Document No.001-89567 Rev. *A ECN # 4526822 Cypress Semiconductor Package Qualification Report QTP# 063503 VERSION*A October, 2014 < 28-Lead SSOP (209 mils) NiPdAu, MSL3,260C Solder Reflow Amkor-Philippines (M) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 6 Document No.001-89567 Rev. *A ECN # 4526822 PACKAGE QUALIFICATION HISTORY QTP Number 063503 Description of Qualification Purpose Qualify Amkor-Phil. for <28-Lead SSOP (209mils), MSL3, 260C Solder Reflow Temperature Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 6 Date Sep 06 Document No.001-89567 Rev. *A ECN # 4526822 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: O28 28-Lead Shrunk Small Outline Package (SSOP) G600 V-O per UL 94 Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Sawing Die Attach Supplier: Ablestik Die Attach Material: 8290 Die Attach Method: Epoxy Bond Diagram Designation 10-05678 Wire Bond Method: Thermosonic Wire Material/Size: Au. 1.0 mils Thermal Resistance Theta JA °C/W: 96°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 49-14999 Name/Location of Assembly (prime) facility: AMKOR-PHIL (M) MSL Level 3 Reflow Profile 260C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 6 Document No.001-89567 Rev. *A ECN # 4526822 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Acoustic Microscopy Test Condition (Temp/Bias) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level Result P/F P 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C Adhesion of Lead Finish MIL-STD-883, Method 2025 P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C, 5.25V, 85%RH Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C P Pressure Cooker JESD22-A102 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C P Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C P J-STD-002, JESD22-B102 95% solder coverage minimum P Solderability, Steam Aged Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 6 Document No.001-89567 Rev. *A ECN # 4526822 Reliability Test Data QTP #: Device STRESS: Fab Lot # Assy Lot # 063503 Assy Loc Duration Samp Rej ACOUSTIC, MSL3 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M COMP 15 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M COMP 15 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M COMP 15 0 STRESS: Failure Mechanism ADHESION OF LEAD FINISH CY8C29466 (8C29466A) 4547386 610608768 PHIL-M COMP 5 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M COMP 5 0 CY8C29466 (8C29466A) 4549157 610646359 PHIL-M COMP 5 0 4547386 610608768 PHIL-M COMP 1396 0 STRESS: EXTERNALVISUAL CY8C29466 (8C29466A) STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HRS, 30C/60%RH, MSL3 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 128 80 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 96 78 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 128 78 0 STRESS: PRESSURE COOKER TEST, 121C 100%RH, 15 Psig, PRE COND 192 HRS, 30C/60%RH, MSL3 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 96 80 0 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 168 80 0 STRESS: TC CONDITION C, -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 500 80 0 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M 100 75 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 500 80 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M 1000 79 0 CY8C29466 (8C29466A) 4549207 610610435 PHIL-M 1000 80 0 CY8C29466 (8C29466A) 4547386 610608768 PHIL-M COMP 15 0 CY8C29466 (8C29466A) 4548960 610608766 PHIL-M COMP 15 0 STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 6 Document No.001-89567 Rev. *A ECN # 4526822 Document History Page Document Title: QTP# 063503: 28-LEAD SSOP (209 MILS) NIPDAU, MSL3,260C SOLDER REFLOW, AMKORPHILIPPINES (M) 001-89567 Document Number: Rev. ECN No. ** 4148796 *A 4526822 Orig. of Change JYF JYF Description of Change Initial Spec Release. Sunset review: Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 6