INTEGRATED CIRCUITS DATA SHEET TDA8716 8-bit high-speed analog-to-digital converter Product specification Supersedes data of April 1993 File under Integrated Circuits, IC02 1996 Aug 26 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 FEATURES GENERAL DESCRIPTION • 8-bit resolution The TDA8716 is an 8-bit high-speed Analog-to-Digital Converter (ADC) designed for HDTV and professional applications. The device converts the analog input signal into 8-bit binary coded digital words at a sampling rate of 120 MHz. All digital outputs are ECL compatible. • Sampling rate up to 120 MHz • ECL (10 K family) compatible digital inputs and outputs • Overflow/Underflow output • Low power dissipation • Low input capacitance (13 pF typ.). APPLICATIONS • High speed analog-to-digital convertion • Video signal digitizing • Radar pulse analysis • Transient signal analysis • High energy physics research • Medical systems • Industrial instrumentation. QUICK REFERENCE DATA Measured over full voltage and temperature ranges, unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VEEA analog supply voltage −5.45 −5.2 −4.95 V VEED digital supply voltage −5.45 −5.2 −4.95 V IEEA analog supply current − 50 55 mA IEED digital supply current − 100 110 mA IEEO output supply current − 20 25 mA VRB reference voltage BOTTOM − −3.130 − V VRT reference voltage TOP − −1.870 − V ILE DC integral linearity error see Fig.8 − ±0.5 ±1 LSB DLE DC differential linearity error see Fig.9 − ±0.25 ±0.45 LSB EB effective bit fi = 20 MHz; fCLK = 100 MHz − 7 − bits fCLK maximum clock frequency 120 − − MHz Ptot total power dissipation − 780 900 mW RL = 2.2 kΩ excluding load ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA8716 DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 TDA8716T SO32L plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 1996 Aug 26 2 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 BLOCK DIAGRAM analog input handbook, full pagewidth 8 voltage reference top 10 voltage reference middle 9 voltage reference bottom 6 LSB ANALOG PROCESSING MSB ANALOG PROCESSING 7 11 analog ground folding and interpolation 5 analog negative supply voltage (– 5.2 V) SAMPLE LATCHES DIGITAL PROCESSING CLK input CLK input 1 2 CLOCK BUFFER LATCHES LSB BINARY ENCODER MSB BINARY ENCODER 6 3 13 24 digital ground 3 12 digital negative supply voltage (– 5.2 V) 4 two's complement output select OUTPUT LATCHES TDA8716 19 ECL BUFFERS 14 15 16 17 18 20 21 22 23 MCD265 - 2 digital outputs D0 to D7 Fig.1 Block diagram; TDA8716. 1996 Aug 26 3 IN range output ground supply voltage (0 V) Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 PINNING TDA8716 SYMBOL PIN DESCRIPTION CLK 1 complementary clock input CLK 2 clock input VEED1 3 digital negative supply voltage (−5.2 V) CPLT2 4 two's complement output select (active HIGH) VEEA 5 analog negative supply voltage (−5.2 V) VRB 6 reference voltage BOTTOM AGND1 7 analog ground 1 VI 8 analog input VRM 9 reference voltage MIDDLE decoupling handbook, halfpage CLK 1 24 DGND2 CLK 2 23 IR V EED1 3 22 D7 C PLT2 4 21 D6 V EEA 5 20 D5 VRB 6 AGND1 7 18 D4 VI 8 17 D3 19 OGND TDA8716 VRT 10 reference voltage TOP AGND2 11 analog ground 2 VEED2 12 digital negative supply voltage (−5.2 V) VRM 9 16 D2 DGND1 13 digital ground 1 VRT 10 15 D1 D0 14 digital output (LSB) AGND2 11 14 D0 D1 15 digital output V EED2 12 13 DGND1 D2 16 digital output D3 17 digital output D4 18 digital output OGND 19 output ground supply voltage (0 V) D5 20 digital output D6 21 digital output D7 22 digital output (MSB) IR 23 IN range DGND2 24 digital ground 2 1996 Aug 26 MCD259 Fig.2 Pin configuration; TDA8716. 