PHILIPS PCA9545ABS

PCA9545A
4-channel I2C switch with interrupt logic and reset
Rev. 03 — 3 March 2005
Product data sheet
1. General description
The PCA9545A is a quad bi-directional translating switch controlled via the I2C-bus. The
SCL/SDA upstream pair fans out to four downstream pairs, or channels. Any individual
SCx/SDx channel or combination of channels can be selected, determined by the
contents of the programmable control register. Four interrupt inputs, INT0 to INT3, one for
each of the downstream pairs, are provided. One interrupt output, INT, acts as an AND of
the four interrupt inputs.
An active LOW reset input allows the PCA9545A to recover from a situation where one of
the downstream I2C-buses is stuck in a LOW state. Pulling the RESET pin LOW resets the
I2C-bus state machine and causes all the channels to be deselected as does the internal
Power-on reset function.
The pass gates of the switches are constructed such that the VDD pin can be used to limit
the maximum high voltage which will be passed by the PCA9545A. This allows the use of
different bus voltages on each pair, so that 1.8 V or 2.5 V or 3.3 V parts can communicate
with 5 V parts without any additional protection. External pull-up resistors pull the bus up
to the desired voltage level for each channel. All I/O pins are 5 V tolerant.
2. Features
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
1-of-4 bi-directional translating switches
I2C-bus interface logic; compatible with SMBus standards
4 active LOW interrupt inputs
Active LOW interrupt output
Active LOW reset input
2 address pins allowing up to 4 devices on the I2C-bus
Channel selection via I2C-bus, in any combination
Power-up with all switch channels deselected
Low Ron switches
Allows voltage level translation between 1.8 V, 2.5 V, 3.3 V and 5 V buses
No glitch on power-up
Supports hot insertion
Low stand-by current
Operating power supply voltage range of 2.3 V to 5.5 V
5 V tolerant Inputs
0 kHz to 400 kHz clock frequency
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
■ Latch-up protection exceeds 100 mA per JESD78
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
■ Three packages offered: SO20, TSSOP20, and HVQFN20
3. Ordering information
Table 1:
Ordering information
Tamb = –40 °C to +85 °C
Type number
Package
Name
Description
Version
PCA9545ABS
HVQFN20
plastic thermal enhanced very thin quad flat package; SOT662-1
no leads; 20 terminals; body 5 × 5 × 0.85 mm
PCA9545AD
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
PCA9545APW
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
Standard packing quantities and other packaging data are available at
www.standardproducts.philips.com/packaging.
4. Marking
Table 2:
Marking codes
Type number
Topside mark
PCA9545ABS
9545A
PCA9545AD
PCA9545AD
PCA9545APW
PA9545A
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
2 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
5. Block diagram
PCA9545A
SC0
SC1
SC2
SC3
SD0
SD1
SD2
SD3
VSS
VDD
RESET
SCL
SDA
SWITCH CONTROL LOGIC
POWER-ON
RESET
INPUT
FILTER
INT0
to
INT3
A0
I2C-BUS
CONTROL
A1
INT
INTERRUPT LOGIC
002aab168
Fig 1. Block diagram of PCA9545A
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
3 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
6. Pinning information
6.1 Pinning
A0
1
1
2
20 VDD
19 SDA
A0
A1
A1
2
20 VDD
19 SDA
RESET
3
18 SCL
RESET
3
18 SCL
INT0
4
17 INT
INT0
4
17 INT
SD0
5
16 SC3
SD0
5
SC0
6
15 SD3
SC0
6
INT1
7
14 INT3
INT1
7
14 INT3
SD1
8
13 SC2
SD1
8
13 SC2
SC1
9
12 SD2
SC1
9
12 SD2
VSS 10
11 INT2
VSS 10
11 INT2
PCA9545AD
PCA9545APW
002aab165
16 SC3
15 SD3
002aab166
16 SCL
17 SDA
20 A1
terminal 1
index area
18 VDD
Fig 3. Pin configuration for TSSOP20
19 A0
Fig 2. Pin configuration for SO20
RESET
1
15 INT
INT0
2
14 SC3
SD0
3
SC0
4
12 INT3
INT1
5
11 SC2
7
8
9
SC1
VSS
INT2
13 SD3
SD2 10
6
SD1
PCA9545ABS
002aab167
Transparent top view
Fig 4. Pin configuration for HVQFN20 (transparent top view)
6.2 Pin description
Table 3:
Symbol
Pin description
Pin
Description
SO, TSSOP
HVQFN
A0
1
19
address input 0
A1
2
20
address input 1
RESET
