Document No.001-68913 Rev. *B ECN # 4267109 Cypress Semiconductor Package Qualification Report QTP# 110909 Jan 2014 100-Lead TQFP (14x14x1.4 mils) 100Ld / 128Ld TQFP (14x20x1.4 mils) Standard and Pb-free NiPdAu, MSL3, 260°°C Reflow JCET-China (JT) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability Engineer, MTS (408) 943–2732 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-68913 Rev. *B ECN # 4267109 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 110909 Qualify New Assembly Site (JCET) Qual – for 100/128L TQFP (14x14/20x1.4), Standard and Pb-Free Package Using KEG6000, QMI-509, 0.9 mil Gold Wire and NiPdAu Lead Finish Apr 2011 132506 TQFP 100 14x20 LFA100RUPD with Capton Tape Qualification Jan 2014 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.001-68913 Rev. *B ECN # 4267109 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: AZ0AA Package Outline, Type, or Name: 100L TQFP Mold Compound Name/Manufacturer: KEG6000 / Kyocera Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: 0.002 CPH/cm2 Oxygen Rating Index: >28% N/A Lead Frame Designation: Reduced Metal Pad Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafersaw Die Attach Supplier: Henkel Die Attach Material: QMI 509 Bond Diagram Designation 001-14561, 001-33059, 001-30701 /10-06475 Wire Bond Method: Thermosonic Wire Material/Size: 0.9mil / Au Thermal Resistance Theta JA °C/W: 11.3 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-64159 / 001-64160M Name/Location of Assembly (prime) facility: JT-JCET China MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R, KYEC-Taiwan, G-Taiwan Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 8 Document No.001-68913 Rev. *B ECN # 4267109 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) Result P/F P High Temp Storage JEDEC STD 22-A110: 130 C, 85%RH, 3.60V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C/235C Reflow) JESD22-A102: 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C/235C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C/235 Reflow) JESD22-A103, 150 C, no bias Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy (2200V) JEDEC EIA/JESD22-A114-B (500V) JESD22-C101 J-STD-020 P Ball Shear JESD22-B116A, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Pressure Cooker Test Temperature Cycle Constructional Analysis Die Shear Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019, Per die size: • <3000 sq. mils = 1.2 kgf • 30001-5000 sq. mils = 1.2 kgf • >5001 sq. mils = 1.2 kgf P P P P P P P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 P P Final Visual Inspection JESD22-B101B P Lead Integrity JESD22-B105, MIL STD 883 P Physical Dimension MIL-STD-1835, JESD22-B100 P MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and P Thermal Shock JESD22-A106B, Condition C, -55 C to 125C Solderability, Steam Aged J-STD-002, JESD22-B102 P 95% solder coverage minimum X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 8 P Document No.001-68913 Rev. *B ECN # 4267109 Reliability Test Data QTP #: 110909 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA COMP 15 0 7C13540XC 4041765 611105085 JT-CHINA COMP 15 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA COMP 15 0 CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA COMP 10 0 7C13540XC 4041765 611105085 JT-CHINA COMP 10 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA COMP 10 0 CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA COMP 10 0 7C13540XC 4041765 611105085 JT-CHINA COMP 10 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA COMP 10 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA COMP 5 0 7C13540XC 4041765 611105085 JT-CHINA COMP 5 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA COMP 5 0 STRESS: DYE PENETRATION TEST CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA COMP 15 0 7C13540XC 4041765 611105085 JT-CHINA COMP 15 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA COMP 15 0 CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA COMP 15 0 7C13540XC 4041765 611105085 JT-CHINA COMP 15 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA COMP 15 0 JT-CHINA COMP 9 0 COMP 8 0 STRESS: DIE SHEAR STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY7C1470BV25 (7C14702B) 4037529 611105083 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 8 Document No.001-68913 Rev. *B ECN # 4267109 Reliability Test Data QTP #: 110909 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 3.60V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 611105083 JT-CHINA 128 80 0 4037529 611105083 JT-CHINA 500 80 0 CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA COMP 5 0 7C13540XC 4041765 611105085 JT-CHINA COMP 5 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA COMP 5 0 CY7C1470BV25 (7C14702B) 4037529 STRESS: HIGH TEMP STORAGE, 150C CY7C1470BV25 (7C14702B) STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA 168 80 0 CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA 288 80 0 STRESS: PHYSICAL DIMENSION CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA COMP 30 0 7C13540XC 4041765 611105085 JT-CHINA COMP 30 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA COMP 30 0 CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA COMP 3 0 7C13540XC 4041765 611105085 JT-CHINA COMP 3 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA 500 72 0 7C13540XC 4041765 611105085 JT-CHINA 500 79 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA 500 80 0 CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA 200 80 0 CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA 1000 79 0 CY7C1470BV25 (7C14702B) 4037529 611105083 JT-CHINA COMP 15 0 7C13540XC 4041765 611105085 JT-CHINA COMP 15 0 CY7C68013A (7C682001B) 4041783 611105084 JT-CHINA COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-68913 Rev. *B ECN # 4267109 Reliability Test Data QTP #: 132506 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC CY7C1363C (7C13630XC) AZ100 4247007 611319797 JCET-JT COMP 22 0 CY7C1363C (7C13630XC) AZ100 4247007 611319798 JCET-JT COMP 22 0 CY7C1363C (CY7C1363C) AZ100 4247007 611319799 JCET-JT COMP 22 0 CY7C1363C (7C13630XC) AZ100 4247007 611319797 JCET-JT COMP 100 0 CY7C1363C (7C13630XC) AZ100 4247007 611319798 JCET-JT COMP 100 0 CY7C1363C (CY7C1363C) AZ100 4247007 611319799 JCET-JT COMP 100 0 CY7C1363C (7C13630XC) AZ100 4247007 611319797 JCET-JT COMP 100 0 CY7C1363C (7C13630XC) AZ100 4247007 611319798 JCET-JT COMP 100 0 CY7C1363C (CY7C1363C) AZ100 4247007 611319799 JCET-JT COMP 100 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY7C1363C (7C13630XC) AZ100 4247007 611319797 JCET-JT COMP 5 0 AZ100 4247007 611319797 JCET-JT 136 80 0 4247007 611319797 JCET-JT 500 80 0 STRESS: HAST CY7C1363C (7C13630XC) STRESS: HIGH TEMPERATIRE STORAGE CY7C1363C (7C13630XC) AZ100 STRESS: PRESSURE COOKER TEST CY7C1363C (7C13630XC) AZ100 4247007 611319797 JCET-JT 176 80 0 CY7C1363C (7C13630XC) AZ100 4247007 611319797 JCET-JT 288 80 0 AZ100 4247007 611319797 JCET-JT COMP 15 0 STRESS: SOLDERABILITY CY7C1363C (7C13630XC) STRESS: TEMPERATURE CYCLE TESTING CY7C1363C (7C13630XC) AZ100 4247007 611319797 JCET-JT 500 80 0 CY7C1363C (7C13630XC) AZ100 4247007 611319797 JCET-JT 1000 80 0 CY7C1363C (7C13630XC) AZ100 4247007 611319798 JCET-JT 500 79 0 CY7C1363C (7C13630XC) AZ100 4247007 611319798 JCET-JT 1000 79 0 CY7C1363C (CY7C1363C) AZ100 4247007 611319799 JCET-JT 500 80 0 CY7C1363C (CY7C1363C) AZ100 4247007 611319799 JCET-JT 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-68913 Rev. *B ECN # 4267109 Document History Page Document Title: QTP 110909:100-Lead TQFP (14x14x1.4 mils),100Ld / 128Ld TQFP (14x20x1.4 mils) NIPDAU, MSL3 260C REFLOW JCET- CHINA (JT) Document Number: 001-68913 Rev. ECN No. ** 3218981 *A 4046089 *B Orig. of Change NSR NSR 4267109 HSTO Description of Change Initial spec release Removed VERSION 1.0 in the title page. Update electrical test location. Removed reference Cypress specs and replaced with reference industry standards in reliability tests performed table. Corrected HAST %RH from 60% to 85%. Added QTP#132506 qualification data to the QTP report. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8