QTP 104802:48L/56L SSOP (300 MILS), NIPDAU, MSL3 260C REFLOW JCET- CHINA (JT)

Document No.001-68940 Rev. *A
ECN # 4352343
Cypress Semiconductor
Package Qualification Report
QTP# 104802 VERSION *A
April 2014
48/56-Lead SSOP (300 mils)
NiPdAu, MSL3, 260C Reflow
JCET-China (JT)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Rene Rodgers (RT)
MTS Reliability Engineer
Reviewed By:
Loren R. Zapanta (ILZ)
Reliability Manager
Approved By:
Richard Oshiro(RGO)
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 8
Document No.001-68940 Rev. *A
ECN # 4352343
PACKAGE QUALIFICATION HISTORY
QTP
Number
Description of Qualification Purpose
Date
104802
Qualify New Assembly Site (JCET) Qual – for 48L/56L SSOP 300
mils, Pb-Free Package Using KEG3000, QMI-509, 0.9 mil Gold
Wire and NiPdAu Lead Finish
Apr 2011
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 8
Document No.001-68940 Rev. *A
ECN # 4352343
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
SP48 / SP56
Package Outline, Type, or Name:
48L/56L SSOP
Mold Compound Name/Manufacturer:
KEG3000 / Kyocera
Mold Compound Flammability Rating:
V-O per UL94
Mold Compound Alpha Emission Rate:
0.002 CPH/cm2
Oxygen Rating Index: >28%
N/A
Lead Frame Designation:
Reduced Metal Pad
Lead Frame Material:
Copper
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Wafer saw
Die Attach Supplier:
Henkel
Die Attach Material:
QMI 509
Bond Diagram Designation
001-34919, 001-34922, 001-51388
Wire Bond Method:
Thermosonic
Wire Material/Size:
0.9mil / Au
Thermal Resistance Theta JA C/W:
11.3 C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
001-64160
Name/Location of Assembly (prime) facility:
JT-JCET China
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 8
Document No.001-68940 Rev. *A
ECN # 4352343
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Accelerated Saturation Test
(HAST)
Test Condition (Temp/Bias)
Result
P/F
P
High Temp Storage
130 C, 85%RH, 3.3V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
150 C, no bias
Electrostatic Discharge
Human Body Model (ESD-HBM)
Electrostatic Discharge
Charge Device Model (ESD-CDM)
Acoustic Microscopy
(2200V)
JEDEC EIA/JESD22-A114-B
(500V)
JESD22-C101
Cypress Spec. 25-00104
P
Ball Shear
Cypress Spec. 12-00292, Cpk : 1.33, Ppk : 1.66
P
Bond Pull
Cypress Spec. 12-00292, Cpk : 1.33, Ppk : 1.66
P
Constructional Analysis
Cypress Spec. 25-20035
P
Die Shear
Cypress Spec. 12-00292,
Per die size:
 <3000 sq. mils = 1.2 kgf
 30001-5000 sq. mils = 1.2 kgf
 >5001 sq. mils = 1.2 kgf
P
Dye Penetrant Test
Cypress Spec. 25-20027-No Crack
P
Internal Visual
Cypress Spec. 12-00292
P
Final Visual Inspection
Cypress Spec. 12-00292
P
Lead Integrity
JESD22-B105, MIL STD 883
P
Physical Dimension
Cypress Spec. 25-00031, MIL-STD-1835, JESD22-B100
P
Thermal Shock
Cypress Spec. 25-00014
P
Pressure Cooker Test
Temperature Cycle
Solderability, Steam Aged
Cypress Spec. 25-00018, J-STD-002, JESD22-B102
P
P
P
P
P
P
95% solder coverage minimum
X-Ray
MIL-STD-883 - 2012
Company Confidential
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Page 4 of 8
P
Document No.001-68940 Rev. *A
ECN # 4352343
Reliability Test Data
QTP #: 104802
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
15
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
15
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
15
0
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
10
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
10
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
10
0
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
10
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
10
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
10
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYIS
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
5
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
5
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
5
0
STRESS: DYE PENETRATION TEST
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
15
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
15
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
15
0
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
15
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
15
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
15
0
JT-CHINA
COMP
9
0
COMP
8
0
STRESS: DIE SHEAR
STRESS: ESD-CHARGE DEVICE MODEL, (500V)
CY7C68001 (7C68001E)
4032514
611104378
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 8
Document No.001-68940 Rev. *A
ECN # 4352343
Reliability Test Data
QTP #: 104802
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: HI-ACCEL SATURATION TEST, 130C, 3.3V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
128
79
0
4029851
611104380
JT-CHINA
500
80
0
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
5
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
5
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
5
0
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
5
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
5
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
5
0
STRESS: HIGH TEMP STORAGE, 150C
CY14B101KA (7C1401B1C)
STRESS: INTERNAL VISUAL
STRESS: LEAD INTEGRITY
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
168
80
0
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
288
80
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
168
76
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
288
76
0
STRESS: PHYSICAL DIMENSION
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
30
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
30
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
30
0
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
3
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
3
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
3
0
STRESS: SOLDERABILITY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 8
Document No.001-68940 Rev. *A
ECN # 4352343
Reliability Test Data
QTP #: 104802
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
500
80
0
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
1000
80
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
500
80
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
1000
80
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
500
80
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
1000
80
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
200
78
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
1000
77
0
CY7C68001 (7C68001E)
4032514
611104378
JT-CHINA
COMP
15
0
CY14B101KA (7C1401B1C)
4029851
611104380
JT-CHINA
COMP
15
0
CY7C68013A (7C682000B)
4034603
611104379
JT-CHINA
COMP
15
0
STRESS: THERMAL SHOCK
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 8
Document No.001-68940 Rev. *A
ECN # 4352343
Document History Page
Document Title:
Document Number:
Rev. ECN
No.
**
3221509
*A
4352343
QTP 104802:48L/56L SSOP (300 mils), NIPDAU, MSL3 260C REFLOW JCET- CHINA (JT)
001-68940
Orig. of
Change
NSR
RT
Description of Change
Initial spec release
Sunset ReviewAlign spec with current qual report template.
Corrected assembly process flow spec number
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 8
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