QTP 114401:24 QFN (4X4X0.6MM), 32/36 QFN(5X5X0.6MM) NIPDAU, CU-PD WIRE, MSL3 260C REFLOW ASEK- TAIWAN

Document No.001-75329 Rev. *B
ECN # 4648768
Cypress Semiconductor
Package Qualification Report
QTP# 114401 VERSION*B
February, 2015
24 QFN (4x4x0.6mm)/ 32/36 QFN(5x5x0.6mm)
NiPdAu, Cu-Pd Wire
MSL3, 260°°C Reflow
ASEK-Taiwan (G)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda (JYF)
Reliability Engineer
Reviewed By:
Rene Rodgers (RT)
Reliability Manager
Approved By:
Richard Oshiro (RGO)
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
Document No.001-75329 Rev. *B
ECN # 4648768
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
114401
Qualification of Copper (Cu-Pd) wire bond on 24 QFN(4x4x0.6mm) and
32/36 QFN (5x5x0.6mm) package dimensions at ASE , Kaohsiung
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
Date
Jan
2012
Document No.001-75329 Rev. *B
ECN # 4648768
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Mold Compound Name/Manufacturer:
LQ24A/ LQ32A/LQ36
24 Quad Flat No-Lead (4X4X0.6mm)
32 / 36 Quad Flat No-Lead (5x5x0.6mm)
G631 / Sumitomo
Mold Compound Flammability Rating:
V-0 / UL94
Mold Compound Alpha Emission Rate:
N/A
Oxygen Rating Index: >28%
54 (typical) / 28 (Min. value)
Lead Frame Designation:
Full Metal Pad
Lead Frame Material:
Copper /PPF
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
SAW Process
Die Attach Supplier:
Hitachi
Die Attach Material:
EN-4900
Bond Diagram Designation
001-69159
Wire Bond Method:
Thermosonic
Wire Material/Size:
Package Cross Section Yes/No:
0.8mil / Cu- Pd
LQ24A Device 7C638055AK - 35°C/W
LQ24A Device 8C20334BK - 96°C/W
LQ32A Device 8C204662B - 19.51°C/W
Yes
Assembly Process Flow:
001-70516M
Name/Location of Assembly (prime) facility:
G-ASEK Taiwan
MSL LEVEL
3
REFLOW PROFILE
260C
Package Outline, Type, or Name:
Thermal Resistance Theta JA °C/W:
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No.001-75329 Rev. *B
ECN # 4648768
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Temperature Operating Life
Early Failure Rate
High Temperature Operating Life
Latent Failure Rate
High Accelerated Saturation Test
(HAST)
Pressure Cooker Test
Temperature Cycle
High Temp Storage
Test Condition (Temp/Bias)
Dynamic Operating Condition, Vcc = 2.1V, 150°C
JESD22-A108
Dynamic Operating Condition, Vcc = 2.1V, 150°C
JESD22-A108
JEDEC STD 22-A110: 130°C, 85%RH, 5.25V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30°C, 60% RH, 260°C Reflow)
JESD22-A102: 121°C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30°C, 60% RH, 260°C Reflow)
MIL-STD-883, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30°C, 60% RH, 260°C Reflow)
JESD22-A103:150°C, no bias
Acoustic Microscopy
Ball Shear
Bond Pull
Constructional Analysis
Dye Penetrant Test
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30°C, 60% RH, 260°C Reflow)
JESD22-B116
Cpk : 1.33, Ppk : 1.66
MIL-STD-883 – Method 2011,
Cpk : 1.33, Ppk : 1.66
Criteria: Meet external and internal characteristics of
Cypress package
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
Result
P/F
P
P
P
P
P
P
P
P
P
P
P
Internal Visual
MIL-STD-883-2014
P
Final Visual Inspection
JESD22-B101
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Thermal Shock
MIL-STD-883, Method 1011, Condition B, -55°C to 125°C and
JESD22-A106, Condition C, -55°C to 125°C
P
X-Ray
MIL-STD-883 – 2012
P
Post Stress Ball Shear
JESD22-A116
P
Post Stress Bond Shear
MIL-STD-883 – 2011
P
Electrical Characterization
AEC-Q100-009
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 8
Document No.001-75329 Rev. *B
ECN # 4648768
Reliability Test Data
QTP #: 114401
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
COMP
15
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
COMP
15
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
15
0
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
COMP
5
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
COMP
5
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
5
0
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
COMP
5
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