3
1
active LOW reset input
INT0
4
2
active LOW interrupt input 0
SD0
5
3
serial data 0
SC0
6
4
serial clock 0
INT1
7
5
active LOW interrupt input 1
SD1
8
6
serial data 1
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
4 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
Table 3:
Pin description …continued
Symbol
SC1
VSS
Pin
Description
SO, TSSOP
HVQFN
9
7
serial clock 1
10
8 [1]
supply ground
INT2
11
9
active LOW interrupt input 2
SD2
12
10
serial data 2
SC2
13
11
serial clock 2
INT3
14
12
active LOW interrupt input 3
SD3
15
13
serial data 3
SC3
16
14
serial clock 3
INT
17
15
active LOW interrupt output
SCL
18
16
serial clock line
SDA
19
17
serial data line
VDD
20
18
supply voltage
[1]
HVQFN package die supply ground is connected to both the VSS pin and the exposed center pad. The VSS
pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and
board-level performance, the exposed pad needs to be soldered to the board using a corresponding
thermal pad on the board, and for proper heat conduction through the board thermal vias need to be
incorporated in the PCB in the thermal pad region.
7. Functional description
Refer to Figure 1 “Block diagram of PCA9545A” on page 3.
7.1 Device address
Following a START condition, the bus master must output the address of the slave it is
accessing. The address of the PCA9545A is shown in Figure 5. To conserve power, no
internal pull-up resistors are incorporated on the hardware selectable address pins and
they must be pulled HIGH or LOW.
1
1
1
0
fixed
0
A1
A0 R/W
hardware
selectable
002aab169
Fig 5. Slave address
The last bit of the slave address defines the operation to be performed. When set to
logic 1, a read is selected while a logic 0 selects a write operation.
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
5 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
7.2 Control register
Following the successful acknowledgement of the slave address, the bus master will send
a byte to the PCA9545A, which will be stored in the control register. If multiple bytes are
received by the PCA9545A, it will save the last byte received. This register can be written
and read via the I2C-bus.
channel selection bits
(read/write)
interrupt bits
(read only)
7
6
5
4
INT INT INT INT
3
2
1
0
3
2
1
0
B3
B2
B1
B0
channel 0
channel 1
channel 2
channel 3
INT0
INT1
INT2
INT3
002aab170
Fig 6. Control register
7.2.1 Control register definition
One or several SCx/SDx downstream pair, or channel, is selected by the contents of the
control register. This register is written after the PCA9545A has been addressed. The
4 LSBs of the control byte are used to determine which channel is to be selected. When a
channel is selected, the channel will become active after a STOP condition has been
placed on the I2C-bus. This ensures that all SCx/SDx lines will be in a HIGH state when
the channel is made active, so that no false conditions are generated at the time of
connection.
Table 4:
INT3
Control register: Write—channel selection; Read—channel status
INT2
INT1
INT0
B3
B2
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
0
0
X
0
1
0
0
B1
X
0
1
B0
Command
0
channel 0 disabled
1
channel 0 enabled
X
X
X
X
X
X
0
0
0
1
channel 1 disabled
channel 1 enabled
channel 2 disabled
channel 2 enabled
channel 3 disabled
channel 3 enabled
no channel selected;
power-up/reset default state
Remark: Several channels can be enabled at the same time. Example: B3 = 0, B2 = 1,
B1 = 1, B0 = 0, means that channel 0 and channel 3 are disabled and channel 1 and
channel 2 are enabled. Care should be taken not to exceed the maximum bus capacity.
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
6 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
7.2.2 Interrupt handling
The PCA9545A provides 4 interrupt inputs, one for each channel, and one open-drain
interrupt output. When an interrupt is generated by any device, it will be detected by the
PCA9545A and the interrupt output will be driven LOW. The channel does not need to be
active for detection of the interrupt. A bit is also set in the control register.
