Document No.001-62081 Rev. *A ECN # 4040635 Cypress Semiconductor Package Qualification Report QTP# 073905 June 2013 172-Ball FBGA (Stacked Die) (15 x 15mm) SnAgCu, MSL3, 260C Reflow ASE-Taiwan (G) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Reliability Director (408) 943-2675 Rene Rodgers Reliability Engineer, MTS (408) 943–2732 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-62081 Rev. *A ECN # 4040635 PACKAGE QUALIFICATION HISTORY Qual Report 073905 Description of Qualification Purpose 172-Ball FBGA (Stacked Die) (15 x 15mm), SnAgCu, MSL3, 260C Reflow assembled at ASETaiwan (G) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Date Comp Jun 10 Document No.001-62081 Rev. *A ECN # 4040635 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: BB172 Package Outline, Type, or Name: 172-Ball FBGA Stacked Die Mold Compound Name/Manufacturer: KE-G-2270/Kyocera Mold Compound Flammability Rating: UL-94 Mold Compound Alpha Emission Rate : N/A Oxygen Rating Index: N/A Substrate Material: ASEM Lead Finish, Composition / Thickness: SnAgCu Die Backside Preparation Method/Metallization: Backgrinding Die Separation Method: Saw Die Attach Supplier: Die Attach Method: Ablestik/QMI Die Attach 1: Ablestik 2025D Die Attach 2: QMI536 Epoxy Bond Diagram Designation: 001-16784 Wire Bond Method: Thermosonic Wire Material/Size: 1.0 mil Thermal Resistance Theta JA °C/W: N/A Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: ASE-Taiwan (G) MSL Level 3 Reflow Profile 260C Die Attach Material: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R, KYEC-Taiwan, G-Taiwan Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 7 Document No.001-62081 Rev. *A ECN # 4040635 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 P Ball Shear JESD22-B116A, Cpk : 1.33, Ppk : 1.66 P Final Visual JESD22-B101B P Internal Visual MIL-STD-883-2014 P High Accelerated Saturation Test (HAST) Pressure Cooker 130C, 85%RH, 3.6V Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs., 30C/60%RH+3IR-Reflow, 260C+0, -5C P 130C, 85%RH, 3.63V Precondition: JESD22 Moisture Sensitivity MSL5 72 Hrs., 30C/60%RH+3IR-Reflow, 260C+0, -5C 121°C, 100%RH Precondition: JESD22 Moisture Sensitivity MSL3 P 192 Hrs., 30C/60%RH+3IR-Reflow, 260C+0, -5C Solderability JESD22-B116A P Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65C to 150C Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs., 30C/60%RH+3IR-Reflow, 260C+0, -5C P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 Document No.001-62081 Rev. *A ECN # 4040635 Reliability Test Data QTP #: 073905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY7C0853AV (7C08533BC) 4625447 610722410 TAIWAN-G COMP 15 0 CY7C0853AV (7C08533BC) 4627264 610724033 TAIWAN-G COMP 15 0 CY7C0853AV (7C08533BC) 4629088 610724229 TAIWAN-G COMP 15 0 CY7C0853AV (7C08533AC) 4616921 610816418 TAIWAN-G COMP 140 0 CY7C0853AV (7C08533AC) 4616921 610816416 TAIWAN-G COMP 155 0 STRESS: FINAL VISUAL STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.6V), PRE COND 192 HR 30C/60%RH, MSL3 CY7C1474V33 (7C1474AC) 4423980 610466039 TAIWAN-G 128 48 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.63V), PRE COND HR 30C/60%RH, MSL5 CY62177DV30L (7C62172DC) 4504324 610518429 TAIWAN-G CY7C0853AV (7C08533AC) 4616921 610816418 TAIWAN-G CY7C0853AV (7C08533AC) 4616921 610816416 TAIWAN-G 128 45 0 COMP 5 0 COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C0853AV (7C08533BC) 4625447 610722410 TAIWAN-G 168 80 0 STRESS: SOLDER BALL SHEAR CY7C0853AV (7C08533AC) 4616921 610816418 TAIWAN-G COMP 5 0 CY7C0853AV (7C08533AC) 4616921 610816416 TAIWAN-G COMP 5 0 CY7C0853AV (7C08533BC) 4625447 610722410 TAIWAN-G COMP 3 0 CY7C0853AV (7C08533BC) 4627264 610724033 TAIWAN-G COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C -65C TO 150C, PRE COND192 HRS 30C/60%RH, MSL3 CY7C0853AV (7C08533BC) 4625447 610722410 TAIWAN-G 500 80 0 CY7C0853AV (7C08533BC) 4625447 610722410 TAIWAN-G 1000 80 0 CY7C0853AV (7C08533BC) 4627264 610724033 TAIWAN-G 500 79 0 CY7C0853AV (7C08533BC) 4627264 610724033 TAIWAN-G 1000 79 0 CY7C0853AV (7C08533BC) 4629088 610724229 TAIWAN-G 500 80 0 CY7C0853AV (7C08533BC) 4629088 610724229 TAIWAN-G 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-62081 Rev. *A ECN # 4040635 Reliability Test Data QTP #: 073905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: CROSS SECTION CY7C0853AV (7C08533AC) 4616921 610816418 TAIWAN-G COMP 5 0 CY7C0853AV (7C08533AC) 4616921 610816416 TAIWAN-G COMP 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-62081 Rev. *A ECN # 4040635 History Page Document Title: 073905: 172-BALL FBGA (STACKED DIE) (15 X 15MM) SNAGCU, MSL3, 260C REFLOW ASE-TAIWAN (G) Document Number: 001-62081 Rev. ECN No. ** 2943601 *A 4040635 Orig. of Change HGA NSR Description of Change Initial spec release Removed VERSION 1.0 in the title page. Updated Cypress Technical Contact For Qualification Data. Added KYEC-Taiwan and G-Taiwan in test site. Removed wetting balance since it was not part of tests requirements for BGA package. Corrected HAST data. Removed reference Cypress Specs and retain the reference industry standards in Reliability Tests performed table. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7