4 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 PINNING TDA8716T SYMBOL PIN DESCRIPTION CLK 1 complementary clock input CLK 2 clock input VEED1 3 digital negative supply voltage (−5.2 V) n.c. 4 not connected n.c. 5 not connected CPLT2 6 two's complement output select (active HIGH) VEEA 7 analog negative supply voltage (−5.2 V) VRB 8 reference voltage BOTTOM AGND1 9 analog ground 1 handbook, halfpage CLK 1 32 DGND2 CLK 2 31 IR V EED1 3 30 D7 VI 10 analog input n.c. 4 29 n.c. VRM 11 reference voltage MIDDLE decoupling n.c. 5 28 n.c. n.c. 12 not connected C PLT2 6 27 D6 n.c. 13 not connected V EEA 7 26 D5 V RB 8 25 OGND VRT 14 reference voltage TOP AGND2 15 analog ground 2 VEED2 16 digital negative supply voltage (−5.2 V) DGND1 17 digital ground 1 D0 18 digital output (LSB) D1 19 digital output n.c. 20 n.c. TDA8716T AGND1 9 24 D4 VI 10 23 D3 VRM 11 22 D2 n.c. 12 21 n.c. n.c. 13 20 n.c. not connected V RT 14 19 D1 21 not connected AGND2 15 18 D0 D2 22 digital output V EED2 16 17 D3 23 digital output D4 24 digital output OGND 25 output ground supply voltage (0 V) D5 26 digital output D6 27 digital output n.c. 28 not connected n.c. 29 not connected D7 30 digital output (MSB) IR 31 IN range DGND2 32 digital ground 2 1996 Aug 26 DGND1 MBC742 - 2 Fig.3 Pin configuration; TDA8716T. 5 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VEEA analog supply voltage −7.0 +0.3 V VEED1,VEED2 digital supply voltage −7.0 +0.3 V VEEA − VEED1; VEEA − VEED2 supply voltage differences −1 +1 V VI input voltage referenced to AGND VEEA 0 V VCLK; CLK(p-p) input voltage for differential clock drive (peak-to-peak value) note 1 − 2.0 V IO output current (each output stage) − 10 mA Tstg storage temperature −55 +150 °C Tamb operating ambient temperature 0 +70 °C Tj junction temperature − +150 °C Note 1. The circuit has two clock inputs: CLK and CLK. Sampling takes place on the rising edge of the clock input signal: CLK and CLK are two's complementary ECL signals. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER CONDITIONS from junction to ambient VALUE UNIT in free air SOT101 35 K/W SOT287 (see Fig.4) 65 K/W HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. 1996 Aug 26 6 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 CHARACTERISTICS VEEA = −4.95 to −5.45 V; VEED1, VEED2 = −4.95 to −5.45 V; AGND, DGND and OGND shorted together; Tamb = 0 to +70 °C; unless otherwise specified. (Typical values taken at VEEA = −5.2 V; VEED1, VEED2 = −5.2 V; Tamb = 25 °C). SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VEEA analog supply voltage −5.45 −5.2 −4.95 VEED1,VEED2 digital supply voltage −5.45 −5.2 −4.95 V IEEA analog supply current − 50 55 mA IEED1,IEED2 digital supply current − 100 110 mA IEE output supply current RL = 2.2 kΩ − 20 25 mA Vdiff supply voltage differential VEEA − VEED1; VEEA − VEED2 −0.5 0 +0.5 V V Reference voltages for the resistor ladder VRB reference voltage BOTTOM −3.5 −3.13 − V VRT reference voltage TOP − −1.87 −1.5 V Vref reference voltage differential VRT − VRB − 1.26 − V VOB voltage offset BOTTOM note 1 − 130 − mV VOT voltage offset TOP note 1 − 130 − mV VI(p-p) input voltage amplitude (peak-to-peak value) 0.95 1.0 1.5 V Iref reference current − 15 − mA RLAD resistor ladder − 85 − Ω TCRL temperature coefficient of the resistor ladder − 0.18 − Ω/K Inputs CLK and CLK input VIL LOW level input voltage −1850 −1770 −1650 mV VIH HIGH level input voltage −960 −880 −810 mV IIL LOW level input current VCLK = −1.77 V − 1 − µA IIH HIGH level input current VCLK = −0.88 V − 10 − µA RI input resistance − 20 − kΩ CI input capacitance − 2 − pF VCLK(p-p) differential clock input VCLK − VCLK (peak-to-peak value) − 900 − mV Analog input; note 2 IIB input current BOTTOM VRB = −3.13 V − 0 − µA IIT input current TOP VRT = −1.87 V − 170 − µA RI input resistance − 7 − kΩ CI input capacitance − 13 20 pF 1996 Aug 26 7 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter SYMBOL PARAMETER TDA8716 CONDITIONS MIN. TYP. MAX. UNIT Outputs (RL = 2.2 kΩ) Digital 10K ECL outputs (D0 to D7; IR) VOL LOW level output voltage −1850 −1770 −1600 mV VOH HIGH level