V6207606 VID

REVISIONS
LTR
DESCRIPTION
A
Add reference information to section 2.
Make change to notes specified under figure 1.
Update boilerplate paragraphs to current
requirements. - ro
DATE
APPROVED
11-12-01
C. SAFFLE
CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24
Vendor item drawing
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PMIC N/A
PREPARED BY
RICK OFFICER
Original date of drawing
YY-MM-DD
CHECKED BY
TOM HESS
06-11-15
TITLE
MICROCIRCUIT, LINEAR, DUAL, HIGH SPEED,
LOW NOISE, OPERATIONAL AMPLIFIER,
MONOLITHIC SILICON
APPROVED BY
RAYMOND MONNIN
SIZE
A
REV
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
CODE IDENT. NO.
DWG NO.
V62/07606
16236
A
PAGE
1
OF
10
5962-V012-12
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance dual, high speed, low noise, operational
amplifier microcircuit, with an operating temperature range of -55C to +125C.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/07606
-
Drawing
number
01
X
E
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Device type
Generic
01
MC33078-EP
Circuit function
Dual, high speed, low noise, operational amplifier
1.2.2 Case outline(s). The case outline(s) are as specified herein.
Outline letter
Number of pins
X
8
JEDEC PUB 95
Package style
MS-012-AA
Plastic surface mount
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture:
Finish designator
A
B
C
D
E
Z
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
SIZE
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CODE IDENT NO.
16236
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1.3 Absolute maximum ratings.
1/
Positive supply voltage (VCC+) .................................................................................. +18 V maximum 2/
Negative supply voltage (VCC-) .................................................................................. -18 V maximum 2/
Supply voltage (VCC- to VCC+) .................................................................................. 36 V maximum
Input voltage, either input ........................................................................................... VCC- to VCC+ maximum 2/ 3/
Input current ............................................................................................................... 10 mA maximum 4/
Duration of output short circuit ................................................................................... Unlimited 5/
Package thermal impedance (JA) ............................................................................. 97C/W 6/ 7/
Operating virtual junction temperature (TJ) ................................................................ +150C
Storage temperature range (TSTG) .............................................................................. -65C to +150C 8/
1.4 Recommended operating conditions. 9/
Positive supply voltage range (VCC+) ........................................................................ +5 V to +18 V
Negative supply voltage range (VCC-) ........................................................................ -5 V to -18 V
Operating free-air temperature range (TA) ................................................................. -55C to +125C
1/
2/
3/
4/
5/
6/
7/
8/
9/
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC-.
The magnitude of the input voltage must never exceed the magnitude of the supply voltage.
Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs,
unless some limiting resistance is used.
The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the
maximum dissipation rating is not exceeded.
Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = ( TJ(max) – TA ) / JA. Operating at the absolute maximum TJ of 150C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Long term high temperature storage and/or extended use at maximum recommended operating conditions may result in a
reduction of overall device life. See manufacturer’s website for additional information on enhanced plastic packaging.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
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2. APPLICABLE DOCUMENTS
JEDEC Solid State Technology Association
JEDEC PUB 95 –
EIA/JEDEC 51-7 –
Registered and Standard Outlines for Semiconductor Devices
High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
(Applications for copies should be addressed to the JEDEC Office, 3103 North 10th Street, Suite 240-S, Arlington, VA 22201-2107
or online at http://www.jedec.org)
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
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TABLE I. Electrical performance characteristics. 1/
Test
Input offset voltage
Symbol
VIO
Conditions
VCC- = -15 V, VCC+ = +15 V
unless otherwise specified
VO = 0, RS = 10 ,
Temperature,
TA
Device
type
Min
-55C to +125C
01
+25C
01
VO = 0, RS = 10 , VCM = 0
Input bias current
IIB
VO = 0, VCM = 0
Max
2
2 typical
IIO
01
150
VICR
VIO = 5 mV, VO = 0
Large signal differential
voltage amplification
AVD
RL  2 k, VO = 10 V
-55C to +125C
01
13
V
+25C
01
90
dB
80
-55C to +125C
Maximum output
voltage swing
VOM+
VID = 1 V, RL = 600 
01
+25C
10.7 typical
VID = 1 V, RL = 2 k
13.2
+25C
-13.2
VOMVOM+
V
-11.9 typical
VOMVOM+
nA
175
-55C to +125C
Common mode input
voltage range
nA
800
+25C
VO = 0, VCM = 0
V/C
750
-55C to +125C
Input offset current
mV
3
-55C to +125C
VIO
Unit
01
+25C
VCM = 0
Input offset voltage
temperature
coefficient
Limits
VID = 1 V, RL = 10 k
13.5
+25C
-14
VOMCommon mode
rejection ratio
CMRR
VIN = 13 V
+25C
01
80
dB
Supply voltage 2/
rejection ratio
kSVR
VCC+ = +5 V to +15 V,
+25C
01
80
dB
Output short circuit
current
IOS
+25C
01
15
mA
VCC- = -5 V to -15 V
|VID| = 1 V, output to GND,
source current
-20
|VID| = 1 V, output to GND,
sink current
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
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SIZE
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Supply current
Symbol
ICC
Conditions
VCC- = -15 V, VCC+ = +15 V
unless otherwise specified
Temperature,
TA
Limits
Min
01
+25C
VO = 0
(per channel)
Slew rate at unity gain
Device
type
AVD = 1, VIN = -10 V to 10 V,
Max
2.5
mA
3.5
-55C to +125C
SR
Unit
+25C
01
5
V/s
RL = 2 k, CL = 100 pF
Gain bandwidth
product
GBW
f = 100 kHz
+25C
01
16 typical
MHz
Unity gain frequency
B1
Open loop
+25C
01
9 typical
MHz
RL = 2 k, CL = 0 pF
+25C
01
-11 typical
dB
Gain margin
-6 typical
RL = 2 k, CL = 100 pF
Phase margin
m
01
+25C
RL = 2 k, CL = 0 pF

