INTEGRATED CIRCUITS SA5778 Serial triple gauge driver (STGD) Product specification Supersedes data of 1997 May 27 IC18 Data Handbook 1998 Apr 03 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 DESCRIPTION FEATURES The Serial Triple Gauge Driver (STGD), is a single chip air core driver providing drive to one major gauge, and two minor gauges, for automotive applications such as Speedometer, Fuel, Temperature, Tachometer, Volts, and Oil pressure information display. The STGD operates in conjunction with a microcontroller receiving serial data inputs, and can provide status back to the microcontroller either serially or via a status line. The protocol is compatible with the Philips Single Gauge Driver (SGD) and Dual Gauge Driver (DGD). The STGD also includes a protected battery supply for external single Serial Gauge Drivers or Dual Gauge Drivers. • Major Gauge 10-bit resolution Drive provides 0.35° resolution PIN CONFIGURATION • Serial Data Output SIN+ 1 28 – Sine/Cosine outputs for 360° operation – 0.2° accuracy typical throughout entire range • Minor gauge drivers provide 0.35° resolution – 112° operation – 0.5° accuracy typical throughout entire range • Serial Data Input – Supports interface from microcontrollers – Compatible with Philips SGD SA5775A and DGD SA5777A – Permits the STGD to be wired in series using a common chip select to additional STGDs, SGDs, and DGDs – Permits fault status information to be returned to the microcontroller SIN– RUN 2 27 COS+ GOE 3 26 COS– SwCONTROL 4 25 ST SwBATT1 5 24 SCLK GND 6 23 GND GND 7 22 GND GND 8 21 GND GND 9 20 GND • Over Voltage Protection, Over Temperature Protection and Low Standby Current Operation – Gauge drivers disabled when supply voltage exceeds specified operating voltage, protection to 40V. – Gauge drivers disabled when die temperature exceeds operating range – External switch may supply overvoltage protected battery supply to other devices operating off battery VBATT 10 19 CS SwBATT2 11 18 DATAIN DATAOUT 12 17 C1– COM 13 16 C1+ C2– 14 15 C2+ • Thermally Enhanced SO-28 surface mount package SR01116 Figure 1. Pin Configuration BLOCK DIAGRAM SCLK MINOR GAUGE 2 DATAIN MINOR GAUGE 1 MAJOR GAUGE 10-BIT SR 10-BIT SR 9-BIT DATA LATCH 9-BIT DATA LATCH 7-BIT Tan DAC 7-BIT Tan DAC 10-BIT SR DATAOUT CS GOE RUN ST ENABLE 7–BIT, SINE /COSINE DAC SIN+ SIN– COS+ COS– MUX GND MUX COM C2+ C2– SwBATT2 SwBATT1 SwControl MUX C1+ BIAS, TSD SwBATT, COMMON REFERENCE C1– VBATT 4-BIT STATUS LATCH 10-BIT DATA LATCH SR01117 Figure 2. STGD Internal Block Diagram 1998 Apr 03 2 853–2055 19199 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 ORDERING INFORMATION DESCRIPTION TEMPERATURE RANGE ORDER CODE DWG # –40 to +105°C SA5778D SOT136-1 28-Pin Small Outline (SO) thermally enhanced Package ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ PIN DESCRIPTION Mnemonic Pin No. Type GND 6,7,8,9,20, 21,22,&23 I Circuit Ground Potential. The pins are used for heat dissipation to board. All pins should be soldered to foil on the board per the thermal management description. Name and Function VBATT 10 I Battery supply voltage GOE 3 I Gauge Output Enable: A high on this input enables normal operation of the gauge coil drivers. See Table 1. RUN 2 I RUN (Ignition): Input to sense the state of the Ignition switch. See Table 1. SwCONTROL 4 O Switched Battery Control: Control output to switch on a protected VBATT supply via an external PNP transistor. This output is controlled by the RUN input, GOE input and the on chip protection circuits. SwBATT1 SwBATT2 5, 11 I I Switched Battery Supplies: Used as the reference level for the DACs, bias voltage for the second coils of the minor gauges, and the supply for the output buffers for the major and minor gauges. One supplies the major gauge drivers and related circuits, while the other supplies the minor gauge circuits. Both SwBATT inputs must be connected to the control transistor as the two inputs are not connected internally. SCLK 24 I Serial Clock: Used to clock data into and out of the STGD. Data is shifted MSB first. DATAIN 18 I Data In: Data is loaded on the rising edge of SCLK and is shifted in MSB first. DATAOUT 12 O Data Out: Is provided to