output voltage −960 −880 −810 mV IOL LOW level output current − 1.8 4.0 mA IOH HIGH level output current − 2.0 4.0 mA Timing (fCLK = 100 MHz; RL = 2.2 kΩ; see Fig.5) tds sampling delay − 1 3 ns tHD output hold time 4 − − ns td output delay time CL = 3.3 pF − − 7.5 ns CL = 7.5 pF − − 9 ns − 15 − ps 120 − − MHz taj note 3 aperture jitter Switching characteristics fCLK; fCLK maximum clock frequency Analog signal processing (fCLK = 100 MHz) Gdiff differential gain note 4 − 0.3 − % φdiff differential phase note 4 − 0.4 − °C Harmonics (full scale); fi = 10 MHz; fCLK = 100 MHz f1 fundamental − 0 − dB f2 even harmonics − −60 − dB f3 odd harmonics − −50 − dB Transfer function ILE DC integral linearity error − ±0.5 ±1 LSB DLE DC differential linearity error − ±0.25 ±0.45 LSB AILE AC integral linearity error note 4 − ±1 ±1.5 LSB EB effective bits Figs 13 and 14; note 5; fCLK = 100 MHz fi = 4.43 MHz see Fig.10 − 7.7 − bits fi = 10 MHz see Fig.11 − 7.5 − bits fi = 20 MHz see Fig.12 − 7.0 − bits − 6.5 − bits − 10−11 − times/ samples fi = 30 MHz BER 1996 Aug 26 bit error rate fCLK = 100 MHz; fi = 10 MHz; Vi = ±8 LSB at code 128; 50% clock duty factor 8 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 Notes 1. Voltage offset BOTTOM (VOB) is the difference between the analog input which produces data outputs equal to 00 and the reference voltage BOTTOM (VRB), at Tamb = 25 °C. Voltage offset TOP (VOT) is the difference between reference voltage TOP (VRT) and the analog input which produces data outputs equal to FF, at Tamb = 25 °C. 2. The analog input is not internally biased. It should be externally biased between VRB and VRT levels. 3. The TDA8716 can only withstand one or two 10K or 100K ECL loads in order to work-out timings at the maximum sampling frequency. It is therefore recommended to minimize the printed-circuit board load by implementing the load device as close as possible to the TDA8716. 4. Full-scale sinewave; fi = 4.43 MHz; fCLK, fCLK = 100 MHz. 5. Effective bits are obtained via a Fast Fourier Transformer (FFT) treatment taking 4 K acquisition points per period. The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency). Conversion to SNR: SNR = EB (dB) × 6.02 + 1.76. MEA540 0 handbook, full pagewidth percent change (R th j–a) –10 –20 –30 SOL –40 –50 –60 0 200 400 600 Fig.4 Average effect of air flow on thermal resistance. 1996 Aug 26 9 800 air flow (LFPM) 1000 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter Table 1 Output coding (CPLT2 HIGH) Table 2 STEP VI (TYP.) BINARY OUTPUTS D7 to D0 IR Underflow < −3 V 00000000 0 0 −3 V 00000000 1 1 . 00000001 1 . . ...... . . . ...... . TDA8716 Two's complement coding CPLT2 . . ...... . 254 . 11111110 1 255 −2 V 11111111 1 Overflow > −2 V 11111111 0 D7 (MSB) 1 (VIH) non inverted 0 (VIL) inverted handbook, full pagewidth 50 % CLK sample N sample N + 1 sample N + 2 ANALOG INPUT V l t HD td DATA OUTPUT D0 - D7 DATA N-1 DATA N DATA N+1 50 % MSA654 Fig.5 Timing diagram. 1996 Aug 26 10 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 APPLICATION INFORMATION Additional application information will be supplied upon request, please quote reference number FTV/AN 9109. handbook, full pagewidth CLK 1 24 CLK 2 23 VEED1 (– 5.2 V) 3 22 C PLT2 4 21 V EEA (– 5.2 V) 5 20 6 19 DGND2 IR VRB (– 3.13 V) 100 nF D7 D6 D5 OGND (0 V) TDA8716 7 18 8 17 9 16 10 15 11 14 12 13 D4 AGND1 analog input VRM D3 D2 100 nF VRT (– 1.87 V) D1 100 nF D0 V EED AGND2 VEED2 (– 5.2 V) DGND1 MCD260 - 2 Typical value for resistors = 2.2 kΩ. Lower resistor values can be used down to 500 Ω to obtain higher sampling frequencies in the 150 MSPS range (limited by td and tHD timings). In this configuration a DC shift of the ECL output levels VOL and VOH will occur. VRB, VRT and VM are decoupled to AGND. Analog, digital and output supplies should be separated and decoupled. The external voltage regulator must be constructed in such a way that a good supply voltage ripple rejection is achieved with respect to the LSB value. Fig.6 Application diagram; TDA8716. 