Bit 4 through bit 7 of the control register corresponds to channel 0 through channel 3 of
the PCA9545A, respectively. Therefore, if an interrupt is generated by any device
connected to channel 1, the state of the interrupt inputs is loaded into the control register
when a read is accomplished. Likewise, an interrupt on any device connected to
channel 0 would cause bit 4 of the control register to be set on the read. The master can
then address the PCA9545A and read the contents of the control register to determine
which channel contains the device generating the interrupt. The master can then
reconfigure the PCA9545A to select this channel, and locate the device generating the
interrupt and clear it.
It should be noted that more than one device can provide an interrupt on a channel, so it is
up to the master to ensure that all devices on a channel are interrogated for an interrupt.
The interrupt inputs may be used as general purpose inputs if the interrupt function is not
required.
If unused, interrupt input(s) must be connected to VDD through a pull-up resistor.
Table 5:
INT3
Control register: Read—interrupt
INT2
X
X
X
X
X
0
1
0
1
X
INT1
B3
B2
B1
B0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
INT0
0
1
Command
no interrupt on channel 0
interrupt on channel 0
no interrupt on channel 1
interrupt on channel 1
no interrupt on channel 2
interrupt on channel 2
no interrupt on channel 3
interrupt on channel 3
Remark: Several interrupts can be active at the same time. Example: INT3 = 0, INT2 = 1,
INT1 = 1, INT0 = 0, means that there is no interrupt on channel 0 and channel 3, and
there is interrupt on channel 1 and channel 2.
7.3 RESET input
The RESET input is an active LOW signal which may be used to recover from a bus fault
condition. By asserting this signal LOW for a minimum of tWL, the PCA9545A will reset its
registers and I2C-bus state machine and will deselect all channels. The RESET input must
be connected to VDD through a pull-up resistor.
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
7 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
7.4 Power-On Reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9545A in
a reset condition until VDD has reached VPOR. At this point, the reset condition is released
and the PCA9545A registers and I2C-bus state machine are initialized to their default
states—all zeroes—causing all the channels to be deselected. Thereafter, VDD must be
lowered below 0.2 V to reset the device.
7.5 Voltage translation
The pass gate transistors of the PCA9545A are constructed such that the VDD voltage can
be used to limit the maximum voltage that will be passed from one I2C-bus to another.
002aaa964
5.0
Vo(sw)
(V)
4.0
(1)
(2)
3.0
(3)
2.0
1.0
2.0
2.5
3.0
3.5
4.0
4.5
5.5
5.0
VDD (V)
(1) maximum
(2) typical
(3) minimum
Fig 7. Pass gate voltage versus supply voltage
Figure 7 shows the voltage characteristics of the pass gate transistors (note that the graph
was generated using the data specified in Section 11 “Static characteristics” of this data
sheet). In order for the PCA9545A to act as a voltage translator, the Vo(sw) voltage should
be equal to, or lower than the lowest bus voltage. For example, if the main bus was
running at 5 V, and the downstream buses were 3.3 V and 2.7 V, then Vo(sw) should be
equal to or below 2.7 V to effectively clamp the downstream bus voltages. Looking at
Figure 7, we see that Vo(sw)(max) will be at 2.7 V when the PCA9545A supply voltage is
3.5 V or lower, so the PCA9545A supply voltage could be set to 3.3 V. Pull-up resistors
can then be used to bring the bus voltages to their appropriate levels (see Figure 14).
More Information can be found in Application Note AN262: PCA954X family of I2C/SMBus
multiplexers and switches.
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
8 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
8. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
8.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 8).
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 8. Bit transfer
8.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line, while the clock is HIGH is defined as the START condition (S).
A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the
STOP condition (P) (see Figure 9).
SDA
SDA
SCL
SCL
S
P
START condition
STOP condition
mba608
Fig 9. Definition of START and STOP conditions
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
9 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
8.3 System configuration
A device generating a message is a ‘transmitter’, a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 10).
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
I2C
MULTIPLEXER
SLAVE
002aaa966
Fig 10. System configuration
8.4 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; setup and hold
times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
S
START
condition
2
8
9
clock pulse for
acknowledgement
002aaa987
Fig 11. Acknowledgement on the I2C-bus
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
10 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
8.5 Bus transactions
Data is transmitted to the PCA9545A control register using the Write mode as shown in
Figure 12.
slave address
SDA
S
1
1
1
0
0
control register
A1
A0
START condition
0
R/W
A
X
X
X
X
B3
B2
acknowledge
from slave
B1
B0
A
P
acknowledge
from slave
STOP condition
002aab172
Fig 12. Write control register
Data is read from PCA9545A using the Read mode as shown in Figure 13.