COMP
5
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
5
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYIS
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
COMP
15
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
COMP
15
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
15
0
STRESS: DYE PENETRATION TEST
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
COMP
15
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
COMP
15
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
15
0
STRESS: ELECTRICAL CHARACTERIZATION
CY8C20466A(8C2046625AK)
5104069
611128980
G-TAIWAN
COMP
30
0
CY8CTMA301E(8C20313DC)
4102579
611121438
G-TAIWAN
COMP
30
0
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
128
79
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
128
80
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max)
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
48
1500
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Document No.001-75329 Rev. *B
ECN # 4648768
Reliability Test Data
QTP #: 114401
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max)
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
500
116
0
STRESS: HIGH TEMP STORAGE, 150C
CY8C20466A(8C2046625AK)
5104069
611128980
G-TAIWAN
1000
80
0
CY8C20466A(8C2046625AK)
5104069
611128981
G-TAIWAN
1000
80
0
CY8CTMA301E(8C20313DC)
4102579
611121438
G-TAIWAN
1000
80
0
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
COMP
5
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
COMP
5
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
5
0
STRESS: INTERNAL VISUAL
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
168
220
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
168
220
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
168
220
0
STRESS: PHYSICAL DIMENSION
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
COMP
5
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
COMP
5
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
5
0
611145346
G-TAIWAN
COMP
1
0
611145346
G-TAIWAN
COMP
1
0
STRESS: POST MSL3 BALL SHEAR
CY8CTMG240 (8C204662BK)
5125017
STRESS: POST MSL3 BOND SHEAR
CY8CTMG240 (8C204662BK)
5125017
STRESS: POST MSL3 CONSTRUCTIONAL ANALYSIS
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
COMP
1
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
COMP
1
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
1
0
COMP
5
0
STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Document No.001-75329 Rev. *B
ECN # 4648768
STRESS: POST HIGH TEMP STORAGE BALL SHEAR
CY8C20466A(8C2046625AK)
5104069
611128980
G-TAIWAN
COMP
5
0
CY8CTMA301E(8C20313DC)
4102579
611121438
G-TAIWAN
COMP
5
0
STRESS: POST PRESSURE COOKER TEST BALL SHEAR TEST
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
5
0
611145346
G-TAIWAN
COMP
5
0
G-TAIWAN
COMP
5
0
G-TAIWAN
COMP
5
0
STRESS: POST TC BALL SHEAR
CY8CTMG240 (8C204662BK)
5125017
STRESS: POST HI-ACCEL SATURATION TEST BOND SHEAR
CY8CTMG240 (8C204662BK)
5125017
611145346
STRESS: POST HIGH TEMP STORAGE BOND SHEAR
CY8CTMG240 (8C204662BK)
5125017
611145346
STRESS: POST PRESSURE COOKER TEST BOND SHEAR TEST
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
5
0
611145346
G-TAIWAN
COMP
5
0
STRESS: POST TC BOND SHEAR
CY8CTMG240 (8C204662BK)
5125017
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
500
220
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
500
220
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
500
220
0
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
200
100
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
200
100
0
CY7C63803 (7C638055AK)
5119008
611144727
G-TAIWAN
COMP
15
0
CY8C20324 (8C20334BK)
5111046
611144587
G-TAIWAN
COMP
15
0
CY8CTMG240 (8C204662BK)
5125017
611145346
G-TAIWAN
COMP
15
0
STRESS: THERMAL SHOCK
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Document No.001-75329 Rev. *B
ECN # 4648768
Document History Page
Document Title:
QTP 114401: 24 QFN (4X4X0.6MM), 32/36 QFN(5x5x0.6mm) NIPDAU, CU-PD Wire, MSL3
260C REFLOW ASEK- TAIWAN
Document Number:
001-75329
Rev. ECN
No.
