTS JEDEC PUB 95 – Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http://www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as follows: A. B. C. Manufacturer’s name, CAGE code, or logo Pin 1 identifier ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ Temperature, TA Limits Device type Min Output voltage VO 1.22 V VO 5.2 V 0 A IO 100 mA, TJ = 25C 3/ 01 -40C to +85C Unit Max V VO typical 0.98VO 1.02VO 1.22 V VO 5.2 V TJ = 25C 0 A IO 100 mA, 02 1.8 typical 1.764 -40C to +85C 1.836 2.8 V VI 5.5 V TJ = 25C 0 A IO 100 mA, 03 3.3 typical 3.234 -40C to +85C 3.366 4.3 V VI 5.5 V TJ = 25C 0 A IO 100 mA, 04 4.7 typical 4.606 -40C to +85C 4.794 5.2 V VI 5.5 V Quiescent current (GND current) IQ Load regulation Output voltage line regulation 4/ Output noise voltage TJ = 25C 01,02, -40C to +85C 03,04 0 A IO 100 mA 170 typical A 250 RLD 0 A IO 100 mA TJ = 25C 01,02, 03,04 5 typical mV VO/VO VO + 1 V VI 5.5 V TJ = 25C 01,02, 0.05 typical %/V -40C to +85C 03,04 TJ = 25C 02 VON C(byp) = 0.001 F, IO = 100 mA, BW = 100 Hz to 100 kHz 0.12 32 typical C(byp) = 0.0047 F, IO = 100 mA, BW = 100 Hz to 100 kHz 17 typical C(byp) = 0.01 F, IO = 100 mA, BW = 100 Hz to 100 kHz 16 typical C(byp) = 0.1 F, IO = 100 mA, BW = 100 Hz to 100 kHz 15 typical VRMS See footnotes at end of table. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 5 TABLE I. Electrical performance characteristics – continued. Test Symbol Conditions 1/ 2/ Limits Device type Temperature, TA Min Time, start-up C(byp) = 0.001 F, 03 TJ = 25C Unit Max 53 typical s RL = 33 , CO = 1 F 67 typical C(byp) = 0.0047 F, RL = 33 , CO = 1 F 98 typical C(byp) = 0.01 F, RL = 33 , CO = 1 F Output current limit VO = 0 V 3/ -40C to +85C 01,02, 03,04 285 600 mA Under voltage lock out (UVLO) threshold VCC rising -40C to +85C 01,02, 03,04 2.25 2.65 V Under voltage lock out (UVLO) hystersis VCC rising TJ = 25C 01,02, 03,04 100 typical mV Standby current EN = VI, 2.7 V VI 5.5 V -40C to +85C 01,02, 03,04 1 A High level enable input voltage 2.7 V VI 5.5 V -40C to +85C 01,02, 03,04 Low level enable input voltage 2.7 V VI 5.5 V -40C to +85C 01,02, 03,04 Input current ( EN ) EN = VI -40C to +85C 01,02, 03,04 TJ = 25C 02 Power supply ripple rejection IO PSRR f = 100 Hz, IO = 10 mA 2 -1 V 0.7 V 1 A 80 typical f = 100 Hz, IO = 100 mA 75 typical f = 10 kHz, IO = 100 mA 72 typical f = 100 kHz, IO = 100 mA 45 typical 03 f = 100 Hz, IO = 10 mA dB 70 typical f = 100 Hz, IO = 100 mA 75 typical f = 10 kHz, IO = 100 mA 73 typical f = 100 kHz, IO = 100 mA 37 typical See footnotes at end of table. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 6 TABLE I. Electrical performance characteristics – continued. Test Symbol Conditions 1/ 2/ Limits Device type Temperature, TA Min Dropout voltage 5/ IO = 100 mA 03 TJ = 25C Unit Max 50 typical mV 90 -40C to +85C 04 TJ = 25C 38 typical 70 -40C to +85C 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Unless otherwise specified, VI = VO(typ) + 1 V, IO = 1 mA, EN = 0 V, CO = 10 F, CO(byp) = 0.01 F, TJ = -40C to +125C. 3/ The minimum IN operating voltage is 2.7 V or VO(typ) + 1 V, whichever is greater. The maximum IN voltage is 5.5 V. The maximum output current is 100 mA. 4/ If VO 1.8 V then VImin = 2.7 V, VImax = 5.5 V: Line regulation (mV) = (%/V) x (VO(VImax – 2.7 V) / 100) x 1000. If VO 2.5 V then VImin = VO +1 V, VImax = 5.5 V; Line regulation (mV) = (%/V) x (VO(VImax – (VO +1 V)) / 100) x 1000 5/ IN voltage equals VO(typ) – 100 mV; device type 02 dropout voltage is limited by the input voltage range limitations. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 7 Case X FIGURE 1. Case outlines. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 8 Case X – continued. Dimensions Symbol Inches Millimeters Min Max Min Max A .037 .057 0.95 1.45 A1 .001 --- 0.05 --- b .011 .019 0.30 0.50 c .005 nominal 0.15 nominal D .110 .118 2.80 3.00 E .059 .066 1.50 1.70 E1 .102 .118 2.60 3.00 e L .037 BSC .013 0.95 BSC .021 0.35 0.55 L1 .009 nominal 0.25 nominal n 5 5 NOTES: 1. Controlling dimensions are millimeter, inch dimensions are given for reference only. 2. This drawing is subject to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 mm (0.006 inch) per end. 4. Falls within reference to JEDEC MO-178-AA. FIGURE 1. Case outlines – continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 9 Case Y FIGURE 1. Case outlines – continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 10 Case Y – continued. Dimensions Symbol Inches Millimeters Min Max Min Max A .037 .057 0.95 1.45 A1 .001 --- 0.05 --- b .009 .019 0.25 0.50 c .005 nominal 0.15 nominal D .110 .118 2.80 3.00 E .059 .066 1.50 1.70 E1 .102 .118 2.60 3.00 e L L1 .037 BSC .013 0.95 BSC .021 0.35 .009 nominal n 0.55 0.25 nominal 6 6 NOTES: 1. Controlling dimensions are millimeter, inch dimensions are given for reference only. 2. This drawing is subjected to change without notice. 3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 mm (0.006 inch) per end. 4. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation. 5. Falls within reference to JEDEC MO-178-AB, except minimum lead width. FIGURE 1. Case outlines - Continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 11 Device types 01, 02, 03, 04 Case outlines X Terminal number Terminal symbol Y Terminal symbol 1 IN IN 2 GND GND 3 EN EN 4 BYPASS BYPASS 5 OUT FB 6 --- OUT I/O Description An external bypass capacitor, connected to this terminal, in conjunction with an internal resistor, creates a low-pass filter to further reduce regulator noise. BYPASS The EN terminal is an input which enables or shuts down the device. EN I When EN is a logic high, the device will be in shutdown mode. When EN is a logic low, the device will be enabled. FB I GND This terminal is the feedback input voltage for the adjustable device. Regulator ground IN I The IN terminal is the input to the device. OUT O The OUT terminal is the regulated output of the device. FIGURE 2. Terminal connections. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 12 FIGURE 3. Logic diagram. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 13 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. Vendor item drawing administrative control number 1/ 2/ Device manufacturer CAGE code Top side marking Vendor part number 3/ 4/ V62/03644-01YE 01295 PEUE TPS79101DBVREP V62/03644-02XE 01295 PERE TPS79118DBVREP V62/03644-03XE 01295 PESE TPS79133DBVREP V62/03644-04XE 5/ PETE TPS79147DBVREP 1/ The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation. 2/ For the most current package and ordering information, see the package option addendum at the end of the manufacturer’s data sheet , or use website www.ti.com. 3/ The DBVR indicates tape and reel of 3000 parts. 4/ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 5/ This device is not available from an approved source of supply. CAGE code 01295 DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Source of supply Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 SIZE CODE IDENT NO. DWG NO. A 16236 V62/03644 REV A PAGE 14