Document No.001-89588 Rev. *A ECN # 4535020 Cypress Semiconductor Package Qualification Report QTP# 090603 VERSION*A October, 2014 48-Lead QFN (Quad Flat No-Lead) (7x7x1.0 mm) NiPdAu-Ag, MSL3, 260°C Reflow, Amkor-Philippines (MB) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-89588 Rev. *A ECN # 4535020 PACKAGE QUALIFICATION HISTORY QTP Number 090603 Description of Qualification Purpose To qualify 48QFN (7X7X1.0) Saw Type Pb-Free (NiPdAu-Ag) using AMK-06 epoxy, and Nitto 7470-LA Mold compound, MSL3 and 260C Reflow at Amkor Phil (P3) Company Confidential A printed copy of this document is considered uncontrolled. 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Page 2 of 7 Date Mar 09 Document No.001-89588 Rev. *A ECN # 4535020 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate : LT48A 48- Quad Flat No Lead (QFN) 7470-LA Nitto UL-94 NA Oxygen Rating Index: NA Lead Frame Material: Copper Alloy Frame (C7025) Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Henkel Die Attach Material: AMK-06 Die Attach Method: Epoxy Bond Diagram Designation 001-48083 Wire Bond Method: Thermosonic Wire Material/Size: Au, 0.8mil Thermal Resistance Theta JA °C/W: 25°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-20659 Name/Location of Assembly (prime) facility: Amkor-Philippines (MB) ELECTRICAL TEST/FINISH DESCRIPTION Test Location CML-R Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 7 Document No.001-89588 Rev. *A ECN # 4535020 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Temperature Cycle Precondition: JESD22 Moisture Sensitivity MSL3 P 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C JEDEC STD 22-A110: 130°C, 3.63/3.8V, 85% RH High Accelerated Saturation Test Precondition: JESD22 Moisture Sensitivity MSL3 P 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C JESD22-A102: 121°C, 100%RH, 15 Psig Pressure Cooker Test Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P J-STD-020 Acoustics Microscopy Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs, 30°C/60%RH+ Reflow, 260°C+0, -5°C P Ball Shear JESD22-B116, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, 1.33, Ppk : 1.66 P Criteria: Meet external and internal characteristics of Constructional Analysis Die Shear Dye Penetration test Cypress package MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Criteria: No Package Crack P P P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V JESD22-C101 P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V JEDEC EIA/JESD22-A114 P Final Visual JESD22-B101 P Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P J-STD-002, JESD22-B102 Solderability, Steam Aged 95% solder coverage minimum P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C P X-Ray MIL-STD-883 2012 P Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 Document No.001-89588 Rev. *A ECN # 4535020 Reliability Test Data QTP #:090603 Device Fab Lot# Assy Lot # CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M COMP 15 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M COMP 15 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M COMP 15 0 4823626 610841281 PHIL-M COMP 10 0 4823626 610841281 PHIL-M COMP 10 0 4803351 610839924 PHIL-M COMP 5 0 4823626 610841281 PHIL-M COMP 10 0 STRESS: STRESS: DIE SHEAR DYE PENETRANT TEST CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M COMP 15 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M COMP 15 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M COMP 15 0 610839923 PHIL-M COMP 7 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CYWUSB6934 (7B6934BC) STRESS: Failure Mechanism CONSTRUCTIONAL ANALYSIS CY7C65640A (7C65642EC) STRESS: Rej BOND PULL CYWUSB6934 (7B6934BC) STRESS: Samp BALL SHEAR CY7C65640A (7C65642EC) STRESS: Duration ACOUSTIC, MSL3 CY7C65640A (7C65642EC) STRESS: Assy Loc 4803351 ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V CYWUSB6934 (7B6934BC) 4803351 610839923 PHIL-M COMP 8 0 4823626 610841281 PHIL-M COMP 996 0 STRESS: FINAL VISUAL CY7C65640A (7C65642EC) STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.8V, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642EC) STRESS: 4823626 610841281 PHIL-M 128 77 0 HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V, PRE COND 192 HR 30C/60%RH, MSL3 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M 128 77 0 4823626 610841281 PHIL-M COMP 5 0 STRESS: INTERNAL VISUAL CY7C65640A (7C65642EC) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-89588 Rev. *A ECN # 4535020 Reliability Test Data QTP #:090603 Device Fab Lot# Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 168 77 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M 168 77 0 STRESS: PHYSICAL DIMENSION CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M COMP 30 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M COMP 30 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M COMP 30 0 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M COMP 5 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M COMP 5 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M COMP 5 0 STRESS: SOLDERABILITY STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 500 77 0 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 1000 77 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M 500 77 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M 1000 77 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M 500 77 0 CYWUSB6934 (7B6934BC) 4803351 610839924 PHIL-M 1000 77 0 STRESS: THERMAL SHOCK COND. B – 55C TO 125C CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 200 77 0 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M 1000 77 0 CY7C65640A (7C65642EC) 4823626 610841281 PHIL-M COMP 10 0 CY7C65640A (7C65642EC) 4823626 610841285 PHIL-M COMP 10 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-89588 Rev. *A ECN # 4535020 Document History Page Document Title: QTP# 090603: 48-LEAD QFN (QUAD FLAT NO-LEAD) (7 X 7 X 1.0MM), NIPDAU-AG, MSL3, 260C REFLOW, AMKOR-PHILIPPINES (MB) 001-89588 Document Number: Rev. ECN No. ** 4149279 *A 4535020 Orig. of Change JYF JYF Description of Change Initial Spec Release. Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7