V6206616 VID

REVISIONS
LTR
DESCRIPTION
A
Add footnotes 3/ and 4/ to output voltage
(reference voltage) test under Table I.
Update boilerplate paragraphs to current
requirements. - ro
DATE
APPROVED
12-08-14
C. SAFFLE
CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24
Vendor item drawing
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PMIC N/A
PREPARED BY
RICK OFFICER
Original date of drawing
YY-MM-DD
CHECKED BY
TOM HESS
06-03-15
TITLE
MICROCIRCUIT, LINEAR, DUAL OUTPUT,
LOW DROPOUT VOLTAGE REGULATOR,
MONOLITHIC SILICON
APPROVED BY
RAYMOND MONNIN
SIZE
A
REV
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
CODE IDENT. NO.
DWG NO.
V62/06616
16236
A
PAGE
1
OF
16
5962-V073-12
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance dual output, low dropout voltage regulator
microcircuit, with an operating temperature range of -55°C to +125°C.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/06616
-
Drawing
number
01
X
E
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Device type
Generic
01
TPS70345-EP
Circuit function
Dual output, low dropout voltage regulator
1.2.2 Case outline(s). The case outline(s) are as specified herein.
Outline letter
Number of pins
X
24
JEDEC PUB 95
Package style
MO-153
Plastic small outline with a thermal pad
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture:
Finish designator
A
B
C
D
E
Z
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/06616
PAGE
2
1.3 Absolute maximum ratings.
1/
Input voltage range:
( VIN1 ) ............................................................................................................. -0.3 V to +7 V 2/
( VIN2 ) ............................................................................................................. -0.3 V to +7 V 2/
Voltage range at EN ............................................................................................ -0.3 V to +7 V
Output voltage range (VOUT1, VSENSE1) ............................................................. +5.5 V
Output voltage range (VOUT2, VSENSE2) ............................................................. +5.5 V
Maximum RESET , PG1 voltage ........................................................................ +7 V
Maximum MR1 , MR2 , and SEQ voltage ............................................................ VIN1
Peak output current .............................................................................................. Internally limited
Operating virtual junction temperature range (TJ) ................................................ -55°C to +150°C
Storage temperature range (TSTG) ...................................................................... -65°C to +150°C
Electrostatic discharge (ESD) rating:
Human body model (HBM) ............................................................................... 2 kV
1.4 Recommended operating conditions. 3/
Input voltage range (VIN) ..................................................................................... +2.7 V to +6.0 V
4/
Output current (IO) (regulator 1) ........................................................................... 0 to 1.0 A
Output current (IO) (regulator 2) ........................................................................... 0 to 2.0 A
Operating virtual junction temperature range (TJ) ................................................ -55°C to +125°C
1/
2/
3/
4/
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
All voltages are tied to network ground.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.
To calculate the minimum input voltage for maximum output current, use the following equation:
VI(min) = VO(max) + VDO(max load).
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
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V62/06616
PAGE
3
2. APPLICABLE DOCUMENTS
JEDEC Solid State Technology Association
JEDEC PUB 95 –
Registered and Standard Outlines for Semiconductor Devices
(Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA
22201-3834 or online at http://www.jedec.org)
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3.
3.5.4 Timing waveforms. The timing waveforms shall be as shown in figure 4.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
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CODE IDENT NO.
16236
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V62/06616
PAGE
4
TABLE I. Electrical performance characteristics. 1/
Test
Symbol
Conditions 2/
Temperature,
TJ
Device
type
Limits
Min
Output voltage 3/ 4/
(reference voltage)
VO
2.7 V < VI < 6 V,
01
25°C
Unit
Max
1.224 typical
V
FB connected to VO
2.7 V < VI < 6 V,
1.196
-55°C to +125°C
1.248
FB connected to VO
Output voltage
1.2 V output (VOUT2)
Quiescent current
(GND current) for
regulator 1 and
VO
3/
2.7 V < VI < 6 V
25°C
2.7 V < VI < 6 V
-55°C to +125°C
4/
01
1.2 typical
1.176
01
25°C
V
1.224
185 typical
µA
250
-55°C to +125°C
regulator 2, EN = 0 V
Output voltage
line regulation
( ∆VO / VO ) for
regulator 1 and
regulator 2
5/
VO + 1 V < VI < 6 V
3/
25°C
VO + 1 V < VI < 6 V
3/
-55°C to +125°C
Load regulation for
VOUT1 and VOUT2
4/
Output current limit
Regulator 1, VO = 0 V
01
0.01 % typical
0.1 %
25°C
01
-55°C to +125°C
01
1 typical
A
4.8
Thermal shutdown
junction temperature
II(standby)
mV
2.35
Regulator 2, VO = 0 V
Standby current
V
01
150 typical
°C
01
2
µA
EN = VI
25°C
EN = VI
-55°C to +125°C
I(RESET) = 300 µA,
-55°C to +125°C
01
-55°C to +125°C
01
+25°C
01
10
RESET terminal.
