[Q)~u~
~[}{]~~¥
.
Product specification
File under Integrated
Philips
Semiconductors
November 96
Circuits,
ICO1
re
Philips Semiconductors
Brushless
Product specification
DC motor
drive
circuit
TDA5241
FEATURES
.Full-wave
.Built-in
commutation
start-up
.Optimum
flyback
.Three
push-pull
-0.85
.Thermal
drivers
at the output stages)
without
position
sensors
independent
on motor type or motor loading
diodes
outputs:
A output
-built-in
push/pull
circuit
commutation
.Built-in
.Low
(using
current
current
limiter
protection
current
.Tacho
consumption
output without
..Comparator
by adaptative
extra sensor.
for external
.Built-in
multiplexer
base-drive
position
combining
generator
internal
(PG) signal
FG and external
PG signal on one pin for easy use with a controlling
microprocessor
.Linear
.PG
control
of the output
stages
signal output.
APPLICATIONS
.General
purpose
spindle
driver ( e.g. VCR scanner
motor).
GENERAL DESCRIPTION
The TDA5241 is a bipolar integrated circuit used to drive brush less DC motors in full-wave mode. The device senses the
rotor position using an EMF-sensing technique and is ideally suited as a drive circuit for VCR scanner motors.
QUICK
~
REFERENCE
Measured
DATA
over full voltage
and temperature
SYMBOL
PARAMETER
supply
Yp
I cu!rent
IUM
I oU~Ut
Yo
ranges
voltage
MIN.
0.6
at 10 = 100
mA(Upper+Lower
transistor)
v
0.85
~
A
0.93
~
V
Note
1.
An unstabilized
supply
can be used;
Transients
of 2 V allowed
2/19
UNIT
MAX.
4
range (note 1 }
limiting
voltage
TYP.
with max slope 0.1 V/J.ls.
Philips Semiconductors
Brushless
Product specification
DC motor drive circuit
TDA5241
ORDERING INFORMATION
.
.
Fig.1
March 1997
Power derating
3/19
curve .
Philips Semiconductors
8
Product specification
Brushless DC motor drive circuit
TDA5241
BLOCK DIAGRAM
March 1997
4/19
Philips Semiconductors
Product
Brushless DC motor drive circuit
specification
TDA5241
PINNING
SYMBOL
GND1
1
ground (0 V) motor supply return for output stages
n.c.
2
not connected
MOT2
3
driver output 2
Vp
4
Dositive suDDlv voltage
PGIN
8
DESCRIPTION
PIN
position generator: input from the position detector sensor to the position detector
5
FGPG
6
stage (optional)
FG/PG (open collector)
GND2
7
ground supply return for control circuits
PGOUT
8
position generator output of the position detector stage
CAP-CDM
9
external capacitor connection for commutation delay timing
CAP-CDS
10
external capacitor connection for commutation delay timing copy
CAP-ST
11
external capacitor connection for start-up oscillator
CAP- TI
12
external capacitor connection for timing
CTLIN
13
non-inverting input of the control amplifier
MOTO
14
input from the start point of the motor coils
CAP-CPC
15
external capacitor for stability of control loop
MOT3
16
driver output 3
n.c.
17
I not
MOT1
18
I driver
connected
output
1
18
MOT1
n.c
17
n.c
MOT2
16
MOT3
Vp
15
CAP-CPC
14
MOTO
13
CTLIN
12
CAP- TI
GND1
u
.
PGIN
10
FGPG
6
GND2
7
PGOUT
CAP-CDM
I
TDA5241
18
19
Fig.3 Pin configuration.
March
1997
5/19
111
CAP-ST
110
CAP-CDS
Philips
Product specification
Semiconductors
Brushless
TDA5241
DC motor drive circuit
FUNCTIONAL DESCRIPTION
The TDA5241 offers a sensorless three phase motor drive function. It is unique in its combination of sensorless motor
drive and full-wave drive.
The TDA5241 offers protected outputs capable of handling high currents and can be used with star or delta connected
motors. It can easily be adapted for different motors and applications.
The TDA5241 offers the following features:
.Sensorless
.Built-in
commutation by using the motor EMF
start-up circuit
.Optimum
.Built-in
commutation, independent of motor type or motor loading
flyback diodes
.Three
phase full-wave drive
..High
output current (0.85 A)
.Outputs
.Low
protected by current limiting and thermal protection of each output transistor
current consumption by adaptive base-drive
.Accurate
frequency generator (FG) by using the motor EMF
.Comparator
.Built-in
for external position generator (PG) signal
multiplexer combining internal FG and external PG signals on one pin for easy use with a controlling
microprocessor
.Linear
control of the output stages.
