Document No.001-77785 Rev. *B ECN # 4331593 Cypress Semiconductor Package Qualification Report QTP# 120207 VERSION*B April, 2014 32 QFN (5x5x0.6mm)/ 24 QFN (4x4x0.6mm) NiPdAu, 100% Cu Wire MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 9 Document No.001-77785 Rev. *B ECN # 4331593 PACKAGE QUALIFICATION HISTORY QTP Number 120207 Description of Qualification Purpose Qualification of 32 QFN (5X5X0.6mm) and 24 QFN (4x4x0.6mm) package dimensions at CML Autoline (RA) using CEL9220 mold compound and QMI 509 epoxy Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 9 Date Mar 2012 Document No.001-77785 Rev. *B ECN # 4331593 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ32 Package Outline, Type, or Name: 32-Lead Quad Flat No Lead, 5x5x0.6mm Package Mold Compound Name/Manufacturer: CEL9220 / Hitachi Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: N/A Lead Frame Material: PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Dexter Die Attach Material: QMI 509 Bond Diagram Designation 001-53496 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Cu Thermal Resistance Theta JA C/W: 19.51°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-80667 Name/Location of Assembly (prime) facility: CML-RA MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 9 Document No.001-77785 Rev. *B ECN # 4331593 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Acoustic Microscopy Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc = 5.75, 150 C JESD22-A108 Dynamic Operating Condition, Vcc = 5.75V, 150 C JESD22-A108 JEDEC STD 22-A110, 130 C, 85%RH, 5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) JESD22-A103, 150 C, no bias Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Result P/F P P P P P P P Ball Shear JESD22-B116, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack P P Internal Visual MIL-STD-883-2014 P Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P MIL-STD-883, Method 1011, Condition B, -55 C to 125C and P Thermal Shock JESD22-A106, Condition C, -55 C to 125C X-Ray MIL-STD-883 - 2012 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Shear MIL-STD-883 - 2011 P Electrical Characterization AEC-Q100-009 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 9 Document No.001-77785 Rev. *B ECN # 4331593 Reliability Test Data QTP #: 120207 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML COMP 15 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML COMP 15 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML COMP 15 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML COMP 5 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML COMP 5 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML COMP 5 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML COMP 5 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML COMP 5 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML COMP 5 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML COMP 5 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML COMP 5 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML COMP 5 0 611200661 RA-CML COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CROSS SECTION STRESS: CONSTRUCTIONAL ANALYIS CY8CTMG200 (8C20466A) 4048174 STRESS: DYE PENETRATION TEST CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML COMP 15 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML COMP 15 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML COMP 15 0 RA-CML COMP 30 0 STRESS: ELECTRICAL CHARACTERIZATION CY8CTMG200 (8C20466A) 4048174 611200661 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 5.75V, Vcc Max) CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 48 1493 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 5.75V, Vcc Max) CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 80 116 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 500 114 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 9 Document No.001-77785 Rev. *B ECN # 4331593 Reliability Test Data QTP #: 120207 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 128 80 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 192 40 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML 128 80 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML 192 40 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML 128 80 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML 192 40 0 STRESS: HIGH TEMP STORAGE, 150C CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 500 114 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 1000 104 0 CY8CTMA300E (8C20323E) 5137028 611158285 RA-CML 1500 94 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 500 114 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 1000 104 0 CY8CTMA300E (8C20323E) 5137028 611158286 RA-CML 1500 104 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 500 114 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 1000 104 0 CY8CTMA300E (8C20323E) 5137028 611158287 RA-CML 1500 104 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML COMP 5 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML COMP 5 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 168 109 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 288 99 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML 168 109 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML 288 99 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML 168 80 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML 288 99 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 9 Document No.001-77785 Rev. *B ECN # 4331593 Reliability Test Data QTP #: 120207 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PHYSICAL DIMENSION CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML COMP 30 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML COMP 30 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML COMP 30 0 611200661 RA-CML COMP 4 0 611200661 RA-CML COMP 3 0 RA-CML COMP 3 0 RA-CML 128 5 0 RA-CML 1000 5 0 STRESS: POST MSL3 BALL SHEAR CY8CTMG200 (8C20466A) 4048174 STRESS: POST MSL3 BOND PULL CY8CTMG200 (8C20466A) 4048174 STRESS: POST MSL3 CONSTRUCTIONAL ANALYSIS CY8CTMG200 (8C20466A) 4048174 611200661 STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR CY8CTMG200 (8C20466A) 4048174 611200661 STRESS: POST HIGH TEMP STORAGE BALL SHEAR CY8CTMA300E (8C20323E) 5137028 611158285 STRESS: POST PRESSURE COOKER TEST BALL SHEAR TEST CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 168 5 0 611200661 RA-CML 500 5 0 RA-CML 1000 5 0 128 5 0 STRESS: POST TC BALL SHEAR CY8CTMG200 (8C20466A) 4048174 STRESS: POST HIGH TEMP STORAGE BOND PULL CY8CTMA300E (8C20323E) 5137028 611158285 STRESS: POST HI-ACCEL SATURATION TEST BOND PULL CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML STRESS: POST PRESSURE COOKER TEST BOND PULL TEST CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 168 5 0 611200661 RA-CML 500 5 0 STRESS: POST TC BOND PULL CY8CTMG200 (8C20466A) 4048174 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 9 Document No.001-77785 Rev. *B ECN # 4331593 Reliability Test Data QTP #: 120207 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 500 109 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 1000 99 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 1500 88 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML 500 109 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML 1000 99 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML 1500 88 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML 500 109 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML 1000 99 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML 1500 89 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 200 109 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML 1000 99 0 CY8CTMG200 (8C20466A) 4048174 611200661 RA-CML COMP 15 0 CY8CTMG200 (8C20466A) 4048174 611200662 RA-CML COMP 15 0 CY8CTMG200 (8C20466A) 4048174 611200663 RA-CML COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 9 Document No.001-77785 Rev. *B ECN # 4331593 Document History Page Document Title: Document Number: Rev. ECN No. ** 3553253 *A 3577076 *B QTP120207: 32 QFN (5X5X0.6MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW CML-RA 001-77785 Orig. of Change NSR NSR 4331593 JYF Description of Change Initial spec release Added extended readpoints 1500 Cycle TCT, 192H HAST and 1500H HTS. Added the reference Industry Standards (JEDEC and MIL) in the stress test conditions table. Sunset review: Alignment of QTP title page and Reliability Tests Performed table to standard template; Updated Assembly Process Flow spec reference from 001-60425M to 001-80667 in Major Package Information table. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 9