INTEGRATED CIRCUITS DATA SHEET SZA1015 Brushless Motor Controller (BMC12) Product specification Supersedes data of 2000 Sep 19 File under Integrated Circuits, IC01 2001 Jul 11 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 It uses a 5 V supply for the internal control circuit and a 5 to 12 V supply for the motor driver. FEATURES • Direct full bridge driving system The switching PWM output is highly efficient resulting in a low power dissipation for forward torque acceleration as well as for reverse torque brake (PWM controlled reverse torque). • No external series resistor required in motor supply line • Adjustable output current up to 2.1 A (over 20X DVD and over 50X CD) • D-MOSFET output with a total on-resistance of 0.7 Ω (typical) Sensitive Hall sensor amplifiers with a very low offset are integrated which can operate on very small Hall signals. • PWM controlled commutation The current limiter circuit requires no external series resistor in the power ground which increases efficiency. The limiting current can be adjusted by means of an external resistor at pin RLIM (not in series with motor supply line). The current limiter is active during accelerating as well as during braking. • Internal compensation for EMF of motor (EMF regenerator) • Start/stop function with built-in power saving circuit • Hall amplifiers with a minimum input level of 25 mV • Built-in frequency generator (FG output) • Adjustable motor current limiter The EMF voltage of the motor is internally measured and is used to compensate for the PWM commutation. A scaling factor can be set by means of an external resistor at pin REMF. • Built-in thermal shutdown • Reverse torque brake function (full bridge) • Built-in reverse rotation protection circuit The tacho-generator can be used to measure the rotational speed of the disk. It shows the triple frequency of the Hall signals. • 32 mA Hall bias circuit • Few external components • Interfaces to 3 V and 5 V logic A thermal shutdown circuit with a small hysteresis protects the IC from overheating. • Package with very low thermal resistance from junction to heatsink (reflowable die pad). A heatsink at the bottom of the chip with a very low thermal resistance enables effective cooling. GENERAL DESCRIPTION The start/stop function reduces current consumption of the IC to a minimum when the motor is stopped (stop mode) and also turns off the Hall sensor bias in the stop mode. The BMC12 is a 3-phase Brushless Motor Controller (BMC) for Hall commutated spindle motors in CD and DVD drives suitable for DVD speeds over 20X and CD speeds over 50X. ORDERING INFORMATION TYPE NUMBER SZA1015TT 2001 Jul 11 PACKAGE NAME HTSSOP32 DESCRIPTION plastic, heatsink thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm 2 VERSION SOT549-1 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VDD supply voltage 4.5 5.0 5.5 V VDDM motor supply voltage 4.5 12.0 14.5 V IDDM motor current − − 2.1 A Rds(on) D-MOSFET on-resistance (high or low) − 0.35 − Ω Ptot total power dissipation − − 3.0 W Tamb ambient temperature 0 − 85 °C 2001 Jul 11 3 2001 Jul 11 EC 7 ECR 8 i.c. 9, 31 4 ADC DC 5 3 ROSC RLIM 32 + Σ + PWM 2 26 27 28 UP UN VP VN 25 29 30 WP WN 6 FG DC-DC CONVERTER VSSA 1 14 W 19 V MGT188 12 CAPY 11 CP2 10 CP1 15, 17, 20 GND POWER SWITCHES Brushless Motor Controller (BMC12) Fig.1 Block diagram. BIAS REVERSE BLOCKING COMMUTATION HALL AMPLIFIERS EMF REGENERATOR REMF 4 CURRENT LIMITER CURRENT REFERENCE SZA1015 DLIM COSC OSCILLATOR MUX INPUTS MUX REFERENCE 18 21 U 23 24 THERMAL SHUTDOWN VDDM 13, 16, 22 START VDD dbook, full pagewidth n.c. Philips Semiconductors Product specification SZA1015 BLOCK DIAGRAM Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 PINNING SYMBOL PIN DESCRIPTION VSSA 1 motor control ground supply BIAS 2 Hall element bias ROSC 3 external resistor for internal oscillator REMF 4 external resistor for