1996 Aug 26 11 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter handbook, halfpage DGND CLK; CLK VCCD1 TDA8716 13, 24 handbook, halfpage 7, 11 AGND 1, 2 8 VI 3 5 VCCA MCD261 MCD262 - 1 7, 11 AGND handbook, halfpage DGND handbook, halfpage 13, 24 C PLT2 4 VCCD2 12 x 80 VRT 10 VRM 9 VRB 6 VCCA 5 resistor ladder MCD263 MCD264 AGND 7, 11 handbook, halfpage VRT 10 VRM 9 VRB 6 VCCA 5 resistor ladder MCD264 Fig.7 Internal pin configuration diagram. 1996 Aug 26 12 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 MEA537 handbook, full pagewidth 1.0 LSB 0.5 0 –0.5 –1.0 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 CODE 256 Fig.8 DC Integral Linearity Error (ILE). MEA536 handbook, full pagewidth 1.0 LSB 0.5 0 –0.5 –1.0 0 16 32 48 64 80 96 112 128 144 160 176 Fig.9 DC Differential Linearity Error (DLE). 1996 Aug 26 13 192 208 224 240 CODE 256 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 MEA535 0 amplitude (dB) –20 –40 –60 –80 –100 –120 0 6.25 12.5 18.7 25.0 31.2 37.5 43.7 frequency (MHz) Effective bits: 7.74; Harmonic levels (in dB): 2nd = −69.34; 3rd = −58.85; 4th = −82.55; 5th = −68.16 and 6th = −63.01. Fig.10 Fast fourier transformer (fCLK = 100 MHz; fi = 4.43 MHz). 1996 Aug 26 14 50.0 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 MEA534 0 amplitude (dB) –20 –40 –60 –80 –100 –120 0 6.25 12.5 18.7 25.0 31.2 37.5 43.7 frequency (MHz) Effective bits: 7.57; Harmonic levels (in dB): 2nd = −82.07; 3rd = −61.90; 4th = −75.70; 5th = −65.61 and 6th = −72.50. Fig.11 Fast fourier transformer (fCLK = 100 MHz; fi = 10 MHz). 1996 Aug 26 15 50.0 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 MEA533 0 amplitude (dB) –20 –40 –60 –80 –100 –120 0 6.43 12.9 19.3 25.7 32.2 38.6 45.0 frequency (MHz) Effective bits: 7.04; Harmonic levels (in dB): 2nd = −61.36; 3rd = −56.66; 4th = −61.97; 5th = −62.79 and 6th = −61.52. Fig.12 Fast fourier transformer (fCLK = 100 MHz; fi = 20 MHz). MEA539 handbook, full pagewidth 8 effective bits 7 6 5 4 0 5 4.43 MHz 10 15 20 25 30 35 40 f i (MHz) Fig.13 Typical effective bit as a function of input signal at fCLK = 100 MHz. 1996 Aug 26 16 51.5 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 MEA538 8 handbook, full pagewidth effective bits 7.5 7 6.5 6.0 0 10 20 30 40 50 60 70 80 90 100 110 120 f clock (MHz) Fig.14 Typical effective bits as a function of clock frequency at fi = 10 MHz. 1996 Aug 26 17 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 PACKAGE OUTLINES seating plane DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1 ME D A2 L A A1 c e Z b1 w M (e 1) b MH 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 32.0 31.4 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 2.2 inches 0.20 0.020 0.16 0.066 0.051 0.021 0.015 0.013 0.009 1.26 1.24 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT101-1 051G02 MO-015AD 1996 Aug 26 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-23 18 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 D E A X c y HE v M A Z 17 32 Q A2 A (A 3) A1 pin 1 index θ Lp L 16 1 0 detail X w M bp e 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.27 0.18 20.7 20.3 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.2 1.0 0.25 0.25 0.1 0.95 0.55 inches 0.10 0.012 0.096 0.004 0.086 0.01 0.02 0.01 0.011 0.007 0.81 0.80 0.30 0.29 0.050 0.42 0.39 0.055 0.043 0.016 0.047 0.039 0.01 0.01 0.004 0.037 0.022 θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-25 SOT287-1 1996 Aug 26 EUROPEAN PROJECTION 19 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1996 Aug 26 TDA8716 20 Philips Semiconductors Product specification 8-bit high-speed analog-to-digital converter TDA8716 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Aug 26 21