LIMITING
VALUES
In accordance
with the Absolute
Maximum
Vp
supply voltage
VI
input voltage;
1
0
Vo
(IEC 134).
PARAMETER
SYMBOL
8
Rating System
I 18
-0.3
V p + 0.5
.5
output voltage; PGOUT and PG/FG
GND
Vp
output voltage;
-1
Vp + Vo
all pins except
MOTO, MOT1,
Vp (VI < 8 V)
MOT2 and MOT3
UNIT
MAX.
MIN.
VI
input voltage; CAP-ST, CAP- TI, CAP-CD and CAP-DC
2.5
Ptot
total power dissipation
see power
v
v
v
v
v
derating
curve
storage temperature range
~
I operating
Tamb
March
1997
ambient
temperature
~
range
1-10
6/19
+150
loc
+70
~
Philips Semiconductors
Product specification
Brushless DC motor drive circuit
TDA5241
CHARACTERISTICS
VP = 14.5 V "10%; Tamb = –10 °C to 70 °C, unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VP
Supply voltage range
note 1
4
–
18
V
IP
Input current range
note 2
–
5.3
7
mA
130
140
150
°C
–
TSD–30
–
°C
Supply
Thermal protection
TSD
Local temperature at temperature
sensor causing shut–down
DT
Reduction in temperature
before switch–on
after shut–down
MOT0 – CENTER TAP
VI
Input voltage range
–0.5
–
VP
V
II
Input bias current
0.5 V<VI <VP–1.5 V
–10
–
–
mA
VCSW
Comparator Switching Level
note 3
20
30
40
mV
DVCS
Variations in comparator switching
levels
–3
0
+3
mV
VH
Comparator input hysteresis
–
75
–
mV
V
MOT1, MOT2 AND MOT3
Voltage drop at 25 °C
IO = 100 mA
–
0.93
1.05
(Vout upper stage + Vout lower stage)
IO = 500 mA
–
1.65
1.9
DVOL
Variation in voltage between lower
transistors
in control mode;
IO = 100 mA
–
–
150
mV
DVOH
Variation in voltage between upper
transistors
in control mode;
IO = –100 mA
–
–
150
mV
ILIM
Current limiting
12 V/6.8W
0.6
0.85
1
A
VDHF
Diode forward voltage (DH)
notes 4 and 5; see Fig. 2;
IO = –500 mA
–
–
1.5
V
VDLF
Diode forward voltage (DL)
notes 4 and 5; see Fig. 2;
IO = 500 mA
–1.5
–
–
V
IDM
Peak diode current
note 5
–
–
1
A
0
–
VP
V
VDO
CTL IN
VCTLIN
Input voltage range
VCTLIN0
Offset voltage
See Fig. 6
VCAPCPC v 1.1 V
0.7
–
–
V
GTRAN
Transfer gain
CAP–CPC = 100 nF
VCTLIN = 1.5V and
VCTLIN = 3 V
4.5
5
5.5
V/V
PG IN
VI
Input voltage range
–0.3
–
+5
V
IB
Input bias current
–
–
650
nA
RI
Input resistance
5
–
30
kW
VCSW
Comparator switching level
86
93
107
mV
+/–VIAMP
Comparator input hysteresis
–
8
–
mV
March 1997
7/19
Philips Semiconductors
Product specification
Brushless DC motor drive circuit
Symbol
Parameter
TDA5241
Conditions
Min
Typ
Max
Unit
IO = 1.6 mA
–
–
0.4
V
–
–
VP
V
–
0.5
–
ms
4
–
10
ms
–
–
0.4
V
–
–
VP
V
–
0.5
–
ms
Ratio of FG frequency and
commutation frequency
–
1:2
–
–
d
Duty factor
–
50
–
%
tPL
Pulse width LOW
5
7
15
ms
PG OUT (open collector)
VOL
Output voltage LOW
VOHmax
Output voltage HIGH
tTHL
Transition time
tPL
Pulse width LOW
HIGH-to-LOW;
CL = 50 pF;
RL = 10 kW
FG/PG (open collector)
VOL
Output voltage LOW
VOHmax
Maximum output voltage HIGH
tTHL
Transition time
IO =1.6 mA
HIGH–to–LOW
CL = 50 pF
RL = 10 kW
after a PG IN pulse
CAP–ST
II
Output sink current
1.5
2.0
2.5
mA
IO
Output source current
–2.5
–2.0
–1.5
mA
VSWL
Lower switching level
–
0.20
–
V
VSWM
Middle switching level
–
0.30
–
V
VSWH
Upper switching level
–
2.20
–
V
II
Output sink current
22
30
38
mA
IOH
Output source current HIGH
–70
–63
–56
mA
IOL
Lower source current LOW
–6.0
–5.3
–4.6
mA
VSWL
Lower switching level
–
50
–
mV
VSWM
Middle switching level
–
0.30
–
V
VSWH
Upper switching level
–
2.20
–
V
II
Output sink current