55 typical
40 typical
RL = 2 k, CL = 100 pF
Amplifier-to-amplifier
isolation
f = 20 Hz to 20 kHz
+25C
01
-120 typical
dB
Power bandwidth
VO = 27 V(PP), RL = 2 k,
THD  1%
+25C
01
120 typical
kHz
Total harmonic
distortion
THD
VO = 3 Vrms, AVD = 1, RL = 2 k,
f = 20 Hz to 20 kHz
+25C
01
0.002 typical
%
Open loop output
impedance
zO
VO = 0, f = 9 MHz
+25C
01
37 typical

Differential input
resistance
rid
VCM = 0
+25C
01
175 typical
k
Differential input
capacitance
Cid
VCM = 0
+25C
01
12 typical
pF
Equivalent input noise
voltage
Vn
f = 1 kHz, RS = 100 
+25C
01
4.5 typical
nV /
Equivalent input noise
current
In
Hz
f = 1 kHz
01
+25C
0.5 typical
pA /
Hz
1/
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over
the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters
may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization
and/or design.
2/
Measured with VCC differentially varied at the same time.
DEFENSE SUPPLY CENTER, COLUMBUS
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SIZE
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Case X
FIGURE 1. Case outline.
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SIZE
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Case X - continued
Dimensions
Inches
Symbol
Millimeters
Min
Max
Min
Max
A
---
0.069
---
1.75
A1
0.004
0.010
0.10
0.25
b
0.012
0.020
0.31
0.51
c
0.007
0.010
0.17
0.25
D
0.189
0.197
4.80
5.00
E
0.150
0.157
3.80
4.00
E1
0.228
0.244
5.80
6.20
e
L
n
0.050 BSC
0.016
1.27 BSC
0.050
0.40
8
1.27
8
NOTES:
1. Controlling dimensions are inch, millimeter dimensions are given for reference only.
2. For dimension D, body length does not include mold flash, protrusion, or gate burrs.
Mold flash, protrusion, or gate burrs shall not exceed 0.006 inch (0.15 mm) per end.
3. For dimension E, body width does not include interlead flash. Interlead flash shall not exceed
0.017 inch (0.43 mm) per side.
4. Falls with JEDEC MS-012 variation AA.
FIGURE 1. Case outline – Continued.
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Device type
01
Case outline
X
Terminal number
Terminal
symbol
1
OUT1
2
IN1-
3
IN1+
4
VCC-
5
IN2+
6
IN2-
7
OUT2
8
VCC+
FIGURE 2. Terminal connections.
DEFENSE SUPPLY CENTER, COLUMBUS
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SIZE
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4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item.
Vendor item drawing
administrative control
number 1/
Device
manufacturer
CAGE code
Package
Top side
marking
Vendor part number
V62/07606-01XE
01295
Reel of 2500
33078M
MC33078MDREP
1/ The vendor item drawing establishes an administrative control number for identifying the item
on the engineering documentation.
2/ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available from manufacturer.
CAGE code
01295
DEFENSE SUPPLY CENTER, COLUMBUS
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Source of supply
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Ln.
PO Box 660199
Dallas, TX 75243
Point of contact:
U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
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