DATA SHEET book, halfpage M3D123 BFG25AW; BFG25AW/X NPN 5 GHz wideband transistors Product specification Supersedes data of August 1995 1998 Sep 23 Philips Semiconductors Product specification NPN 5 GHz wideband transistors FEATURES BFG25AW; BFG25AW/X PINNING • Low current consumption (100 µA to 1 mA) • Low noise figure • Gold metallization ensures excellent reliability. APPLICATIONS Wideband applications in UHF low power amplifiers, such as pocket telephones and paging systems. DESCRIPTION PIN DESCRIPTION fpage 4 3 1 2 BFG25AW 1 collector 2 base 3 emitter 4 emitter Top view BFG25AW/X MBK523 Fig.1 SOT343N. 1 collector 2 emitter 3 base 4 emitter MARKING TYPE NUMBER NPN silicon planar epitaxial transistor in a 4-pin dual-emitter SOT343N plastic package. CODE BFG25AW N6 BFG25AW/X V1 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCBO collector-base voltage open emitter − − 8 V VCEO collector-emitter voltage open base − − 5 V IC collector current (DC) − − 6.5 mA Ptot total power dissipation − − 500 mW hFE DC current gain IC = 0.5 mA; VCE = 1 V 50 80 200 Cre feedback capacitance IC = 0; VCE = 1 V; f = 1 MHz − 0.2 0.3 pF fT transition frequency IC = 1 mA; VCE = 1 V; f = 500 MHz; Tamb = 25 °C 3.5 5 − GHz GUM maximum unilateral power gain IC = 0.5 mA; VCE = 1 V; f = 1 GHz; Tamb = 25 °C − 16 − dB F noise figure Γs = Γopt; IC = 1 mA; VCE = 1 V; f = 1 GHz − 2 − dB Ts ≤ 85 °C LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT open emitter − 8 V collector-emitter voltage open base − 5 V emitter-base voltage open collector − 2 V − 6.5 mA VCBO collector-base voltage VCEO VEBO IC collector current (DC) Ptot total power dissipation − 500 mW Tstg storage temperature Ts ≤ 85 °C; see Fig.2; note 1 −65 +150 °C Tj junction temperature − 175 °C Note 1. Ts is the temperature at the soldering point of the collector pin. 1998 Sep 23 2 Philips Semiconductors Product specification NPN 5 GHz wideband transistors BFG25AW; BFG25AW/X THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER CONDITIONS VALUE UNIT 180 K/W thermal resistance from junction to soldering point Ts ≤ 85 °C; note 1 Note 1. Ts is the temperature at the soldering point of the collector pin. CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS IC = 100 µA; IE = 0 V(BR)CBO collector-base breakdown voltage V(BR)CEO collector-emitter breakdown voltage IC = 1 mA; IB = 0 MIN. TYP. MAX. UNIT − − 8 V − − 5 V V(BR)EBO emitter-base breakdown voltage IE = 100 µA; IC = 0 − − 2 V ICBO collector leakage current open emitter; VCB = 5 V; IE = 0 − − 50 nA hFE DC current gain IC = 0.5 mA; VCE = 1 V 50 80 200 Cre feedback capacitance IC = 0; VCE = 1 V; f = 1 MHz − 0.2 0.3 pF fT transition frequency IC = 1 mA; VCE = 1 V; f = 1 GHz; Tamb = 25 °C 3.5 5 − GHz GUM maximum unilateral power gain; note 1 IC = 0.5 mA; VCE = 1 V; f = 1 GHz; Tamb = 25 °C − 16 − dB IC = 0.5 mA; VCE = 1 V; f = 2 GHz; Tamb = 25 °C − 8 − dB Γs = Γopt; IC = 0.5 mA; VCE = 1 V; f = 1 GHz − 1.9 − dB Γs = Γopt; IC = 1 mA; VCE = 1 V; f = 1 GHz − 2 F noise figure Note dB S 21 2 dB. 1. GUM is the maximum unilateral power gain, assuming S12 is