EMF regeneration RLIM 5 external resistor for current limiting FG 6 frequency generator output EC 7 output current control pin ECR 8 output current control reference voltage pin i.c. 9 internally connected (leave open-circuit) handbook, halfpage VSSA 1 32 COSC BIAS 2 31 i.c. ROSC 3 30 WN REMF 4 29 WP RLIM 5 28 VN FG 6 27 VP EC 7 26 UN ECR 8 25 UP SZA1015 CP1 10 booster capacitor connection 1 i.c. 9 CP2 11 booster capacitor connection 2 CP1 10 23 START CAPY 12 booster output CP2 11 22 VDDM VDDM 13 motor supply voltage W 14 motor terminal W GND 15 ground supply VDDM 16 motor supply voltage GND 17 ground supply n.c. 18 not connected V 19 motor terminal V GND 20 ground supply U 21 motor terminal U VDDM 22 motor supply voltage START 23 start/stop control pin VDD 24 system supply voltage UP 25 positive Hall input U UN 26 negative Hall input U VP 27 positive Hall input V VN 28 negative Hall input V WP 29 positive Hall input W WN 30 negative Hall input W i.c. 31 internally connected (leave open-circuit) COSC 32 external capacitor for internal oscillator 2001 Jul 11 24 VDD CAPY 12 21 U VDDM 13 20 GND W 14 19 V GND 15 18 n.c. VDDM 16 17 GND MGT189 Fig.2 Pin configuration. 5 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 FUNCTIONAL DESCRIPTION Motor control handbook, halfpageVM1 The control input voltage EC is converted into a digital value (DC) by the ADC where voltage ECR is the midpoint reference for EC (see Fig.3). IMACC IMBR VRM (IM × + − I M =halfpage −I LIM handbook, reverse torque brake forward torque (−DC) (+DC) EC = 0 V − EC = ECR 2 ) VEMF 2 + V EMF 2 RM VRM (IM × ) 2 I M = +I LIM IM = 0 RM VM2 EC = 2 × ECR MGT191 Fig.4 Simplified motor schematic. MGT190 Fig.3 Motor control. The gain from input voltage (EC) to motor current (IM) is ILIM/ECR (A/V). The motor current can be determined with the following formula: I M handbook, halfpage VDDM VM1 VEMF I LIM = ----------- × ( E C – E CR ) E CR VM The maximum motor current ILIM is set by the motor current limiter. When the rotational speed of the motor has become zero the motor current is switched off and all driver outputs (pins U, V and W) are connected to ground. This prevents the motor of spinning backwards. VDDM 2 VRM 2 VRM VEMF k 2 VM2 Internal motor voltage generation ω (rad/s) The simplified motor schematic in Fig.4 shows the series resistance and back-EMF voltage of the motor. MGT192 Fig.5 Motor voltage when accelerating. If we assume that IMACC is used to accelerate and IMBR is used to brake we can draw two pictures shown in Figs 5 (accelerate) and 6 (brake). 2001 Jul 11 6 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 MGT194 100 handbook, halfpage handbook, halfpage VDDM % of I MAX VEMF 2 VM VRM VDDM 2 80 VM1 60 k VRM 40 VM2 VEMF 2 20 ω (rad/s) 0 MGT193 0 10 20 30 40 50 R LIM (kΩ) Fig.6 Motor voltage when actively braking. ROSC = 47 kΩ. Fig.7 The BMC12 regenerates VEMF and superimposes VM (0 ≤ IM ≤ ILIM) which depends on the EC (gain) input voltage. VRM (IM) can be positive (accelerate) or negative (brake). Maximum output current as a function of RLIM. The formula to determine the limiting current is as follows: R LIM I LIM = -------------- × I MAX R OSC Motor current limiting function The maximum motor current is determined with the V DDM following formula: I MAX = ------------------------------------------------------R motor + R switches(min) Back-EMF regeneration The back-EMF voltage is internally regenerated. The ratio between REMF and ROSC can be used to scale the internal EMF regeneration. The value of resistor REMF depends on the type of motor (k-factor, number of pole pairs) and the motor supply voltage used. This is shown in the following ILIM is a fraction of the maximum motor current IMAX. During accelerating and braking the motor current will not exceed the limiting current set by RLIM. 3 k × 2.6 × 10 × R OSC formula: R EMF = ----------------------------------------------------N PP × V DDM For noise reduction the Hall signals are internally filtered. 