slave address
SDA
S
1
1
1
0
0
START condition
last byte
control register
A1
A0
1
R/W
A
INT3 INT2 INT1 INT0 B3
acknowledge
from slave
B2
B1
B0
NA
P
no acknowledge
from master
STOP condition
002aab173
Fig 13. Read control register
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
11 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
9. Application design-in information
VDD = 2.7 V to 5.5 V
VDD = 3.3 V
V = 2.7 V to 5.5 V
see note (1)
SDA
SDA
SD0
SCL
SCL
SC0
INT
INT0
channel 0
V = 2.7 V to 5.5 V
RESET
see note (1)
I2C/SMBus master
SD1
channel 1
SC1
INT1
V = 2.7 V to 5.5 V
PCA9545A
SD2
see note (1)
channel 2
SC2
INT2
V = 2.7 V to 5.5 V
see note (1)
A1
SD3
A0
SC3
VSS
INT3
channel 3
002aab171
(1) If the device generating the interrupt has an open-drain output structure or can be 3-stated, a
pull-up resistor is required.
If the device generating the interrupt has a totem-pole output structure and cannot be 3-stated,
a pull-up resistor is not required.
The interrupt inputs should not be left floating.
Fig 14. Typical application
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
12 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
10. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS (ground = 0 V). [1]
Symbol
Parameter
VDD
Min
Max
Unit
supply voltage
–0.5
+7.0
V
VI
input voltage
–0.5
+7.0
V
II
input current
-
±20
mA
IO
output current
-
±25
mA
IDD
supply current
-
±100
mA
ISS
ground supply current
-
±100
mA
Ptot
total power dissipation
-
400
mW
Tstg
storage temperature
–60
+150
°C
Tamb
operating ambient temperature
–40
+85
°C
[1]
Conditions
The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
13 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
11. Static characteristics
Table 7:
Static characteristics
VDD = 2.3 V to 3.6 V; VSS = 0 V; Tamb = –40 °C to +85 °C; unless otherwise specified.
See Table 8 on page 15 for VDD = 4.5 V to 5.5 V. [1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2.3
-
3.6
V
Supply
VDD
supply voltage
IDD
supply current
operating mode; VDD = 3.6 V; no load;
VI = VDD or VSS; fSCL = 100 kHz
-
10
30
µA
Istb
standby current
standby mode; VDD = 3.6 V; no load;
VI = VDD or VSS
-
0.1
1
µA
VPOR
power-on reset voltage
no load; VI = VDD or VSS
-
1.6
2.1
V
[2]
Input SCL; input/output SDA
VIL
LOW-level input voltage
–0.5
-
0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
6
V
IOL
LOW-level output current
VOL = 0.4 V
3
7
-
mA
VOL = 0.6 V
6
10
-
mA
IL
leakage current
VI = VDD or VSS
–1
-
+1
µA
Ci
input capacitance
VI = VSS
-
10
13
pF
–0.5
-
0.3VDD
V
Select inputs A0, A1, INT0 to INT3, RESET
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
0.7VDD
-
VDD + 0.5
V
ILI
input leakage current
pin at VDD or VSS
–1
-
+1
µA
Ci
input capacitance
VI = VSS
-
1.6
3
pF
Pass gate
on-state resistance
Ron
Vo(sw)
switch output voltage
VDD = 3.67 V; VO = 0.4 V; IO = 15 mA
5
11
30
Ω
VDD = 2.3 V to 2.7 V; VO = 0.4 V;
IO = 10 mA
7
16
55
Ω
Vi(sw) = VDD = 3.3 V; Io(sw) = –100 µA
-
1.9
-
V
Vi(sw) = VDD = 3.0 V to 3.6 V;
Io(sw) = –100 µA
1.6
-
2.8
V
Vi(sw) = VDD = 2.5 V; Io(sw) = –100 µA
-
1.5
-
V
Vi(sw) = VDD = 2.3 V to 2.7 V;
Io(sw) = –100 µA
1.1
-
2.0
V
IL
leakage current
VI = VDD or VSS
–1
-
+1
µA
Cio
input/output capacitance
VI = VSS
-
3
5
pF
IOL
LOW-level output current
VOL = 0.4 V
IOH
HIGH-level output current
INT output
3
-
-
mA
-
-
+10
µA
[1]
For operation between published voltage ranges, refer to the worst-case parameter in both ranges.