10.6
16.2
22
mA
IO
Output source current
–5.3
–8.1
–11
mA
II/IO
Ratio of sink to source current
1.85
2.05
2.25
VIL
Input voltage level LOW
780
860
940
mV
VIH
Input voltage level HIGH
2.3
2.4
2.55
V
CAP–TI
CAP–CDM
March 1997
8/19
Philips Semiconductors
Product specification
Brushless DC motor drive circuit
Symbol
Parameter
TDA5241
Conditions
Min
Typ
Max
Unit
CAP–CDS
II
Output sink current
10.1
15.5
20.9
A
IO
Output source current
–20.9
–15.5
–10.1
A
II/IO
Ratio of sink to source current
0.9
1.025
1.15
VIL
Input voltage level LOW
780
860
940
mV
VIH
Input voltage level HIGH
2.3
2.4
2.55
V
II
Output sink current
1
–
3
mA
IO
Output source current
–100
–
–30
CAP–CPC
NOTES:
1. An unstabilized supply can be used; transients of 2 V allowed with max slope 0.1 V/µs.
2. All other inputs at 0V; all outputs at VP and IO = 0 µA.
3. Switching levels with respect to MOT1, MOT2 and MOT3.
4. Drivers are in high impedance OFF–state.
5. The outputs are short–circuit protected by limiting the current and the IC temperature.
Fig. 4 Switching levels
March 1997
9/19
A
Philips Semiconductors
8
Brushless
APPLICATION
Product
DC motor drive circuit
specification
TDA5241
INFORMATION
Introduction
Figure 5 shows full-wave driving of a three phase motor requires three push-pull output stages. In each of the six possible
states two outputs are active, one sourcing and one sinking current. The third output presents a high impedance to the
motor which enables measurement of the motor EMF in the corresponding motor coil by the EMF comparator at each
output. The commutation logic is responsible for control of the output transistors and selection of the correct EMF
comparator.
The zero-crossing in the motor EMF (detected by the comparator selected by the commutation logic) is used to calculate
the correct moment for the next commutation, that is, the change to the next output state. The delay is calculated
(depending on the motor loading) by the adaptive commutation delay block.
Because of high inductive loading the output stages contain flyback diodes. The output stages are also protected by a
current limiting circuit and by thermal protection of the six output transistors.
8
The zero-crossings can be used to provide speed information such as the tacho signal FG. A VCR scanner also requires
a PG phase sensor. This circuit has an interface for a simple pick-up coil. A multiplexer circuit is also provided to combine
the FG and PG signals in time. The TDA 5240 is providing 1 multiplexed FG PG signal: pin7 (8020) FG-PG 3 times the
number of pole pairs. A PG output signal is generated; pulse width is typically 7 ~s.
Table 1
OUTPUT STATES
MOT1
MOT2
MOT3
1
Z
L
H
2
H
L
Z
3
H
Z
L
4
Z
H
L
5
L
H
L
Z
STATE
6
8
In Table1
, the
sequence
of the
six possible
states
-
H
of the outputs
8
March
1997
Z
10/19
has
been
depicted
Philips
Product
Semiconductors
Brushless
DC motor drive circuit
TDA5241
.
.
Fig.5 Typical application of the TDA5241.
March 1997
specification
11/19
Product specification
Philips Semiconductors
Brushless
DC motor drive circuit
TDA5241
Analog control of the motor output voltages is achieved by an internal operational amplifier which tranfer gain is internally
fixed. Compensation of the motor pole is done by an external capacitor (CAP CPC).
Both grounds GND1 and GND2 must be connected together.
