DMP2004DMK DUAL P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR NEW PRODUCT Features • • • • • • • • • • Mechanical Data • • Dual P-Channel MOSFET Low On-Resistance Very Low Gate Threshold Voltage VGS(th) < 1V Low Input Capacitance Fast Switching Speed Low Input/Output Leakage Lead Free By Design/RoHS Compliant (Note 2) ESD Protected Gate "Green" Device (Note 3) Qualified to AEC-Q101 standards for High Reliability Case: SOT-26 Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminals Connections: See Diagram Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 Marking Information: See Page 3 Ordering Information: See Page 3 Weight: 0.015 grams (approximate) • • • • • • SOT-26 ESD PROTECTED TOP VIEW D2 G1 S1 S2 G2 D1 TOP VIEW Internal Schematic Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol VDSS VGSS ID IDM Drain-Source Voltage Gate-Source Voltage Drain Current (Note 1) Pulsed Drain Current Thermal Characteristics Value -20 ±8 -550 -1.9 Units V V mA A @TA = 25°C unless otherwise specified Characteristic Total Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient (Note 1) Symbol Pd RθJA Value 500 250 Units mW °C/W Operating and Storage Temperature Range Tj, TSTG -55 to +150 °C Electrical Characteristics Characteristic OFF CHARACTERISTICS (Note 4) Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage ON CHARACTERISTICS (Note 4) Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transfer Admittance Diode Forward Voltage (Note 4) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance Notes: 1. 2. 3. 4. @TA = 25°C unless otherwise specified Symbol Min Typ Max Unit BVDSS IGSS -20 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ -1.0 ±1.0 V μA μA VGS = 0V, ID = -250mA VDS = -20V, VGS = 0V VGS = ±4.5V, VDS = 0V VGS(th) -0.5 ⎯ 0.7 1.1 1.7 -1.0 V 0.9 1.4 2.0 Ω VDS = VGS, ID = -250μA VGS = -4.5V, ID = -430mA VGS = -2.5V, ID = -300mA VGS = -1.8V, ID = -150mA VDS =10V, ID = -0.2A VGS = 0V, IS = 115mA IDSS RDS (ON) ⎯ |Yfs| VBSD 200 -0.5 ⎯ ⎯ ⎯ -1.2 mS V Ciss Coss Crss ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 175 30 20 pF pF pF Test Condition VDS = -16V, VGS = 0V f = 1.0MHz Device mounted on FR-4 PCB. No purposefully added lead. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. Short duration pulse test used to minimize self-heating effect. DMP2004DMK Document number: DS30939 Rev. 3 - 2 1 of 4 www.diodes.com November 2007 © Diodes Incorporated -ID, DRAIN CURRENT (A) -ID, DRAIN CURRENT (A) 0 0 -VGS, GATE SOURCE VOLTAGE (V) Fig. 2 Typical Transfer Characteristics -VDS, DRAIN SOURCE VOLTAGE (V) Fig. 1 Typical Output Characteristics -VGS(th), GATE THRESHOLD VOLTAGE (V) NEW PRODUCT DMP2004DMK TA, AMBIENT TEMPERATURE (°C) Fig. 3 Gate Threshold Voltage vs. Ambient Temperature -ID, DRAIN-SOURCE CURRENT (A) Fig. 4 Static Drain-Source On-Resistance vs. Drain Current 10 -ID, DRAIN-SOURCE CURRENT (A) Fig. 5 Static Drain-Source On-Resistance vs. Drain Current DMP2004DMK Document number: DS30939 Rev. 3 - 2 -ID, DRAIN-SOURCE CURRENT (A) Fig. 6 Static Drain-Source On-Resistance vs. Drain-Source Current vs. Gate Source Voltage 2 of 4 www.diodes.com November 2007 © Diodes Incorporated NEW PRODUCT DMP2004DMK TA, AMBIENT TEMPERATURE (°C) Fig. 7 Static Drain-Source On-State Resistance vs. Ambient Temperature -VDS, DRAIN-SOURCE VOLTAGE (V) Fig. 10 Typical Capacitance -ID, DRAIN CURRENT (A) Fig. 9 Forward Transfer Admittance vs. Drain Current Ordering Information (Note 5) Part Number DMP2004DMK-7 Notes: Case SOT-26 Packaging 3000/Tape & Reel 5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information G1 D2 S1 PAB YM S2 Date Code Key Year Code G2 PAB = Marking Code YM = Date Code Marking Y = Year ex: U = 2007 M = Month ex: 9 = September D1 2007 2008 2009 2010 2011 2012 U V W X Y Z Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D DMP2004DMK Document number: DS30939 Rev. 3 - 2 3 of 4 www.diodes.com November 2007 © Diodes Incorporated DMP2004DMK Package Outline Dimensions A NEW PRODUCT TOP VIEW B C H K M J D F L SOT-26 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D ⎯ ⎯ 0.95 F ⎯ ⎯ 0.55 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 0° 8° α ⎯ All Dimensions in mm Suggested Pad Layout E Z E C G Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 Y 0.80 C 2.40 E 0.95 Y X IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. DMP2004DMK Document number: DS30939 Rev. 3 - 2 4 of 4 www.diodes.com November 2007 © Diodes Incorporated