[2]
VDD must be lowered to 0.2 V in order to reset part.
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
14 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
Table 8:
Static characteristics
VDD = 4.5 V to 5.5 V; VSS = 0 V; Tamb = –40 °C to +85 °C; unless otherwise specified.
See Table 7 on page 14 for VDD = 2.3 V to 3.6 V. [1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
4.5
-
5.5
V
Supply
VDD
supply voltage
IDD
supply current
operating mode; VDD = 5.5 V;
no load; VI = VDD or VSS;
fSCL = 100 kHz
-
25
100
µA
Istb
standby current
standby mode; VDD = 5.5 V;
no load; VI = VDD or VSS
-
0.3
1
µA
VPOR
power-on reset voltage
no load; VI = VDD or VSS
-
1.7
2.1
V
[2]
Input SCL; input/output SDA
VIL
LOW-level input voltage
–0.5
-
0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
6
V
IOL
LOW-level output current
VOL = 0.4 V
3
-
-
mA
VOL = 0.6 V
6
-
-
mA
IL
leakage current
VI = VSS
–1
-
1
µA
Ci
input capacitance
VI = VSS
-
10
13
pF
Select inputs A0, A1, INT0 to INT3, RESET
VIL
LOW-level input voltage
–0.5
-
0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
VDD + 0.5
V
ILI
input leakage current
VI = VDD or VSS
–1
-
+1
µA
Ci
input capacitance
VI = VSS
-
2
5
pF
Ron
on-state resistance
VDD = 4.5 V to 5.5 V; VO = 0.4 V;
IO = 15 mA
4
9
24
Ω
Vo(sw)
switch output voltage
Vi(sw) = VDD = 5.0 V;
Io(sw) = –100 µA
-
3.6
-
V
Vi(sw) = VDD = 4.5 V to 5.5 V;
Io(sw) = –100 µA
2.6
-
4.5
V
Pass gate
IL
leakage current
VI = VDD or VSS
–1
-
+1
µA
Cio
input/output capacitance
VI = VSS
-
3
5
pF
IOL
LOW-level output current
VOL = 0.4 V
3
-
-
mA
IOH
HIGH-level output current
-
-
+10
µA
INT output
[1]
For operation between published voltage ranges, refer to the worst-case parameter in both ranges.
[2]
VDD must be lowered to 0.2 V in order to reset part.
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PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
12. Dynamic characteristics
Table 9:
Symbol
Dynamic characteristics
Parameter
Conditions
Fast-mode I2C-bus
Standard-mode
I2C-bus
Min
Max
Min
Unit
Max
tPD
propagation delay from SDA to SDn, or
SCL to SCn
-
0.3 [1]
fSCL
SCL clock frequency
0
100
0
400
kHz
tBUF
bus free time between a STOP and
START condition
4.7
-
1.3
-
µs
tHD;STA
hold time (repeated) START condition.
After this period, the first clock pulse is
generated.
4.0
-
0.6
-
µs
tLOW
LOW period of the SCL clock
4.7
-
1.3
-
µs
tHIGH
HIGH period of the SCL clock
4.0
-
0.6
-
µs
tSU;STA
setup time for a repeated START
condition
4.7
-
0.6
-
µs
tSU;STO
setup time for STOP condition
4.0
-
0.6
-
µs
tHD;DAT
data hold time
0 [2]
3.45
0 [2]
0.9
µs
tSU;DAT
data setup time
250
-
100
rise time of both SDA and SCL signals
tr
-
1000
-
0.3 [1]
ns
-
ns
20 + 0.1Cb
[3]
300
ns
[3]
tf
fall time of both SDA and SCL signals
-
300
20 + 0.1Cb
300
µs
Cb
capacitive load for each bus line
-
400
-
400
µs
tSP
pulse width of spikes which must be
suppressed by the input filter
-
50
-
50
ns
tVD;DAT
data valid time
tVD;ACK
HIGH-to-LOW
[4]
-
1
-
1
µs
LOW-to-HIGH
[4]
-
0.6
-
0.6
µs
-
1
-
1
µs
data valid Acknowledge
INT
tv(INTnN-INTN) valid time from INTn to INT signal
-
4
-
4
µs
td(INTnN-INTN) delay time from INTn to INT inactive
-
2
100
2
µs
tw(rej)L
LOW-level rejection time
INTn inputs
1
-
1
-
µs
tw(rej)H
HIGH-level rejection time
INTn inputs
0.5
-
0.5
-
µs
RESET
tw(rst)L
LOW-level reset time
4
-
4
-
ns
trst
reset time (SDA clear)
500
-
500
-
ns
tREC;STA
recovery time to START condition
0
-
0
-
ns
[1]
Pass gate propagation delay is calculated from the 20 Ω typical Ron and the 15 pF load capacitance.