ADJUSTMENTS
The system has been designed in such a way that the tolerances of the application components are not critical. However ,
the approximate values of the following components must still be determined:
.The
start capacitor; this determines the frequency of the start oscillator
.The two capacitors in the adaptive commutation delay circuit. These are important in determining the optimum moment
for commutation, depending on the type and loading of the motor
.The
timing capacitor; this provides the system with its timing signals
(This deals with the application note AN94070)
THE STARTCAPACITORS(CAP-ST)
This capacitor determines the frequency of the start oscillator. It is charged and discharged, with a current of 2 ~A, from
0.05 to 2.2 V and back to 0.05 V. The time taken to complete one cycle is given by:
tstart= (2.15 X C)s
(with C in ~F)
The start oscillator is reset by a commutation pulse and so is only active when the system is in the start-up mode. A pulse
from the start oscillator will cause the outputs to change to the next state (torque in the motor) .If the movement of the
motor generates enough EMF the TDA5241 will run the motor. If the amount of EMF generated is insufficient, then the
motor will move one step only and will oscillate in its new position.
The amplitude of the oscillation must decrease sufficiently before the arrival of the next start pulse, to prevent the pulse
arriving during the wrong phase of the oscillation. The oscillation of the motor is given by:
8
March 1997
12/19
Philips Semiconductors
Brushless
Product
DC motor drive circuit
specification
TDA5241
fosc
=
where:
Kt = torque
constant
I = current
p = number
(N.m/A)
(A)
of magnetic
pole-pairs
J = inertia J (kg/m2)
Example:
J = 72 x 10-6 kg/m2,
then a start frequency
K = 25 x 10-3 N.m/A,
of 2 Hz can be chosen
p = 6 and I = 0.5 A; this gives f osc = 5 Hz. If the damping
or t = 500 ms, thus C = 0.5/2 = 0.25 IlF, (choose
is high
220 nF).
THE ADAPTIVECOMMUTATION
DELAY(CAP-CDM AND CAP-CDS)
In this circuit capacitor CAP-CDM is charged during one commutation period, with an interruption of the charging current
during the diode pulse. During the next commutation period this capacitor (CAP-CDM) is discharged at twice the charging
current. The charging current is 8.1 IlA and the discharging current 16.2 IlA ; the voltage range is from 0.9 to 2.2 V. The
voltage must stay within this range at the lowest commutation frequency of interest, fc1:
c
=
8.1
-5
-~
:rx1:3
If the frequency
2.2 to 0.9 Vat
is lower, then a constant
commutation
(C
in nF)
-fC1
delay after the zero-crossing
is generated
by the discharge
16.2 J.lA.
maximum delay = (0.076 x C) ms (witch C in nF)
Example: nominal commutation frequency = 900 Hz and the lowest usable frequency = 400 Hz, so:
CAP-CDM = 6231
400=
15.6 (choose 18 nF)
The other capacitor, CAP-CDS, is used to repeat the same delay by charging and discharging with 20 ~A.
The same value can be chosen as for CAP-CDM. Figure 7 illustrates typical voltage waveforms
-Vmax=Vih
voltage
on
CAP-CD
-Vil
Fig.7
CAP-CD
and CAP-DC typical voltage waveforms
in normal
(ZCR = Zero-crossing
; COM = COMMUTATION)
8
March 1997
13/19
running
mode.
from
Philips
Product specification
Semiconductors
Brushless
DC motor drive circuit
TDA5241
THE TIMINGCAPACITOR(CAP- TI)
Capacitor CAP- TI is used for timing the successive steps within one commutation period; these steps include some
internal delays.
The most important function is the watchdog time in which the motor EMF has to recover from a negative diode-pulse
back to a positive EMF voltage (or vice versa). A watchdog timer is a guarding function that only becomes active when
the expected event does not occur within a predetermined time.
The EMF usually recovers within a short time if the motor is running normally ( « ms ). However, if the motor is
motionless or rotating in the reverse direction, then the time can be longer ( » ms ).
A watchdog time must be chosen so that it is long enough for a motor without EMF (still) and eddy currents that may
stretch the voltage in a motor winding; however, it must be short enough to detect reverse rotation. If the watchdog time
is made too long, then the motor may run in the wrong direction (with little torque).
The capacitor is charged, with a current of 5711A, from 0.2 to 0.3 V. Above this level it is charged, with a current of 5 I1A,
up to 2.2 V only if the selected motor EMF remains in the wrong polarity (watchdog function). At the end, or, if the motor
voltage becomes positive, the capacitor is discharged with a current of 28 11A. The watchdog time is the time taken to
charge the capacitor, with a current of 5 I1A, from 0.3 to 2.2 V. The value of CAP- TI is given by:
= 2.63
tm
(C in nF ; t in ms)
Example: If after switching off, the voltage from a motor winding is reduced, in 3.5 ms, to within 20 mV (the offset of the
EMF comparator), then the value of the required timing capacitor is given by:
C = 2.63 x 3.5 = 9.2 (choose 10 nF)
Typical voltage waveforms are illustrated by Fig. 8.
voltage
on CAP- TI
If the chosen
possible
value of CAP- TI is too small, then oscillations
that the motor may run in the reverse
direction
can occur in certain
(synchronously
positions
of a blocked
rotor. If the chosen
value
with little torque).