Minimum input voltage
for valid RESET
1.3
V
98%
VO
V(RESET) ≤ 0.8 V
Trip threshold voltage
VO decreasing
Hysteresis voltage
Measured at VO
92%
0.5% typical
VO
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
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PAGE
5
TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TJ
Device
type
Limits
Unit
Min
Max
80
160
RESET terminal – continued.
-55°C to +125°C
01
+25°C
01
VI = 3.5 V, I(RESET) = 1 mA
-55°C to +125°C
01
0.4
V
V(RESET) = 6 V
-55°C to +125°C
01
1
µA
Minimum input voltage
for valid PG
I(PG) = 300 µA, V(PG1) ≤ 0.8 V
-55°C to +125°C
01
1.3
V
Trip threshold voltage
VO decreasing
-55°C to +125°C
01
98%
VO
Hysteresis voltage
Measured at VO
+25°C
01
0.5% typical
VO
tr(PG1)
Rising edge deglitch
+25°C
01
30 typical
µs
Output low voltage
VI = 2.7 V, I(PG) = 1 mA
-55°C to +125°C
01
0.4
V
Leakage current
V(PG1) = 6 V
-55°C to +125°C
01
1
µA
High level EN input
voltage
-55°C to +125°C
01
Low level EN input
voltage
-55°C to +125°C
01
Input current ( EN )
-55°C to +125°C
01
-1
High level SEQ input
voltage
-55°C to +125°C
01
2
Low level SEQ input
voltage
-55°C to +125°C
01
SEQ pullup current
source
+25°C
01
t(RESET)
RESET pulse duration
tr(RESET)
Rising edge deglitch
Output low voltage
Leakage current
ms
µs
30 typical
PG terminal.
92%
EN terminal.
2
V
0.7
V
1
µA
SEQ terminal.
V
0.7
6 typical
V
µA
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
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A
DWG NO.
V62/06616
PAGE
6
TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TJ
Device
type
Limits
Min
Unit
Max
MR1 / MR2 terminals.
High level input voltage
-55°C to +125°C
01
Low level input voltage
-55°C to +125°C
01
+25°C
01
VOUT2 UV comparator
positive going input
threshold voltage of
VOUT1 UV
comparator
-55°C to +125°C
01
80 %
VO
VOUT2 UV comparator
hysteresis
+25°C
01
3 % VO typical
mV
Pullup current source
2
V
0.7
9.5 typical
V
µA
VOUT2 terminal.
86 %
VO
V
VOUT2 UV comparator
falling edge deglitch
VSENSE2 decreasing below
threshold
+25°C
01
140 typical
µs
Peak output current
2 ms pulse width
+25°C
01
3 typical
A
Discharge transistor
current
VOUT2 = 1.5 V
+25°C
01
7.5 typical
mA
VOUT1 UV comparator
positive going input
threshold voltage
of VOUT1 UV
comparator
-55°C to +125°C
01
80 %
VO
VOUT1 UV comparator
hysteresis
+25°C
01
3 % VO typical
mV
VOUT1 terminal.
86 %
VO
V
VOUT1 UV comparator
falling edge deglitch
VSENSE1 decreasing below
threshold
+25°C
01
140 typical
µs
Dropout voltage 6/
IO = 1 A, VIN1 = 3.2 V
+25°C
01
160 typical
mV
IO = 1 A, VIN1 = 3.2 V
-55°C to +125°C
255
Peak output current
2 ms pulse width
+25°C
01
1.2 typical
A
Discharge transistor
current
VOUT1 = 1.5 V
+25°C
01
7.5 typical
mA
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
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7
TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TJ
Device
type
Limits
Unit
Min
Max
2.3
2.65
VIN1 / VIN2 terminal.
UVLO threshold
-55°C to +125°C
01
UVLO hysteresis
+25°C
01
110 typical
V
mV
1/
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over
the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters
may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization
and/or design.
2/
Unless otherwise specified, VIN1 or VIN2 = VOUTX(nom) + 1 V, IOUTX = 1 mA, EN = 0, COUT1 = 22 µF, and COUT2 = 47 µF.
3/
Minimum input operating voltage is 2.7 V or VO(typ) + 1 V, whichever is greater.
Maximum input voltage = 6 V, minimum output current is 1 mA.
4/
IO = 1 mA to 1 A for regulator 1 and 1 mA to 2 A regulator 2.