permit the STGD to pass status information back to the controlling microcontroller, and to allow multiple devices to be connected in series. ST 25 O Status Output: This is an open drain output. Status outputs from several devices may be wire OR’ed together. This output is low when the outputs are disabled due to a fault condition. The outputs may be disabled due to shorted outputs, over temperature, power up reset, or the GOE control pin and this condition is reflected on the ST pin. The outputs will also be disabled due to an over voltage condition, however this is not reported on the ST pin as over voltage should be a transient condition. CS 19 I Chip Select: Active high chip select input. When CS is high, the part is enabled to receive data on the DATAin pin and output data on the DATAout pin. A low to high transition of CS captures device status in the shift register for output. A high to low transition of CS loads gauge data from the shift register into the data latches. SIN+ 1 O Sine Positive: Driver output to sine coil of major gauge, positive side. SIN– 28 O Sine Negative: Driver output to sine coil of major gauge, negative side. COS+ 27 O Cosine Positive: Driver output to cosine coil of major gauge, positive side. COS– 26 O Cosine Negative: Driver output to cosine coil of major gauge, negative side. C1+ 16 O Coil 1 Positive: Driver output to driven coil of minor gauge 1, positive side. C1– 17 O Coil 1 Negative: Driver output to driven coil of minor gauge 1, negative side. C2+ 15 O Coil 2 Positive: Driver output to driven coil of minor gauge 2, positive side. C2– 14 O Coil 2 Negative: Driver output to driven coil of minor gauge 2, negative side. COM 13 O Common: Driver output for junction of bias coils for minor gauges. This output is regulated to half of SwBATT. ABSOLUTE MAXIMUM RATINGS SYMBOL VBATT PARAMETER RATING UNIT 40 V VIN1 Input voltage; Data In, CS, SCLK, GOE –1 to +7 V VIN2 Input voltage; SwBATT –1 to +24 V VIN3 Input voltage; RUN, with recommended RC Circuit –1 to +40 V PD Power Dissipation (Tamb = 105°C) SO-28 Package Battery supply voltage, with recommended 1K series resistor 1400 mw Ambient operating temperature –40 to +105 °C TJ Junction temperature1 +150/+160 °C θJA Thermal Impedance See Thermal Management Section °C/W Tamb NOTE: 1. 160°C junction temperature is permitted during high battery (>16V) fault operation 1998 Apr 03 3 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ Á ÁÁÁÁ ÁÁÁ Á ÁÁÁ ÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ Á ÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ Á ÁÁÁÁ ÁÁÁ ÁÁÁÁ Á ÁÁÁ ÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁ DC ELECTRICAL CHARACTERISTICS VBATT = 8.0 to 16V; Tamb = –40 to +105°C SYMBOL LIMITS PARAMETER TEST CONDITION Battery supply voltage Normal operating range 8 Switched battery supply voltage Normal operating range 7.5 16 V Battery supply current, operating VBATT = VBATTMAX RL = RLMIN 0.5 ma ISWBATT Switched battery supply current, operating Normal operating range 400 ma IBATTSB Battery supply current, standby VBATT = 12 V 60 µA VOH1 Output high voltage DATAOUT, IOH = 300µA 4.0 V VOH2 Output high voltage SwCONTROL, IOH = 10µA 40 V Off state output current ST, VOH = 5 V 25 µA Output low voltage ST, DATAOUT, IOL = 1.5 mA 0.4 V IOL = 50 mA @ VBATTMAX 1.5 V IOL = 20 mA @ VBATTMIN 1.2 V VBATT VSWBATT IBATT IOH VOL1 MIN TYP MAX 16 UNITS V SwCONTROL, VOL2 Output low voltage VIH Input high voltage CS, SCLK, DATAIN, GOE, RUN VIL Input low voltage CS, SCLK, DATAIN, GOE, RUN Battery overvoltage shutdown voltage VBATT IIH Input high current CS, SCLK, DATAIN, RUN GOE; VIH = 3.5 IIL Input low current CS, SCLK, DATAIN, RUN GOE; VIL=1.5 VOVSD 3.5 V 18 1.5 V 23 V 10 µA 10 µA ACC1 Output function accuracy, major gauge RL = RLMIN; major gauge, G1 –0.5 +0.5 Deg ACC2,3 Output function accuracy, minor gauges RL = RLMIN; minor gauges, G2 & G3 –1.0 +1.0 Deg VDRIVE1 Coil drive voltage, major gauge 68 71 78 % SwBATT VDRIVE2,3 Coil drive voltage, minor gauges 70 74 80 % SwBATT RLMIN Minimum coil load resistance Tamb = 105°C Tamb = 25°C Tamb = –40°C VCOM Minor gauge bias voltage IOB (Source or Sink) RL = RLMIN Ω Ω Ω 226 171 127 0.475 × SwBATT 0.525 × SwBATT V AC ELECTRICAL CHARACTERISTICS VBATT = 7.5 to 16V; Tamb = –40 to +105°C SYMBOL PARAMETER TEST CONDITION LIMITS MIN TYP MAX 625 UNITS tCYC Clock cycle time FSCLK Clock frequency tSCLKL SCLK LOW time 175 ns tSCLKH TCYC ns 1.60 MHz SCLK HIGH time 175 ns tCSH CS high to SCLK high time 75 ns tCSL SCLK low to CS low time 75 ns tSU DATAIN setup to SCLK high time 75 ns tHD SCLK high to DATAIN hold time 75 ns tDR DATAOUT rise time 0.8 to 3.6V; CL = 90pF 75 ns tDF DATAOUT fall time 3.6 to 0.8V; CL = 90pF 75 ns 1998 Apr 03 4 Philips Semiconductors Product specification Serial triple gauge driver (STGD) J1850 PROTOCOL CONTROLLER SA5778 4 80C51 MICRO– CONTROLLER SERIAL SA5778 SERIAL TRIPLE GAUGE DRIVER AU5780 J1850 VPW TRANSCEIVER J1850 BUS 360° MAJOR GAUGE GOE 2 112° MINOR GAUGE 2 RUN IGNITION ADDITIONAL GAUGE DRIVERS; SA5775A OR SA5777A PROTECTED BY SA5778 VBATT SR01118 Figure 3. System Connections for the STGD FUNCTIONAL DESCRIPTION Figure 1 shows the pin-out of the STGD, which is packaged in an SO-28 pin package, enhanced for improved thermal management. Four pins on each side of the package serve as a heat spreader to remove heat from the die, and also function as the ground connection. The recommended mounting includes an area of copper on the PC board to aid in thermal management. DATAOUT SCLK Figure 2 is a block diagram of the STGD. A serial interface connects the STGD to the microcontroller. A data output pin is provided to permit the STGD to be wired in series with other Philips air core gauge drivers such as the Serial Gauge Driver, SA5775, and the Dual Gauge Driver, SA5777 or additional STGDs. Status information may be passed back to the microcontroller via a status output, or via the serial interface. DATAIN SCLK PORT N CS DATAIN DATAOUT INT 5V ST DATAIN SCLK CS ADDITIONAL GAUGE DRIVER(S), SA5775A, SA5777A OR SA5778 DATAOUT Figure 3 shows the connection of the STGD in a typical application. ST SR01119 APPLICATION INFORMATION Figure 4. Serial Communications Between STGD, Microcontroller and Other Gauge Drivers Figure 4 demonstrates the connections between the STGD, the microcontroller, and optionally additional gauge drivers such as the SGD and DGD. With an active high on the chip select input (CS), data is shifted into the STGD through DATAIN on the rising edge of SCLK. Several gauge drivers may be wired in series using a common chip select and clock line, when more than three gauges are needed. The DATAOUT pins are cascaded to the DATAIN pins of the following gauge drivers. Status information can be returned to the microcontroller via the ST pins of each gauge driver. These are open-drain, active low outputs, which may be wire OR’ed together to signal that a fault, such as a thermal shut down, has occurred within one of the gauge drivers. This pin may be connected to a microcontroller port pin for polling in software, or may be connected to an external interrupt input to cause entry into an interrupt service routine. The STGD, may also pass status information back to the microcontroller serially. The rising edge of chip select loads status information into the shift register for the first four bits that will be shifted out of the STGD by the shift clock. Figure 11 shows the data bits within the shift register. A low on the ST pin signals that one or more status bits have been set in the status register. A high indicates all status bits are reset. The status output bits include minor gauge over current, major gauge over current, thermal shutdown and RUN. Gauge data is captured in latches by the falling edge of the chip select. 1998 Apr 03 SA5778 SERIAL TRIPLE GAUGE DRIVER MICROCONTROLLER Figure 5 shows the gauge connections to the STGD. The major gauge, G1, supports full 360° operation with two coils driven. The seven least significant bits of the gauge information are converted to an analog level by digital-to-analog converter. The display range is divided into eight sections, two sections per quadrant. The coils are driven with a Sine/Cosine approximation. The three most significant bits of gauge display information control the multiplexer to select which coil is fed by the DAC and which coil receives a fixed bias. The multiplexer also determines the polarity of the voltages supplied to the coils. The minor gauges, G2 and G3, each have one coil driven by a DAC. The other coils of each gauge are wired in series with the switched battery supply to supply the bias. The switched battery supply is turned off during over voltage conditions. Only 9-bits of information are required for the minor gauges, however, 10-bits are shifted through the part to maintain compatibility with the SGD and DGD. Hence, all gauges, both major and minor, are supplied with 10-bit data for consistency. 