Document No. 001-85253 Rev. *A ECN #: 4612981 Cypress Semiconductor Package Qualification Report QTP# 030301 VERSION*A January, 2015 8-Lead SOIC Package Pb-Free, MSL3 235C & 260C Reflow PHIL-M FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro (RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 6 Document No. 001-85253 Rev. *A ECN #: 4612981 PACKAGE QUALIFICATION HISTORY QUAL REPORT DESCRIPTION OF QUALIFICATION PURPOSE DATE COMP. 030301 8-Lead (150mil) SOIC package, Pb-Free, @ 260C Solder Reflow Peak, MSL1 @ ANAM-PHIL May 03 030301 Cypress established policy requiring MSL and Reflow Peak Temperature alignment for Cypress and its Assembly Subcontractors. Downgrade from MSL1 to MSL3 Nov 06 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 6 Document No. 001-85253 Rev. *A ECN #: 4612981 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: S08 8-Lead Plastic Small Outline IC Package (SOIC) EME-6600H V-O per UL94 Oxygen Rating Index: >28% Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: N/A Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8290 Die Attach Method: Silver Epoxy Bond Diagram Designation Not Applicable Wire Bond Method: Thermosonic Wire Material/Size: Gold 1.0mil Thermal Resistance Theta JA °C/W: 191.8° Theta JA C/W Package Cross Section Yes/No: N/A Assembly Process Flow: Not Applicable Name/Location of Assembly (prime) facility: ANAM Philippines (PHIL-M) MSL Level 3 Reflow Profile 235C & 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Note: Please contact a Cypress Representative for other packages availability Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 6 Document No. 001-85253 Rev. *A ECN #: 4612981 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Temperature Cycle Test Condition (Temp/Bias) MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity MSL 1 Result P/F P (168 Hrs., 85°C, 85% RH, 260°C Reflow) JESD22-A102: 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL 1 Pressure Cooker P (168 Hrs., 85°C, 85% RH, 260°C Reflow) High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C,85%RH,3.3V Precondition: JESD22 Moisture Sensitivity MSL 1 (168 Hrs., 85°C, 85% RH, 260°C Reflow) P External Visual MIL-PRF-38535, MIL-STD-883, Method 2009 P Adhesion of Lead Finish MIL-STD-883, Method 2025 – Adhesion of Lead Finish P Solderability, Steam Aged J-STD-002, JESD22-B102 95% solder coverage minimum J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (168 Hrs., 85°C, 85% RH, 260°C Reflow) Acoustic Microscopy Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 6 P P Document No. 001-85253 Rev. *A ECN #: 4612981 Reliability Test Data QTP #: Device Fab Lot # 030301 Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC - MICROSCOPE, MSL1 CY27022-SC (7C827022A) 9214305 610239606 PHIL-M COMP 15 0 CY27022-SC (7C827022A) 9214305 610239607 PHIL-M COMP 15 0 CY27022-SC (7C827022A) 9214305 610239608 PHIL-M COMP 15 0 CY27022-SC (7C827022A) 9214305 610239606 PHIL-M COMP 15 0 CY27022-SC (7C827022A) 9214305 610239608 PHIL-M COMP 15 0 CY27022-SC (7C827022A) 9214305 610239606 PHIL-M COMP 5 0 CY27022-SC (7C827022A) 9214305 610239608 PHIL-M COMP 5 0 STRESS: EXTERNAL VISUAL STRESS: SOLDERABILITY STRESS: ADHESION OF LEAD FINISH CY27022-SC (7C827022A) 9214305 610239606 PHIL-M COMP 5 0 CY27022-SC (7C827022A) 9214305 610239608 PHIL-M COMP 5 0 STRESS: HI-ACCEL SATURATION TEST. 130C, 3.3V, 85%RH, PRE COND 168 HR 85C/85%RH, MSL 1 CY27022-SC (7C827022A) 9214305 610239606 PHIL-M 128 50 0 CY27022-SC (7C827022A) 9214305 610239608 PHIL-M 128 50 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1 CY27022-SC (7C827022A) 9214305 610239606 PHIL-M 176 46 0 STRESS: TC COND. C -65C TO 150C, PRE COND 168 HRS 85C/85%RH, MSL1 CY27022-SC (7C827022A) 9214305 610239606 PHIL-M 300 50 0 CY27022-SC (7C827022A) 9214305 610239606 PHIL-M 500 50 0 CY27022-SC (7C827022A) 9214305 610239606 PHIL-M 1000 50 0 CY27022-SC (7C827022A) 9214305 610239607 PHIL-M 300 42 0 CY27022-SC (7C827022A) 9214305 610239607 PHIL-M 500 42 0 CY27022-SC (7C827022A) 9214305 610239607 PHIL-M 1000 42 0 CY27022-SC (7C827022A) 9214305 610239608 PHIL-M 300 50 0 CY27022-SC (7C827022A) 9214305 610239608 PHIL-M 500 50 0 CY27022-SC (7C827022A) 9214305 610239608 PHIL-M 1000 50 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 6 Document No. 001-85253 Rev. *A ECN #: 4612981 Document History Page Document Title: Document Number: Rev. ECN No. ** 3839090 *A 4612981 QTP NO. 030301 : 8-LEAD SOIC, MSL3, 235C, 260C, AMKOR PHILS. 001-85253 Orig. of Change HLR JYF Description of Change Initial Spec Release. Updated QTP title page and Reliability Tests Performed table (TCT,PCT,HAST,EVI,Solderability,Acoustic) for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 6