zero. G UM = 10 log -------------------------------------------------------------( 1 – S 11 2 ) ( 1 – S 22 2 ) 1998 Sep 23 3 Philips Semiconductors Product specification NPN 5 GHz wideband transistors BFG25AW; BFG25AW/X MBG248 600 MCD138 100 handbook, halfpage handbook, halfpage h FE P tot 80 (mW) 400 60 40 200 20 0 0 50 100 150 o 0 10 3 200 T s ( C) 10 2 10 1 1 I C (mA) 10 VCE = 1 V. Fig.3 DC current gain as a function of collector current; typical values. Fig.2 Power derating curve. MLB971 0.3 MLB972 6 handbook, halfpage handbook, halfpage Cre fT (GHz) (pF) 0.2 4 0.1 2 0 0 0 2 4 VCE (V) 6 0 1998 Sep 23 2 3 I (mA) 4 C f = 500 MHz; VCE = 1 V; Tamb = 25 °C. IC = 0; f = 1 MHz. Fig.4 1 Feedback capacitance as a function of collector-base voltage; typical values. Fig.5 4 Transition frequency as a function of collector current; typical values. Philips Semiconductors Product specification NPN 5 GHz wideband transistors BFG25AW; BFG25AW/X MLB973 30 MLB974 30 handbook, halfpage handbook, halfpage gain gain (dB) (dB) G UM 20 20 MSG G UM MSG 10 10 0 0 0 1 2 0 3 1 2 3 I C (mA) I C (mA) f = 500 MHz; VCE = 1 V. Fig.6 f = 1 GHz; VCE = 1 V. Gain as a function of collector current; typical values. Fig.7 MLB975 50 Gain as a function of collector current; typical values. MLB976 50 handbook, halfpage handbook, halfpage gain gain (dB) (dB) 40 40 G UM 30 G UM 30 MSG MSG 20 20 10 10 0 0 10 10 2 10 3 f (MHz) 10 4 10 IC = 0.5 mA; VCE = 1 V. Fig.8 1998 Sep 23 10 2 10 3 f (MHz) 10 IC = 1 mA; VCE = 1 V. Gain as a function of frequency; typical values. Fig.9 5 Gain as a function of frequency; typical values. 4 Philips Semiconductors Product specification NPN 5 GHz wideband transistors BFG25AW; BFG25AW/X MCD145 4 MCD146 4 handbook, halfpage handbook, halfpage F (dB) F (dB) f = 2 GHz 3 IC = 2 mA 3 1 GHz 1 mA 500 MHz 2 2 1 1 0 10−1 1 IC (mA) 0.5 mA 0 102 10 VCE = 1 V. 103 104 VCE = 1 V. Fig.10 Minimum noise figure as a function of collector current; typical values. Fig.11 Minimum noise figure as a function of frequency; typical values. 90 o 1.0 handbook, full pagewidth 1 135 o 45 o 2 0.5 0.8 0.6 0.2 0.4 5 0.2 F min = 1.9 dB 180 o 0.2 0 0.5 1 2 5 Γ opt 0o 0 F = 3 dB F = 4 dB F = 5 dB 0.2 0.5 5 2 135 o 45 o 1 MLB977 90 o f = 500 MHz; VCE = 1 V; IC = 1 mA; Zo = 50 Ω. Fig.12 Common emitter noise figure circles; typical values. 1998 Sep 23 f (MHz) 6 1.0 Philips Semiconductors Product specification NPN 5 GHz wideband transistors BFG25AW; BFG25AW/X 90 o 1.0 handbook, full pagewidth 1 135 o 45 o 2 0.5 0.8 stability circle 0.2 0.4 5 F min = 2.0 dB 180 o 0.2 0 0.5 1 2 5 0.6 0.2 Γ opt 0o F = 3 dB 0 F = 4 dB F = 5 dB 5 0.2 0.5 2 135 o 45 o 1 MLB978 1.0 90 o f = 1 GHz; VCE = 1 V; IC = 1 mA; Zo = 50 Ω. Fig.13 Common emitter noise figure circles; typical values. 90 o handbook, full pagewidth 1 135 o stability circle 1.0 45 o 0.8 2 F = 5 dB F = 4 dB F = 3 dB Γ opt 0.5 0.6 F min = 2.4 dB 0.2 0.4 5 unstable region 180 o 0.2 0.2 0 0.5 1 2 5 0o 0 5 0.2 0.5 2 135 o 45 o 1 MLB979 90 o f = 2 GHz; VCE = 1 V; IC = 1 mA; Zo = 50 Ω. Fig.14 Common emitter noise figure circles; typical values. 