5 Philips Semiconductors Product specification Serial triple gauge driver (STGD) DATAIN SA5778 placed in a standby mode with a low on both the GOE and RUN input pin. In this mode, battery current drain is minimized. DATA / STATUS SHIFT REGISTERS DATA OUT SCLK STATUS LATCH ST The SwBATT1 and SwBATT2 inputs are the supply for the DACs, and the output buffers driving the coils including the COM output which stabilizes the voltages applied to the bias coils of the minor gauges. Both SwBATT1 and SwBATT2 should be connected to the collector of the control transistor as these inputs are not connected internally and supply different portions of the circuit. This switched battery supply is protected from voltages exceeding the specified operating range and is controlled by the SwCONTROL output. This supply may optionally be used to supply additional circuits which operate from unregulated battery supplies but which need protection from over voltage transients. Typical devices which may benefit from this protection include the Serial Gauge Driver, SA5775A and Dual Gauge Driver, SA5777A, which are often used in conjunction with the STGD in 4 and 5 gauge applications. DATA LATCHES CS GOE 112° MINOR GAUGES SIN+ SIN– COS+ COS– GND C1– C1+ COM C2– SwBATT TRANSISTOR C2+ SwBATT2 SwBATT1 VBATT SwControl DIGITAL-to-ANALOG CONVERTERS and OUTPUT MULTIPLEXERS ENABLE THERMAL PROTECTION SwBATT, BIAS RUN This switched battery supply is turned off when the STGD enters the standby mode in response to the RUN and GOE inputs both being low, or a VBATT supply exceeding the specified operating range. The switched battery supply depends on the RUN signal to prevent undesired needle movement on the minor gauges when going from standby to active mode. This movement would otherwise occur if the voltage to the fixed bias coils of the minor gauges was switched on before the coil voltages provided by the DACs within the STGD were defined. The start up jump is prevented as follows. In the sleep mode the switched battery supply is off, and the gauge drive outputs of the STGD are in a high impedance state. The gauges are in their zero position from the previous power-down sequence. When the RUN input goes high, but the GOE is kept low, the STGD enters the start up mode in which the minor gauges are driven to zero, the internal 5V regulator for the logic is turned on, and the switched battery supply is turned on to supply the bias coil and STGD output buffers. However, the output buffers for the major gauge remain in the high impedance output state. The microcontroller may load values into the STGD via the serial interface while GOE is low. When the microcontroller applies a high to GOE, the major gauge output buffers are enabled. When the RUN signal is removed the STGD continues to operate in the normal mode, however, the controlling microcontroller should also monitor RUN and, when it goes low, send a series of values to the STGD to move the needles to their zero positions before taking GOE low to put the part in the standby mode. 360° MAJOR GAUGE SR01120 Figure 5. Gauge Connections to the STGD 18-24V REFERENCE VBATT 5V REGULATOR + 5V LOGIC – OUTPUT BUFFER SUPPLY 1KΩ DAC REFERENCES GOE SwControl RUN SwBATT1/2 10KΩ RB VBATT BIAS COILS EXTERNAL GAUGE DRIVERS SR01121 Figure 6. Gauge Enable/Standby Circuit and Over Voltage Protection Circuit Figure 6 shows the protection and gauge enable logic for the STGD. The battery supply voltage VBATT is monitored, and if the supply exceeds the specified operating range, the STGD is put in a shutdown mode in which the output buffers are disabled. The STGD