2001 Jul 11 7 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 FG generator Start/stop function The FG generator output shows a frequency which depends on the number of Hall signals (three) and the number of pole pairs (NPP). The formula to determine the At pin START = LOW, the BMC12 can be set to a power saving mode, reducing the current consumption. In the power saving mode the outputs will be in 3-state. FG motor frequency is as follows: f motor = -------------------3 × N PP DC-DC converter The on-board DC-DC converter generates a voltage of approximately 2 × VDDM − 1.2 V with a maximum voltage of 19.3 V typical (internal clamp circuit). This voltage is used internal to switch the upper drivers of the U, V and W outputs. The FG has an open-drain output for easy interfacing to 3 V and 5 V logic. Thermal shutdown The thermal shutdown block sets all outputs to 3-state mode if the junction temperature of the BMC12 exceeds 155 °C (typical). There is a hysteresis of 15 °C (typical) between the temperatures at which the thermal shutdown activates and deactivates. As soon as the thermal shutdown deactivates, the commutation control continues its operation. Oscillator The RC oscillator uses two external components (ROSC and COSC) to fix its frequency. To ensure a stable oscillator frequency the oscillator and ROSC both use a reference current made by the current reference block. The nominal frequency is 3 MHz with ROSC = 47 kΩ (2% tolerance) and COSC = 100 pF (5% tolerance). The values of the external components for the oscillator are fixed. The oscillator can be overruled by applying a 3 MHz clock to pin COSC (ROSC is used to determine ILIM and REMF and should always be connected). 2001 Jul 11 8 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) handbook, full pagewidth UP-UN WP-WN SZA1015 VP-VN (3) (1) 12 V (4) U 0V (2) 12 V V 0V 12 V W 0V MGT196 (1) In this example, a PWM output signal with a 25% duty cycle is drawn as a thin line. The average motor voltage (drawn with a thicker line width) is 25% × VDDM, i.e. 3.0 V. At the opposite side of the coil (in this drawing pin W) the duty cycle is 75%, so the average voltage on pin W is 9.0 V. The differential voltage over the motor pins then is: 9 − 3 = 6 V. (2) There is still a current flowing from pin U into the motor. The lower flyback diode starts conducting, and causes a flyback voltage of around 0.7 V below GND, until the current is zero. (3) There is still a current flowing from the motor into pin U. The upper flyback diode starts conducting, and causes a flyback voltage of around 0.7 V above VDDM, until the current is zero. (4) During this phase, the driver output is 3-state. Because there is no current flowing through pin U, the back-EMF of the motor is seen. Fig.8 Phase condition of Hall input and output voltage (motor running with EC > ECR). 2001 Jul 11 9 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER MIN. MAX. UNIT VDD supply voltage −0.5 +6.5 V VDDM motor supply voltage −0.5 +15 V IDDM motor current − 2.1 A Ptot total power dissipation − 3.0 W Tstg storage temperature −55 +150 °C Tamb ambient temperature 0 85 °C MGT197 4 handbook, halfpage Ptot (W) 3 2 1 0 0 50 100 Tamb (°C) 150 The IC is thermally connected with its heatsink to an external heatsink at ambient temperature, with a total thermal resistance of 35 K/W (10 K/W junction to case plus 25 K/W case to surrounding). Fig.9 Maximum dissipation as a function of the ambient temperature. THERMAL CHARACTERISTICS SYMBOL Rth(j-c) PARAMETER VALUE UNIT 10 K/W thermal resistance from junction to case CHARACTERISTICS VDD = 5 V; VDDM = 12 V; GND = 0 V; Tamb = 25 °C; ROSC = 47 kΩ, COSC = 100 pF; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDD supply voltage 4.5 5.0 5.5 V VDDM