[2]
A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) in order to
bridge the undefined region of the falling edge of SCL.
[3]
Cb = total capacitance of one bus line in pF.
[4]
Measurements taken with 1 kΩ pull-up resistor and 50 pF load.
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PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
SDA
tr
tBUF
tf
tHD;STA
tSP
tLOW
SCL
tHD;STA
P
tSU;STA
tHD;DAT
S
tHIGH
tSU;DAT
tSU;STO
Sr
P
002aaa986
Fig 15. Definition of timing on the I2C-bus
ACK or read cycle
START
SCL
SDA
30 %
trst
RESET
50 %
50 %
tREC;STA
50 %
tw(rst)L
trst
50 %
LEDx
LED off
002aab174
Fig 16. Definition of RESET timing
protocol
START
condition
(S)
tSU;STA
bit 7
MSB
(A7)
tLOW
bit 6
(A6)
tHIGH
bit 0
(R/W)
acknowledge
(A)
STOP
condition
(P)
1/f
SCL
SCL
tBUF
tr
tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab175
Rise and fall times, refer to VIL and VIH.
Fig 17. I2C-bus timing diagram
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Product data sheet
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Rev. 03 — 3 March 2005
17 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
SCL
2
1
0
A
P
70 %
30 %
SDA
INPUT
50 %
tv(INTnN−INTN)
td(INTnN−INTN)
INT
002aab176
Fig 18. Expanded view of read input port register
13. Test information
VDD
VDD
PULSE
GENERATOR
VI
VO
RL
500 Ω
D.U.T.
RT
CL
50 pF
002aab177
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse
generator.
Fig 19. Test circuitry for switching times
9397 750 14311
Product data sheet
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Rev. 03 — 3 March 2005
18 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
14. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
10
1
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 20. Package outline SOT163-1 (SO20)
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Product data sheet
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Rev. 03 — 3 March 2005
19 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
E
D
A
X
c
HE
y
v M A
Z
11
20
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
10
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT360-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-153
Fig 21. Package outline SOT360-1 (TSSOP20)
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Product data sheet
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Rev. 03 — 3 March 2005
20 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 5 x 5 x 0.85 mm
A
B
D
SOT662-1
terminal 1
index area
A
A1
E
c
detail X
C
e1
e
b
6
y
y1 C
v M C A B
w M C
10
L
11
5
e
e2
Eh
1
15
terminal 1
index area
20
16
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A(1)
max.
A1
b
1
0.05
0.00
0.38
0.23
c
D(1)
Dh
E(1)
Eh
0.2
5.1
4.9
3.25
2.95
5.1
4.9
3.25
2.95
e
e1
2.6
0.65
e2
L
v
w
y
y1
2.6
0.75
0.50
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT662-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
01-08-08
02-10-22
Fig 22. Package outline SOT662-1 (HVQFN20)
9397 750 14311
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Rev. 03 — 3 March 2005
21 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
15. Soldering
15.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
15.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called
thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
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22 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
15.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
15.5 Package related soldering information
Table 10:
Suitability of surface mount IC packages for wave and reflow soldering methods
Package [1]
Soldering method
Wave
Reflow [2]
BGA, HTSSON..T [3], LBGA, LFBGA, SQFP,
SSOP..T [3], TFBGA, USON, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable [4]
suitable
PLCC [5], SO, SOJ
suitable
suitable
not
recommended [5] [6]
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended [7]
suitable
CWQCCN..L [8], PMFP [9], WQCCN..L [8]
not suitable
LQFP, QFP, TQFP
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
9397 750 14311
Product data sheet
not suitable
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
23 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
16. Abbreviations
Table 11:
Abbreviations
Acronym
Description
CDM
Charged Device Model
ESD
Electro Static Discharge
HBM
Human Body Model
IC
Integrated Circuit
LSB
Least Significant Bit
MM
Machine Model
MSB
Most Significant Bit
PCB
Printed-Circuit Board
POR
Power-On Reset
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Rev. 03 — 3 March 2005
24 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
17. Revision history
Table 12:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
PCA9545A_3
20050303
Product data sheet
-
9397 750 14311
PCA9545A_2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•
•
Section 2 “Features” on page 1: 9th bullet: changed “RDSON” to “Ron”
•
•
Figure 4 “Pin configuration for HVQFN20 (transparent top view)” on page 4: added pin 1
indicator notch and center pad.