Fig.8 Typical CAP- TI and VMOT1 voltage waveforms in normal running mode.
8
March 1997
14/19
is too large, then it is
Philips Semiconductors
Brushless
Product
DC motor drive circuit
specification
TDA5241
OTHER DESIGN ASPECTS
There are other design
.Generation
.Built-in
aspects
concerning
the application
of the TDA5241
besides
the commutation
function.
They are:
of the tacho signal FG
interface
for a PG sensor
.Reliability.
FG SIGNAL
The FG signal is generated in the TDA5241 by using the zero-crossing of the motor EMF from the three motor windings.
Every zero-crossing in a (star connected) motor winding is used to toggle the FG output signal. The FG frequency is
therefore half the commutation frequency. All transitions indicate the detection of a zero-crossing (except for PG). The
negative-going edges are called FG pulses because they generate an interrupt in a controlling microprocessor.
8
The accuracy of the FG output signal Uitter) is very good. This accuracy depends on the symmetry of the motor's
electromagnetic construction, which also effects the satisfactory functioning of the motor itself.
Two FG frequencies are given out: 6 times the number of poles pairs or 3 times the number of poles pairs. A pull-up
resistor must be connected to PGFG outputs
Example: A three phase motor with 6 magnetic pole-pairs at 1500 rpm and with a full-wave drive has a commutation
frequency of 25 x 6 x 6 = 900 Hz, and generates a tacho signal of 450 Hz.
PG SIGNAL
The accuracy of the PG signal in applications such as VCR must be high (phase information. This accuracy is obtained
by combining the accurate FG signal with the PG signal by using a wide tolerance external PG sensor. The external PG
signal (PGIN) is only used as an indicator to select a particular FG pulse. This pulse differs from the other FG pulses in
that a ahort LOW-time of 15 /.ls after a HIGH to LOW transition. All other FG pulses have a 50% duty factor (see Fig. 9),
tolerance
PG IN
on PC IN
v!\v
v!\v
MOT3
PG / F G.S'-J~s-LJ~
Fig.9 Timing and the FG and PG IN signals.
March 1997
15/19
Philips
Product
Semiconductors
Brushless
DC motor drive circuit
specification
TDA5241
RELIABILITY
It is necessary to protect high current circuits and the output stages are protected in two ways:
.Current limiting of the 'lower' output transistors. The 'upper' output transistors use the same base current as the
conducting 'lower' transistor (+15%). This means that the current to and from the output stages is limited.
.Thermal protection of the six output transistors is achieved by each transistor having a thermal sensor that is active
when the transistor is switched on. The transistors are switched off when the local temperature becomes too high.
March 1997
16/19
Philips
Semiconductors
Brushless
Product
DC motor drive circuit
specification
TDA5241
PACKAGE OUTLINE
8
MSA259
Dimensions in mm
Fig.10
March 1997
PLASTIC
DUAL IN-LINE
PACKAGE;
17/19
18 LEADS;
SOT102RG4
Philips
Product specification
Semiconductors
Brushless DC motor drive circuit
TDA5241
SOLDERING
Introduction
There is no soldering method that is ideal for aIlIC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
"IC Package Databook"(order code 939865290011).
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the
printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between
50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
.A
double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique
should be used.
.The
longitudinal axis of the package footprint must be parallel to the solder flow.
.The
package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered
joints
Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less
than 24 V) applied to the flat part of the lead. Contact time must be limited to' 10 seconds at up to 300 °C. When using a
dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
March
1997
18/19
Philips Semiconductors
Product specification
Brushless DC motor drive circuit
TDA5241
Data sheet status
Data sheet status [1]
Product
status [2]
Definitions
Objective
specification
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be
published at a later date. Philips Semiconductors reserves the right to change the specification
without notice, in order to improve the design and supply the best possible product.
Product
specification
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply.
Changes will be communicated according to the Customer Product/Process Change Notification
(CPCN) procedure SNW-SQ-650A.
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Koninklijke Philips Electronics N.V. 1996
All rights reserved. Printed in U.S.A.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 11-96
For sales offices addresses send e-mail to:
[email protected].
Document order number:
yyyy mmm dd
1
9397 750 08755