will also enter the shutdown mode by excessive die temperature, and will return to normal operation when the die temperature decreases to within specified limits. Thermal shutdown may occur at VBATT supply voltages over 16V at high ambient temperatures near 105°C. Internal logic will continue to function and status may be read out to determine the source of the shutdown. The STGD may be 1998 Apr 03 Table 1 describes the operation and control of the SwBATT supply, the output buffers, and the operations normally performed by the microcontroller. Normal operation of a vehicle will follow the sequence of the truth table from top to bottom. The RUN input is typically connected to the switched ignition voltage, while GOE is controlled by the microcontroller. 6 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ Table 1. Truth Table RUN Input 1=High GOE Input 1=High SwControl 1=ON Swbatt1,2 Voltage Minor Gauge Driver Outputs Major Gauge Driver Outputs 0 0 0 Off High Impedance High Impedance Standby mode 1 0 1 VBATT Enabled (output forced to zero) High Impedance Start up mode, sets minor gauge driver to zero position, and disables major gauge driver. Load values into STGD via the serial port. 1 1 1 VBATT Enabled Enabled Normal Operating mode. Periodically update gauge data as required by the application. 0 1 1 VBATT Enabled Enabled Power down sequence. Load a series of values into the STGD to return needles to zero before power is removed. 0 0 0 Off High Impedance High Impedance Returned to standby mode (same as first row of table) The actual value used is dependent on the current needed to keep the PNP in saturation. THERMAL MANAGEMENT AND POWER DISSIPATION All gauges at 45° to a quadrant axis, as this is the highest internal power dissipation position. If only the nominal coil resistance is known at a given nominal ambient temperature such as 25°C, the coil operating resistance at a high temperature ambient may be calculated using the following formula: The power dissipated by the STGD has three components. The first term in the equation below represents the power dissipated in the STGD from current through the coil resistance. This component of the power dissipation is a function of both the battery voltage and the coil resistance. Most of the external loads such as the coils are resistive, so the current drawn by the output buffers is proportional to the supply voltage, resulting in power dissipation that is proportional to the square of the supply voltage for these circuits. RCA = RCN (1+(0.4%/°C)*((TSH+Tamb)–25°C)) Where: The highest power dissipation for a given coil driver will occur when the coil voltage is being driven to 50% of VBATT. Thus the power dissipated by each coil driver is (VBATT/2)* (VBATT/2Rc) or VBATT(VBATT/4Rc). If the coil resistance of the two minor gauge coils and the two coils of the major gauge all have the same resistance, then the maximum total power dissipation of the drivers becomes 4*VBATT(VBATT/4Rc) or simply VBATT(VBATT/Rc). Much of the internal analog circuits appears to the supply pins as a current sink and is represented by the second term. The current drawn by these circuits is relatively constant despite changes in supply voltage, resulting in power dissipation that is proportional to the supply voltage. Finally some power is dissipated in driving the external PNP transistor used to control the switched battery supply. The total power dissipation is a combination of these components and may be calculated from the formula: RCA = Resistance of Coil at Ambient temperature, including self heating RCN = Nominal Resistance of Coil at 25°C, without self heating Tamb = Ambient temperature, °C TSH = Self heating of coil, °C 0.4%/°C = Resistance increase coefficient for copper Figure 7 shows power dissipation plotted as a function of coil resistance and voltage. Since coil resistance is a function of temperature, the maximum power dissipation plotted will only occur at the lowest specified operating temperature. The power dissipation is lowest at the highest ambient temperature because of the increase in coil resistance with temperature. This maximum power dissipation will only occur during a fault