**
3473919
*A
4272218
*B
4648768
Orig. of
Change
ILZ
JYF
JYF
Description of Change
Initial spec release
No Change
Sunset review:
Updated QTP title page and Reliability Tests Performed table
(EFR/LFR, HAST, PCT, HTS, Acoustic, Ball Shear, Bond Pull, CA,
DPT, IVI/FVI, Physical Dimension, Therml Shock) for template
alignment.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
Similar pages
QTP 114404:56QFN (7X7X0.6MM) NIPDAU, CU-PD WIRE, MSL3 260C REFLOW ASEK- TAIWAN (G)
Print RoHS Certificate of Compliance
QTP 114403 :48 QFN(6X6X0.6MM) NIPDAU, CU-PD WIRE MSL3, 260C REFLOW ASEK-TAIWAN
QTP 114904:40 QFN (6X6X1.0MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G)
QTP 112603:16 QFN (3X3X0.6MM), NIPDAU-AG, MSL3 260C REFLOW ASEK- TAIWAN
QTP 114903:16 QFN (3X3X0.6MM) 08 DFN (5X6X0.8MM) NIPDAU-AG, 100% CU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G)
QTP 114907:32 QFN (5X5X1.0MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G)
QTP 112104:32 QFN (5X5X0.6 MILS) / 36 QFN (5X5X0.6 MILS), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP 90603 48-Lead QFN (Quad Flat No-Lead) (7x7x1.0 mm) NiPdAu-Ag, MSL3, 260°C Reflow, Amkor-Philippines (MB).pdf
QTP 104807:48-LEAD QFN (6X6X0.6MM),24-LEAD QFN (4X4X0.6MM),32-LEAD QFN (5X5X0.6MM) NIPDAU-AG, MSL3, 260C REFLOW K1-AMKOR (L) QUALIFICATION REPORT
QTP 111812:32 QFN (5X5X1.0 MILS) / 40 QFN (6X6X1.0 MILS), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP 134802 24 QFN (4x4x0.6mm) Pure Sn, CuPd Wire MSL3, 260°C Reflow ASE-Taiwan (G).pdf
QTP 102610:48-LEAD QFN (7X7X1.0 MM) NIPDAU, MSL3, 260C REFLOW CML-RA
QTP120207 32 QFN (5X5X0.6MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW CML-RA.pdf
QTP 103308:165 - BALL FBGA (15X17X1.4MM) FOR 144M 65NM, SNAGCU, MSL3, 260C AT CML-RA QUALIFICATION REPORT
QTP NO 030301 :8-LEAD SOIC, MSL3, 235C, 260C, AMKOR PHILS.pdf
QTP 112106:40 QFN (6X6X1.0MM) / 48 QFN (7X7X1.0MM), STACK DIE, NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP 120205 48 QFN (6X6X0.6MM) / 36 QFN (5X5X0.6MM) / 56 QFN (7X7X0.6MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW CML-RA.pdf
QTP 101208:48-LEAD SSOP, KEG3000 M/C, NIPDAU, MSL3, 260C REFLOW CML-RA
QTP 104802:48L/56L SSOP (300 MILS), NIPDAU, MSL3 260C REFLOW JCET- CHINA (JT)
QTP 84006 40 Lead Saw QFN (Quad Flat No-Lead) (6 x 6 x 1mm) NiPdAu-Ag, MSL3, 260°C Reflow, ASE-Shanghai.pdf
QTP 104609:WIRELESS USB FAMILY (CYRF8935), 0.18UM, TSMC