Document No.001-66057 Rev. *B ECN # 4614479 Cypress Semiconductor Package Qualification Report QTP# 103308 VERSION*B January, 2015 165 - Ball FBGA (15X17X1.4mm) SnAgCu, MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro (RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-66057 Rev. *B ECN # 4614479 PACKAGE QUALIFICATION HISTORY QTP Number 103308 Description of Qualification Purpose 165-Ball FBGA (15X17X1.4mm) for LL65nm 144M QDR Device using GR9810 Mold Compound, QMI 506 Epoxy SnAgCu, MSL3, 260C Reflow assembled at CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date Comp Dec 10 Document No.001-66057 Rev. *B ECN # 4614479 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: BW 165 ( 15X17X1.4mm ) Package Outline, Type, or Name: 165-Ball FBGA Mold Compound Name/Manufacturer: GR9810/Hysol Mold Compound Flammability Rating: UL-94V (0) Substrate Material: SUBBBW165RF/ SUBBBW165RG Lead Finish, Composition / Thickness: Die Backside Preparation Method/Metallization: Die Separation Method: SAC405 Die Attach Supplier: Henkel Die Attach Material: QMI-506 Die Attach Method: Epoxy Bond Diagram Designation: 001-57409, 001-57411 Wire Bond Method: Thermosonic Wire Material/Size: Au / 1.0 mil Thermal Resistance Theta JA °C/W: 12.55 C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C Backgrinding Saw 0 ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 8 Document No.001-66057 Rev. *B ECN # 4614479 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Acoustic Microscopy Test Condition (Temp/Bias) J-STD-020 Precondition: JESD22 Moisture Sensitivity MSL 3 Result P/F P 192 Hrs, 30C/60%RH+ Reflow, 260C +0, -5C Ball Shear JESD22-B116 P Bond Pull MIL-STD-883 – Method 2011 P Criteria: Meet external and internal characteristics of Constructional Analysis Cypress package P MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 Die Shear P >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Dye Penetrant Test Criteria: No Package Crack P Final Visual JESD22-B101 P High Temp Storage JESD22-A103: 150C, no bias P Internal Visual MIL-STD-883-2014 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 110C, 85%RH, 2.05V Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+ Reflow, 260C +0, -5C JESD22-A102: 121C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL 3 Pressure Cooker P P 192 Hrs, 30C/60%RH+ Reflow, 260C +0, -5C JESD22-B117 Solder Ball Shear Temperature Cycle Thermal Shock X-ray MIL-STD-883, Method 1010, Condition B, -55C to 125C Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+ Reflow, 260C +0, -5C MIL-STD-883, Method 1011, Condition B, -55C to 125C and JESD22-A106, Condition C, -55C to 125C MIL-STD-883 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 8 P P P P Document No.001-66057 Rev. *B ECN # 4614479 Reliability Test Data QTP #: 103308 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY7C1612K (7C1612K) 8845001 611032553 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8845001 611032555 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8845001 611032554 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA COMP 230 0 CY7C1612K (7C1612K) 8845001 611024890 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8845001 611032553 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8845001 611032555 CML-RA COMP 5 0 CY7C1612K (7C1612K) 8845001 611032554 CML-RA COMP 5 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8845001 611032553 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8845001 611032555 CML-RA COMP 5 0 CY7C1612K (7C1612K) 8845001 611032554 CML-RA COMP 5 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA COMP 15 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY7C1612K (7C1612K) 8845001 611032553 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA COMP 15 0 STRESS: DYE PENETRATION TEST CY7C1612K (7C1612K) 8845001 611032553 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8845001 611032555 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8845001 611032554 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8845001 611024890 CML-RA COMP 15 0 CY7C1612K (7C1612K) 8845001 611032553 CML-RA COMP 5 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA COMP 30 0 STRESS: DIE SHEAR Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-66057 Rev. *B ECN # 4614479 Reliability Test Data QTP #: 103308 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP STORAGE CY7C1612K (7C1612K) 8845001 611032553 CML-RA 500 76 0 CY7C1612K (7C1612K) 8845001 611032553 CML-RA 1000 74 0 CY7C1612K (7C1612K) 8845001 611032553 CML-RA 1500 66 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA 500 77 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA 1000 76 0 STRESS: HI-ACCEL SATURATION TEST (110C, 85%RH, 2.05V), PRE COND 192 HR 30C/60%RH, MSL3 CY7C1612K (7C1612K) 8845001 611032553 CML-RA 264 76 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA 264 72 0 CY7C1612K (7C1612K) 8845001 611032553 CML-RA COMP 5 0 CY7C1612K (7C1612K) 8845001 611032555 CML-RA COMP 5 0 CY7C1612K (7C1612K) 8845001 611032554 CML-RA COMP 5 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C1612K (7C1612K) 8845001 611032553 CML-RA 168 75 0 CY7C1612K (7C1612K) 8845001 611032553 CML-RA 288 72 0 CY7C1612K (7C1612K) 8845001 611032555 CML-RA 168 73 0 CY7C1612K (7C1612K) 8845001 611032555 CML-RA 288 73 0 STRESS: SOLDER BALL SHEAR CY7C1612K (7C1612K) 8845001 611032553 CML-RA COMP 20 0 CY7C1612K (7C1612K) 8845001 611032555 CML-RA COMP 20 0 CY7C1612K (7C1612K) 8845001 611032554 CML-RA COMP 20 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA COMP 15 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-66057 Rev. *B ECN # 4614479 Reliability Test Data QTP #: 103308 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. B -55C TO 125C, PRE COND192 HRS 30C/60%RH, MSL3 CY7C1614KV (7C1614K) 8945028 611036123 CML-RA 500 74 0 CY7C1614KV (7C1614K) 8945028 611036123 CML-RA 1000 74 0 CY7C1614KV (7C1614K) 8945028 611036123 CML-RA 1300 74 0 CY7C1618KV (7C1618K) 8945028 611036125 CML-RA 500 76 0 CY7C1618KV (7C1618K) 8945028 611036125 CML-RA 1000 75 0 CY7C1618KV (7C1618K) 8945028 611036125 CML-RA 1300 75 0 CY7C1613KV (7C1613K) 8015005 611041460 CML-RA 500 77 0 CY7C1613KV (7C1613K) 8015005 611041460 CML-RA 1000 77 0 CY7C1613KV (7C1613K) 8015005 611041460 CML-RA 1300 77 0 CY7C1612K (7C1612K) 8845001 611032554 CML-RA 200 77 0 CY7C1612K (7C1612K) 8845001 611032554 CML-RA 1000 77 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA 200 77 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA 1000 76 0 CY7C1612K (7C1612K) 8845001 611032553 CML-RA COMP 324 0 CY7C1612K (7C1612K) 8845001 611032555 CML-RA COMP 36 0 CY7C1612K (7C1612K) 8845001 611032554 CML-RA COMP 36 0 CY7C1612K (7C1612K) 8908003 611024882 CML-RA COMP 36 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-66057 Rev. *B ECN # 4614479 Document History Page Document Title: QTP 103308:165 - Ball FBGA (15X17X1.4mm) for 144M 65nm, SnAgCu, MSL3, 260C at CML-RA Qualification Report 001-66057 Document Number: Rev. ECN No. 3112570 ** Orig. of Change NSR *A 4231150 JYF *B 4614479 JYF Description of Change Initial spec release Sunset Review: QTP title page update: - Deleted Version 1.0 - Updated title of QA Engineering Director to Reliability Director and Principal Reliability Engineer to Reliability Engineer, MTS; Deleted obsolete spec 001-57677 and 001-57674 in Major Package Information table; Complete re-write of Reliability Test Performed table for template alignment. Sunset Review: Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8