condition in which the system voltage rises to 18V, generally because of a failed voltage regulator controlling the vehicles battery voltage. Power dissipation will be lower when air core meter movements with higher nominal coil resistance are used. PD=VBATT(VBATT/RC)+VBATT(0.012) + VOL2(VBATT–VOL2–VBE(PNP))/RB Where: PD = Power dissipation in watts VBATT = Battery supply voltage in volts RC = Coil resistance in ohms at ambient temperature including any self heating effects VOL2 = Output low voltage of the SwCONTROL pin as specified in the DC Characteristics VBE(PNP)= The VBE drop of the external PNP transistor RB = Resistor is series with base of external PNP transistor. The minimum value of RB = VBATTMAXIOL=16/0.050=320 Ω 1998 Apr 03 System Status 7 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 125 3.0 POWER (W) POWER DISSIPATION FOR COIL RESISTANCE IN OHMS AND OPERATING BATTERY VOLTAGE 2.5 150 175 2.0 235 325 1.5 LOAD RESISTANCE (Ω) 1.0 0.5 18 17.5 17 16.5 16 15.5 15 14.5 14 13.5 13 12.5 12 11.5 11 10.5 10 9.5 9 8.5 8 7.5 0.0 VSWBATT (V) SR01430 Figure 7. Power Dissipation of the STGD as a Function of Coil Resistance and Operating Voltage Figure 8 shows the thermal resistance of the STGD mounted on a PC board with heat-sinking copper on the component side only. Figure 9 is a similar plot for a two sided PC board (same size copper areas on each side). Both plots assume a 60 x 60 x 1.57 mm FR4 board with varying square-shaped sizes of 2 oz. copper. The two sided board also assumes 8 thermal bias with 0.36 mm2 cross section. The STGD is specified to operate up to VBATTmax. The over voltage shutdown circuit will turn off the output buffers and the switched battery supply when the battery voltage reaches VOVSD. Over temperature conditions will also cause the output buffers to be disabled. The STGD employs a thermally enhanced SO-28 package. The center four pins on each side are fused to the die pad to create a path for removal of heat from the package to the copper foil on the PC board. An area of copper foil is required on the PC board for heat dissipation at higher power dissipation levels. It is important to note that at such a high ambient temperature (worst case of 105°C assumed), radiation is just as significant as convection in the dissipation of heat. Good radiation is highly dependent on the emissivity of the heated surface, so the thermal radiation properties of the copper foil should be considered. Bare, clean copper is a good thermal conductor, but it has a low emissivity, and is therefore a bad radiator. It is recommended that the copper areas intended for heat dissipation be left covered with solder mask or otherwise blackened to increase the emissivity, thereby improving the heat radiating ability of the board. In order to determine the size of the copper foil required, both thermal testing and thermal modeling were used. The effective ΘJA (thermal resistance, junction to ambient) was determined using both single and double sided PCBs with heat-sinking copper foil areas. Figures 8 and 9 show the effect of PCB copper foil area on the effective thermal resistance of the STGD part/PCB system. 1998 Apr 03 8 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 50 ΘJA (°C/W) 45 40 1.4W LIMIT 35 30 25 0 500 1000 1500 2000 2500 3000 3500 PCB COPPER HEAT SINK AREA (SQ mm) SR01497 Figure 8. θJA for SO28 with 8 Fused Pins One-sided PCB (2 oz. Copper), e = 0.9, Tamb = 105°C, P = 1.4–1.8W 45 ΘJA (°C/W) 40 1.4W LIMIT 35 30 25 0 500 1000 1500 2000 2500 3000 PCB COPPER HEAT SINK AREA (SQ mm) SR01498 Figure 9. θJA for SO28 with 8 Fused Pins Two-sided PCB (2 oz. Copper), e = 0.9, Tamb = 105°C, P = 1.4–1.8W 1998 Apr 03 9 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 From Figure 8, the copper area required, using a single sided board, to keep the junction temperature within limits is approximately 2200 mm2. Figure 9 shows 1200 mm2 is required on each side of a double-sided board. Sample Calculations for Power Dissipation and Thermal Management Worst Case Example The worst case example will occur when the STGD is operating at VBATTMAX (16V, in the highest specified ambient temperature (105°C), and with the