QTP 84005 56 QFN and 68 QFN Saw Type (8 x 8 x 1mm) NiPdAu-Ag, MSL3, 260C Reflow ASE-Shanghai.pdf

Document No.001-88448 Rev. **
ECN # 4064141
Cypress Semiconductor
Package Qualification Report
QTP# 084005
July 2013
56 QFN and 68 QFN Saw Type
(8 x 8 x 1mm)
NiPdAu-Ag, MSL3, 260C Reflow
ASE-Shanghai
CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
Rene Rodgers
Reliability Engineer, MTS
(408) 943-2732
Mira Ben-Tzur
Quality Engineering Director
(408) 943-2675
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
Document No.001-88448 Rev. **
ECN # 4064141
PACKAGE QUALIFICATION HISTORY
Qual
Report
084005
Description of Qualification Purpose
Qualify 56L and 68L QFN(8X8X1) Saw Type Pb-Free(NiPdAu-Ag) Package Qualification
at ASE Shanghai
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
Date
Comp
Jan 09
Document No.001-88448 Rev. **
ECN # 4064141
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
LT68/ LT56
56L / 68L- Quad Flat No-Lead (QFN)
G700L/Sumitomo
Mold Compound Alpha Emission Rate :
UL-94
N/A
Oxygen Rating Index:
N/A
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
NiPdAu-Ag
Die Backside Preparation
M th d/M t lli ti
Die Separation Method:
Backgrind
Die Attach Supplier:
Hitachi
Die Attach Material:
EN4900G
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-48188, 001-48115
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au, 0.8mil
Thermal Resistance Theta JA °C/W:
13.05 C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
001-20659
Name/Location of Assembly (prime) facility:
ASE-Shanghai (AE)
MSL Level
3
Reflow Profile
260C
Saw
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R, ASE-G, KYEC
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No.001-88448 Rev. **
ECN # 4064141
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
Acoustic Microscopy
J-STD-020
P
Ball Shear
JESD22-B116A
P
Bond Pull
MIL-STD-883 – Method 2011,
P
Constructional Analysis
Criteria: Meet external and internal characteristics of
P
Cypress package
Die Shear
MIL-STD-883, Method 2019
P
Dye Penetration test
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V
JESD22-C101
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
2,200V
JESD22, Method A114-B
P
Final Visual
JESD22-B101B
P
Internal Visual
MIL-STD-883-2014
P
High Accelerated Saturation Test
(HAST)
130°C, 85%RH, 5.25V
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C
P
High Temperature Storage
150C, no bias
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Pressure Cooker
121°C, 100%RH
Precondition: JESD22 Moisture Sensitivity MSL3
P
192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C
Solderability
J-STD-002, JESD22-B102
P
Temperature Cycle
MIL-STD-883C, Method 1010, Condition C, -65°C to
150°C Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C
P
125C, -55C
Thermal Shock
P
MIL-STD-883C, Method 1011,
X-Ray
MIL-STD-883 - 2012
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 8
P
Document No.001-88448 Rev. **
ECN # 4064141
Reliability Test Data
QTP #: 084005
Device
STRESS:
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
ACOUSTIC, MSL3
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
COMP
15
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
COMP
15
0
CY7C65640A (7C65642EC)
4803351
610838527
SHANGHAI-AE
COMP
15
0
CY8C24994 (8C14994AC)
4826655
610839419
SHANGHAI-AE
COMP
15
0
CY8C24994 (8C14994AC)
4826655
610839417
SHANGHAI-AE
COMP
15
0
CY7C65640A (7C65642EC)
4820094
610838529
SHANGHAI-AE
COMP
15
0
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
COMP
10
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
COMP
10
0
CY8C24994 (8C14994AC)
4826655
610839419
SHANGHAI-AE
COMP
10
0
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
COMP
10
0
CY8C24994 (8C14994AC)
4826655
610839419
SHANGHAI-AE
COMP
10
0
4826655
610839411
SHANGHAI-AE
COMP
3
0
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
COMP
15
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
COMP
15
0
CY8C24994 (8C14994AC)
4826655
610839419
SHANGHAI-AE
COMP
15
0
STRESS:
STRESS:
Failure Mechanism
BALL SHEAR
BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C24994 (8C14994AC)
STRESS: DIE SHEAR
STRESS: DYE PENTRANT TEST