motor supply voltage 4.5 12.0 14.5 V IDDM motor current − − 2.1 A 2001 Jul 11 10 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SYMBOL PARAMETER SZA1015 CONDITIONS MIN. TYP. MAX. UNIT IDD supply current START = HIGH − 15 − mA IDD(q) quiescent current in power saving mode START = LOW − − 1 mA Ptot total power dissipation − − 3.0 W Tamb ambient temperature 0 − 85 °C Hall amplifier inputs (pins UN, UP, VN, VP, WN and WP) VIO input offset voltage −3.5 − +3.5 mV Vi input voltage range 0 − 4.0 V Vi(dif)(p-p) Hall amplifier input voltage (peak-to-peak value) 25 − − mV Hall elements bias (pin BIAS) Ibias bias current − − 32 mA Vbias bias voltage Ibias = 32 mA 0.1 − 0.5 V oscillator frequency note 1 − 3.0 − MHz 140 155 170 °C Oscillator fosc Thermal shutdown circuit TSD thermal shutdown operating temperature Power switches Rds(on) D-MOSFET on-resistance (high or low) VDDM = 12 V 0.25 0.35 0.50 Ω VDDM = 5 V 0.35 0.50 0.71 Ω booster output voltage note 2 19 19.3 19.6 V 1.2 1.8 2.5 V 0 − VDD V Booster VCAPY Torque control (pins EC and ECR) VECR reference voltage on pin ECR VEC torque control voltage on pin EC note 3 Digital input (pin START) VIH HIGH-level input voltage 2.0 − − V VIL LOW-level input voltage − − 0.8 V − − 0.5 V Open-drain output (pin FG) VOL LOW-level output voltage IO = 2 mA Notes f osc 1. The PWM frequency is: f PWM = -------33 2. Clamping level with VDDM = 12 V. 3. The maximum useful range of the control input voltage EC is 0 to 2 × ECR (midpoint reference voltage). When EC = ECR, then no torque is applied to the motor. The conversion characteristic does not have a ‘dead zone’. 2001 Jul 11 11 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 APPLICATION INFORMATION handbook, full pagewidth +12 V +5 V from microcontroller VDDM VDD START ECR 13, 16, 22 21 24 23 19 14 signals to/from decoder EC CP1 10 nF CP2 CAPY VSSA W 100 Ω 6 SZA1015 UP 25 UN 26 7 HU VP 27 VN 28 11 HV 12 WP 29 WN 30 15, 17, 20 1 2 5 4 3 REMF RLIM REMF(1) RLIM(1) HW BIAS 32 ROSC 47 kΩ COSC 100 pF MGT198 (1) For selection of the resistors REMF and RLIM see Chapter “Functional description”. Fig.10 Typical application diagram. 2001 Jul 11 +5 V +5 V UP UN HU VP VN HV WP WN HW 10 22 nF GND motor V 8 3 V or 5 V FG U 12 Hall elements BIAS Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 INTERNAL PIN CONFIGURATION Ron = 150 to 350 Ω handbook, full pagewidth Ron = 150 to 350 Ω UP (pin 25) UN (pin 26) 5 pF START (pin 23) 5 pF VN (pin 28) VP (pin 27) 5 pF 3.4 pF BIAS (pin 2) 'on' when START is active 3.4 pF 5 pF WP (pin 29) WN (pin 30) 5 pF 5 pF VDDM EC (pin 7) ECR (pin 8) U (pin 21) 100 kΩ V (pin 19) W (pin 14) GND Fig.11 Input and output equivalent circuits. 2001 Jul 11 13 MGT199 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 PACKAGE OUTLINE HTSSOP32: plastic, heatsink thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT549-1 E D A X c y HE heatsink side v M A Dh Z 32 17 A2 Eh (A3) A A1 pin 1 index θ Lp L detail X 16 1 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D(1) Dh E(2) Eh e HE L Lp v w y Z θ mm 1.10 0.15 0.05 0.95 0.85 0.25 0.30 0.19 0.20 0.09 11.10 10.90 5.10 4.90 6.20 6.00 3.60 3.40 0.65 8.30 7.90 1.00 0.75 0.50 0.20 0.10 0.10 0.78 0.48 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 99-03-04 SOT549-1 2001 Jul 11 EUROPEAN PROJECTION 14 o Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 2001 Jul 11 15 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(1) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 Jul 11 16 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2001 Jul 11 17 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 NOTES 2001 Jul 11 18 Philips Semiconductors Product specification Brushless Motor Controller (BMC12) SZA1015 NOTES 2001 Jul 11 19 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753503/02/pp20 Date of release: 2001 Jul 11 Document order number: 9397 750 08543