Table 3 “Pin description” on page 4: added Table note 1 and its reference at HVQFN pin 8.
Section 7.5 “Voltage translation” on page 8:
– Figure 7: title changed from “Vpass voltage versus VDD” to “Pass gate voltage versus supply
voltage”; within graphic changed “Vpass (V)” to “Vo(sw) (V)”
– 2nd paragraph: changed “Vpass” to “Vo(sw)”; changed “Vpass(max)” to “Vo(sw)(max)”
•
Table 6 “Limiting values” on page 13: remove (old) table note [1], as it is now covered by Section
19 “Definitions” on page 26.
•
Table 7 “Static characteristics” on page 14:
– changed symbol “RON” to “Ron”; changed parameter from “switch resistance” to “on-state
resistance”
– changed symbol “Vpass” to “Vo(sw)”
– under Conditions column for Vo(sw): changed “Vswin” to “Vi(sw)”; changed “Iswout” to “Io(sw)”
– Added (new) Table note 1.
•
Table 8 “Static characteristics” on page 15:
– changed symbol “RON” to “Ron”; changed parameter from “switch resistance” to “on-state
resistance”
– changed symbol “Vpass” to “Vo(sw)”
– under Conditions column for Vo(sw): changed “Vswin” to “Vi(sw)”; changed “Iswout” to “Io(sw)”
•
Table 9 “Dynamic characteristics” on page 16:
– changed symbol “tR” to “tr”; changed symbol “tF” to “tf” (also in Figure 15 on page 17)
– changed symbols “tVD;DATL” and “tVD;DATH” to “tVD;DAT” and added Conditions indicating
HIGH-to-LOW and LOW-to-HIGH transitions
– changed symbol “tIV” to “tv(INTnN-INTN)” (also in Figure 18 on page 18)
– changed symbol “tIR” to “td(INTn-INTN)” (also in Figure 18 on page 18)
– changed symbol “Lpwr” to “tw(rej)L”
– changed symbol “Hpwr” to “tw(rej)H”
– changed symbol “tWL(rst)” to “tw(rst)L” (also in Figure 16 on page 17)
•
Added Section 16 “Abbreviations”.
PCA9545A_2
20040929
Objective data sheet
-
9397 750 13989
PCA9545A_1
PCA9545A_1
20040728
Objective data sheet
-
9397 750 13309
-
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
25 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
18. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions
20. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
21. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
9397 750 14311
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 3 March 2005
26 of 27
PCA9545A
Philips Semiconductors
4-channel I2C switch with interrupt logic and reset
22. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.2.1
7.2.2
7.3
7.4
7.5
8
8.1
8.2
8.3
8.4
8.5
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
15.5
16
17
18
19
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Device address . . . . . . . . . . . . . . . . . . . . . . . . . 5
Control register . . . . . . . . . . . . . . . . . . . . . . . . . 6
Control register definition . . . . . . . . . . . . . . . . . 6
Interrupt handling . . . . . . . . . . . . . . . . . . . . . . . 7
RESET input . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . 8
Voltage translation . . . . . . . . . . . . . . . . . . . . . . 8
Characteristics of the I2C-bus. . . . . . . . . . . . . . 9
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
START and STOP conditions . . . . . . . . . . . . . . 9
System configuration . . . . . . . . . . . . . . . . . . . 10
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 10
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 11
Application design-in information . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
Static characteristics. . . . . . . . . . . . . . . . . . . . 14
Dynamic characteristics . . . . . . . . . . . . . . . . . 16
Test information . . . . . . . . . . . . . . . . . . . . . . . . 18
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23
Package related soldering information . . . . . . 23
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information . . . . . . . . . . . . . . . . . . . . 26
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 3 March 2005
Document number: 9397 750 14311
Published in The Netherlands