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
COMP
15
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
COMP
15
0
CY7C65640A (7C65642EC)
4803351
610838527
SHANGHAI-AE
COMP
15
0
CY8C24994 (8C14994AC)
4826655
610839419
SHANGHAI-AE
COMP
15
0
CY8C24994 (8C14994AC)
4826655
610839417
SHANGHAI-AE
COMP
15
0
CY7C65640A (7C65642EC)
4820094
610838529
SHANGHAI-AE
COMP
15
0
SHANGHAI-AE
COMP
9
0
COMP
8
0
STRESS:
ESD-CHARGE DEVICE MODEL, 500V
CY8C24994 (8C14994AC)
STRESS:
4826655
610839411
ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 2,200V
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Document No.001-88448 Rev. **
ECN # 4064141
Reliability Test Data
QTP #: 084005
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: FINAL VISUAL
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
COMP
1245
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
COMP
991
0
CY8C24994 (8C14994AC)
4826655
SHANGHAI-AE
COMP
1183
0
STRESS:
610839419
HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND192 HR 30C/60%RH, MSL3
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
128
80
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
128
80
0
CY7C65640A (7C65642EC)
4803351
610838527
SHANGHAI-AE
128
77
0
CY8C24994 (8C14994AC)
4826655
610839419
SHANGHAI-AE
128
80
0
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
COMP
5
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
COMP
5
0
CY7C65640A (7C65642EC)
4803351
610838527
SHANGHAI-AE
COMP
5
0
CY8C24994 (8C14994AC)
4826655
610839419
SHANGHAI-AE
COMP
5
0
CY8C24994 (8C14994AC)
4826655
610839417
SHANGHAI-AE
COMP
5
0
CY7C65640A (7C65642EC)
4820094
610838529
SHANGHAI-AE
COMP
5
0
STRESS:
STRESS:
INTERNAL VISUAL
PRESSURE COOKER TEST, 121C, 100%RH, PRE COND192 HR 30C/60%RH, MSL3
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
168
80
0
CY7C65640A (7C65642EC)
4803351
610838527
SHANGHAI-AE
168
80
0
CY8C24994 (8C14994AC)
4826655
610839419
SHANGHAI-AE
168
80
0
STRESS: PHYSICAL DIMENSIONS
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
COMP
30
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
COMP
30
0
CY7C65640A (7C65642EC)
4803351
610838527
SHANGHAI-AE
COMP
30
0
CY8C24994 (8C14994AC)
4826655
610839419
SHANGHAI-AE
COMP
30
0
CY8C24994 (8C14994AC)
4826655
610839417
SHANGHAI-AE
COMP
30
0
CY7C65640A (7C65642EC)
4820094
610838529
SHANGHAI-AE
COMP
30
0
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
COMP
3
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
COMP
3
0
CY7C65640A (7C65642EC)
4803351
610838527
SHANGHAI-AE
COMP
3
0
STRESS: SOLDERABILITY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Document No.001-88448 Rev. **
ECN # 4064141
Reliability Test Data
QTP #: 084005
Device
STRESS:
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
500
80
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
500
80
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
1000
80
0
CY7C65640A (7C65642EC)
4803351
610838527
SHANGHAI-AE
500
80
0
CY7C65640A (7C65642EC)
4803351
610838527
SHANGHAI-AE
1000
80
0
CY8C24994 (8C14994AC)
4826655
610839419
SHANGHAI-AE
500
80
0
CY8C24994 (8C14994AC)
4826655
610839417
SHANGHAI-AE
500
80
0
CY8C24994 (8C14994AC)
4826655
610839417
SHANGHAI-AE
1000
80
0
CY7C65640A (7C65642EC)
4820094
610838529
SHANGHAI-AE
500
80
0
CY7C65640A (7C65642EC)
4820094
610838529
SHANGHAI-AE
1000
80
0
STRESS: THERMAL SHOCK COND. B – 55C TO 125C
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
200
80
0
CY8C24994 (8C14994AC)
4826655
610839411
SHANGHAI-AE
COMP
15
0
CY8C24994 (8C14994AC)
4826655
610839412
SHANGHAI-AE
COMP
15
0
CY7C65640A (7C65642EC)
4803351
610838527
SHANGHAI-AE
COMP
15
0
STRESS:
X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Document No.001-88448 Rev. **
ECN # 4064141
Document Title: QTP#084005: 56 QFN AND 68 QFN SAW TYPE (8X8X1MM) NIPDAU-AG, MSL3, 260C REFLOW
ASE-SHANGHAI
Document Number: 001-88448
Rev. ECN
Orig. of
No.
Change
**
4064141 HSTO
Description of Change
Initial Spec Release
Qualification report published on Cypress.com is documented on
memo HGA-773 and was transferred to qualification report spec
template.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
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