lowest specified coil resistance (171 ohms at 25°C). Typical coil self heating of 15°C is assumed. The above example illustrates the worst case situation of the STGD operating in at a maximum battery voltage, with the lowest nominal coil resistance (171Ω at room temperature), and at the highest ambient temperature. This will produce the highest junction temperature. At lower ambient temperatures the power dissipation may be higher because the coil resistance is decreased, however the junction temperature will be lower. Calculation of Coil resistance operating at 105°C ambient. R CA= RCN (1+(0.4%W/°C)*((TSH+Tamb)–25°C)) = 171 x(1+(0.4%((15+105)–25))) Serial Interface = 236 Ohms at Tamb=105°C, with 15°C of self heating. Figure 10 demonstrates the serial interface timing referenced in the AC specifications. Figure 11 shows the order of information transfer through the serial interface. On a low to high transition of the CS pin, status information replaces the four most significant bits of data in the shift register and are the first bits shifted out. Output data is changed on the falling edge of SCLK, while input data is captured on the rising edge of SCLK. Major gauge data is loaded first, starting with the most significant bit, followed by minor gauge 1 data then minor gauge 2 data. Calculation of STGD power dissipation at 16 volt operation. PD = VBATT (VBATT/RC) + VBATT (0.012) +VOL2 (VBATT – VOL2 – VBE(PNP)) / RL = 16(16/236)+16(0.012)+1.5(16–1.5–0.5)/320 = 1.085+0.192+0.066 Watts = 1.34 Watts Required board area and Junction Temperature calculation The maximum junction temperature desired is 150°C. The permissible temperature rise and required ΘJA may be calculated as: ∆T = Tj–Tamb ΘJA = ∆T/PD Where; ∆T = Temperature rise in °C PD = Power dissipation Tj = Junction Temperature Tamb = Ambient Temperature ∆T = TJ–Tamb = 150 – 105 = 45°C ΘJA = ∆T/PD=55°C/1.34 watts = 33°C/W. tCYC tCF tCR tCSL tCSH 1 SCLK 29 tSCLKL CS tSCLKH 30 CLOCK CYCLES DATAIN D29 D1 tSU D0* tHD tDF tDR DATAOUT 30 S4 D1* D0* SR01499 Figure 10. Serial Interface Timing 1998 Apr 03 10 Philips Semiconductors Product specification Serial triple gauge driver (STGD) MINOR GAUGE 2 DATA IN SA5778 MINOR GAUGE 1 MAJOR GAUGE/STATUS D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 LSB MSB LSB MSB LSB DATA OUT MSB During Read out: D26: RUN Input State; 1 = RUN input high 0 = RUN input low D27: Thermal Shutdown; 1 = Shutdown 0 = Normal operation D28: Minor Gauge Over Current; 1 = Over Current Shutdown 0 = Normal operation D29: Major Gauge Over Current; 1 = Over Current Shutdown 0 = Normal operation SR01123 Figure 11. Internal Shift Register 15 COS DIFFERENTIAL OUTPUT VOLTAGE 10 SIN 5 0 0 127 255 383 511 639 767 895 1023 –5 –10 –15 INPUT CODE SR01500 Figure 12. Major Gauge Output Voltages (VSWBATT = 14V) 1998 Apr 03 11 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 14.00 12.00 10.00 8.00 C+ – C– (VOLTS) 6.00 4.00 2.00 0.00 31 –2.00 63 95 127 159 191 223 255 287 319 INPUT CODE –4.00 –6.00 –8.00 –10.00 –12.00 –14.00 SL00462 Figure 13. Typical Minor Gauge Output Voltage vs. Input Code (VSWBATT = 14V) ASSUMING CODE 0 IS 0°: 0.5 x VSWBATT CODE –56° +56° 0.744 x VSWBATT –0.744 x VSWBATT TOTAL SPAN = 112.15° STEP SIZE = 0.35° POSITION 0 –56.097 31 –45.194 63 –33.940 95 –22.685 127 –11.430 159 –0.176 191 11.079 223 22.333 255 33.588 287 44.843 319 56.097 IDEAL ANGLE(DEGREE)=CODE/319*2* ArcTan (0.744/0.5)–ArcTan(0.744/0.5) SR01501 Figure 14. Minor Gauge Total Span 1998 Apr 03 12 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 120 100 ANGLE (DEGREES) 80 60 40 20 0 0 15 31 41 63 79 95 111 127 159 175 143 INPUT CODE 191 207 223 239 255 271 287 303 319 SL00464 Figure 15. Meter Position (degrees) vs. Input Code for Minor Gauges 1998 Apr 03 13 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 SO28: plastic small outline package; 28 leads; body width 7.5mm 1998 Apr 03 14 SOT136-1 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 NOTES 1998 Apr 03 15 Philips Semiconductors Product specification Serial triple gauge driver (STGD) SA5778 Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Date of release: 04–98 Document order number: 1998 Apr 03 16 9397 750 03715