1998 Sep 23 7 1.0 Philips Semiconductors Product specification NPN 5 GHz wideband transistors BFG25AW; BFG25AW/X 90 o 1.0 handbook, full pagewidth 1 135 o 45 o 2 0.5 0.8 0.6 0.2 0.4 5 0.2 180 o 0.2 0 0.5 1 2 5 0o 0 40 MHz 3 GHz 0.2 5 0.5 2 135 o 45 o 1 MLB980 1.0 90 o VCE = 1 V; IC = 1 mA; Zo = 50 Ω.. Fig.15 Common emitter input reflection coefficient (S11); typical values. 90 o handbook, full pagewidth 135 o 45 o 3 GHz 180 o 40 MHz 5 4 3 2 0o 1 135 o 45 o 90 o MLB981 VCE = 1 V; IC = 1 mA. Fig.16 Common emitter forward transmission coefficient (S21); typical values. 1998 Sep 23 8 Philips Semiconductors Product specification NPN 5 GHz wideband transistors BFG25AW; BFG25AW/X 90 o handbook, full pagewidth 135 o 45 o 3 GHz 180 o 0.5 0.4 0.3 0.2 0.1 40 MHz 0o 135 o 45 o 90 o MLB982 VCE = 1 V; IC = 1 mA. Fig.17 Common emitter reverse transmission coefficient (S12); typical values. 90 o 1.0 handbook, full pagewidth 1 135 o 45 o 2 0.5 0.8 0.6 0.2 0.4 5 0.2 180 o 0.2 0 0.5 1 2 5 0o 0 40 MHz 5 0.2 3 GHz 0.5 2 135 o 45 o 1 MLB983 1.0 90 o VCE = 1 V; IC = 1 mA; Zo = 50 Ω. Fig.18 Common emitter output reflection coefficient (S22); typical values. 1998 Sep 23 9 Philips Semiconductors Product specification NPN 5 GHz wideband transistors BFG25AW; BFG25AW/X SPICE parameters for the BFG25W crystal SEQUENCE No. PARAMETER VALUE SEQUENCE No. UNIT PARAMETER VALUE UNIT 1 IS 13.77 aA 36(1) VJS 750.0 mV 2 BF 85.65 − 37(1) MJS 0.000 − 3 NF 0.980 − 38 FC 0.988 − 4 VAF 50.80 V Note 5 IKF 10.00 A 6 ISE 2.199 fA 1. These parameters have not been extracted, the default values are shown. 7 NE 1.857 − 8 BR 16.97 − 9 NR 0.986 − 10 VAR 2.491 V 11 IKR 188.0 mA 12 ISC 205.1 aA 13 NC 1.107 − 14 RB 80.00 Ω 15 IRB 1.000 µA 16 RBM 80.00 Ω 17 RE 7.911 Ω 18 RC 5.300 Ω 19(1) XTB 0.000 − 20(1) EG 1.110 eV 21(1) XTI 3.000 − 22 CJE 223.0 fF 23 VJE 669.7 mV 24 MJE 0.060 − 25 TF 5.112 ps 26 XTF 7.909 − 27 VTF 1.338 V 28 ITF 5.662 mA Cbe 70 29 PTF 15.37 deg Ccb 50 fF 115 fF C cb handbook, halfpage L1 LB B L2 B' C be C' E' C Cce LE MBC964 L3 E QLB = 50; QLE = 50; QLB,E(f) = QLB,E√(f/fc); fc = scaling frequency = 1 GHz. Fig.19 Package equivalent circuit SOT343N. List of components (see Fig.19) DESIGNATION VALUE UNIT fF 30 CJC 229.0 fF Cce 31 VJC 394.7 mV L1 0.34 nH 32 MJC 0.043 − L2 0.10 nH XCJC 0.050 − L3 0.25 nH TR 13.26 ns LB 0.40 nH CJS 0.000 F LE 0.40 nH 33 34 35 (1) 1998 Sep 23 10 Philips Semiconductors Product specification NPN 5 GHz wideband transistors BFG25AW; BFG25AW/X PACKAGE OUTLINES Plastic surface mounted package; 4 leads SOT343N D E B A X HE y v M A e 4 3 Q A A1 c 1 2 b1 bp w M B Lp e1 detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp b1 c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.4 0.3 0.7 0.5 0.25 0.10 2.2 1.8 1.35 1.15 1.3 1.15 2.2 2.0 0.45 0.15 0.23 0.13 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-05-21 SOT343N 1998 Sep 23 EUROPEAN PROJECTION 11 Philips Semiconductors Product specification NPN 5 GHz wideband transistors BFG25AW; BFG25AW/X DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. 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