5/
If VO < 1.8 V then VImax = 6 V, VImin = 2.7 V:
Line regulation (mV) = ( % / V ) x ( VO ( VImax – 2.7 V ) / 100 ) x 1000
If VO > 2.5 V then VImax = 6 V, VImin = VO + 1 V:
Line regulation (mV) = ( % / V ) x ( VO ( VImax – (VO + 1 V )) / 100 ) x 1000
6/
Input voltage ( VIN1 or VIN2 ) = VO(typ) – 100 mV. For the 1.5 V, 1.8 V, and 2.5 V regulators, the dropout voltage is limited
by input voltage range. The 3.3 V regulator input voltage is set to 3.2 V to perform this test.
DEFENSE SUPPLY CENTER, COLUMBUS
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SIZE
A
CODE IDENT NO.
16236
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Case X
FIGURE 1. Case outline.
DEFENSE SUPPLY CENTER, COLUMBUS
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Case X
Dimensions
Inches
Symbol
Millimeters
Min
Max
Min
Max
A
---
.047
---
1.20
A1
.001
.005
0.05
0.15
b
.007
.011
0.19
0.30
c
.005 nominal
0.15 nominal
D
.303
.311
7.70
7.90
E
.169
.177
4.30
4.50
E1
.244
.259
6.20
6.60
e
L
n
.025 BSC
.019
0.65 BSC
.029
0.50
24
0.75
24
Notes:
1. Controlling dimensions are millimeter, inch dimensions are given for reference only.
2. Body dimensions do not include mold flash or protrusions. Mold flash and protrusion shall not exceed 0.15 mm
(0.006 inch) per side.
3. This package is designed to be soldered to a thermal pad on the board. Refer to technical brief, power pad thermally
enhanced package, manufacturer literature number SLMA002 for information regarding recommended board layout.
This document is available from the manufacturer.
4. Falls within JEDEC MO-153.
FIGURE 1. Case outline – Continued.
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Device type
01
Case outline
X
Terminal number
Terminal symbol
1
GND / HEATSINK
2
VIN1
3
VIN1
4
NC
5
MR2
6
MR1
7
EN
8
SEQ
9
GND
10
VIN2
11
VIN2
12
GND / HEATSINK
13
GND / HEATSINK
14
VOUT2
15
VOUT2
16
VSENSE2 / FB2
17
NC
18
RESET
19
PG1
20
NC
21
VSENSE1 / FB1
22
VOUT1
23
VOUT1
24
GND / HEATSINK
FIGURE 2. Terminal connections.
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Terminal symbol
I/O
EN
I
Description
Active low enable.
GND
Regulator ground.
GND / HEATSINK
Ground / heatsink.
MR1
I
MR2
I
NC
Manual reset input 1, active low, pulled up
internally.
Manual reset input 2, active low, pulled up
internally.
No connection.
Open drain output, low when VOUT1 voltage is less
than 95 % of the nominal regulated voltage.
Open drain output, SVS (power on reset) signal,
active low.
Power up sequence control:
SEQ = high, VOUT2 powers up first;
PG1
O
RESET
O
SEQ
I
VIN1
I
Input voltage of regulator 1.
VIN2
I
Input voltage of regulator 2.
VOUT1
O
Output voltage of regulator 1.
VOUT2
O
Output voltage of regulator 2.
VSENSE2
I
Regulator 2 output voltage sense.
VSENSE1
I
Regulator 1 output voltage sense.
SEQ = low, VOUT1 powers up first,
SEQ terminal pulled up internally.
FIGURE 2. Terminal connections – Continued.
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NOTES:
1. For most applications, VSENSE1 and VSENSE2 should be externally connected to VOUT as close as possible
to the device. For other implementations, refer to SENSE terminal connection discussion in the application
information section.
2. If the SEQ terminal is floating at the input, VOUT2 powers up first.
FIGURE 3. Logic diagram.
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NOTES:
1.
2.
VRES is the minimum input voltage for a valid RESET . The symbol VRES is not currently listed within EIA or JEDEC
standards for semiconductor symbology.
VIT - Trip voltage is typically 5% lower than the output voltage (95% VO) VIT- to VIT+ is the hysteresis voltage.
FIGURE 4. Timing waveforms.
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Notes:
1. VPG is the minimum input voltage for a valid PG. The symbol VPG is not currently listed within EIA or JEDEC standards for
semiconductor symbology.
2. VIT- Trip voltage is typically 5% lower than the output voltage (95% VO) VIT– to VIT+ is the hysteresis voltage.
FIGURE 4. Timing waveforms – Continued.
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4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all
current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Vendor item drawing
administrative control
number 1/
Device
manufacturer
CAGE code
Regulator 1
VO (V)
Regulator 2
VO (V)
Vendor part number
V62/06616-01XE
01295
3.3 V
1.2 V
TPS70345MPWPREP
1/ The vendor item drawing establishes an administrative control number for identifying the item on the
engineering documentation.
CAGE code
01295
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Source of supply
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
Point of contact: U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/06616
PAGE
16