CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 ® 16 K/8 K/4 K × 16 MoBL ADM Asynchronous Dual-Port Static RAM 16 K/8 K/4 K × 16 MoBL® ADM Asynchronous Dual-Port Static RAM Features ■ True dual-ported memory block that allow simultaneous independent access ❐ One port with dedicated time multiplexed address and data (ADM) interface ❐ One port configurable to standard SRAM or time multiplexed address and data interface ■ 16 K/8 K/4 K × 16 memory configuration ■ High speed access ❐ 65 ns or 90 ns ADM interface ❐ 40 ns or 60 ns standard SRAM interface ■ Fully asynchronous operation ■ Port independent 1.8 V, 2.5 V, and 3.0 V IOs ■ Ultra low operating power ❐ Active: ICC = 15 mA (typical) at 90 ns ❐ Active: ICC = 25 mA (typical) at 65 ns ❐ Standby: ISB3 = 2 A (typical) ■ Port independent power-down ■ On-chip arbitration logic ■ Mailbox interrupt for port to port communication ■ Input Read and Output Drive registers ■ Upper byte and lower byte control ■ Small package: 6 × 6 mm, 100-ball Pb-free BGA ■ Industrial temperature range Block Diagram SFEN# I/OL15-I/OL8 I/OL7-I/OL0 ADV#L UB#L LB#L DataL<15..0> Mux'ed Address / Data I/O Control IRR1-IRR0 [note 2] ODR4-ODR0 IRR/ODR DataR<15..0> Dual Ported Memory Array 16k/8k/4k x 16 AddrL<13..0> Mux'ed Address/ Data I/O Control AddrR<13..0> I/OR15-I/OR8 I/OR7-I/OR0 ADV#R UB#R LB#R A13-A0 [note 1] Address Decode CS#L OE#L WE#L Address Decode MSEL CS#R OE#R WE#R Control Logic BUSY#L INT#L BUSY#R INT#R Notes 1. A13-A0 for CYDMX256A16 and CYDMX256B16; A12-A0 for CYDMX128A16 and CYDMX128B16; and A11-A0 for CYDMX064A16 and CYDMX064B16. 2. IRR1 and IRR2 not available for CYDMX256A16 and CYDMX256B16. Cypress Semiconductor Corporation Document Number: 001-08090 Rev. *I • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised June 24, 2014 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Contents Pin Configurations ........................................................... 3 Pin Definitions .................................................................. 4 Functional Description ..................................................... 4 Power Supply .............................................................. 4 ADM Interface Read or Write Operation ..................... 4 Standard SRAM Interface Read or Write Operation ..................................................... 5 Byte Select Operation ................................................. 5 Chip Select Operation ................................................. 5 Output Enable Operation ............................................. 5 Mailbox Interrupts ........................................................ 5 Arbitration Logic .......................................................... 5 Input Read Register .................................................... 5 Output Drive Register .................................................. 5 Architecture ...................................................................... 6 Maximum Ratings ............................................................. 8 Operating Range ............................................................... 8 Electrical Characteristics for VCC = 1.8 V ...................... 8 Electrical Characteristics for VCC = 2.5 V .................... 10 Electrical Characteristics for 3.0 V ............................... 11 Capacitance .................................................................... 11 Switching Characteristics for VCC = 1.8 V ................... 12 Document Number: 001-08090 Rev. *I Switching Waveforms .................................................... 15 Ordering Information ...................................................... 21 16 K × 16 MoBL ADM Asynchronous Dual-Port SRAM ....................................... 21 8 K × 16 MoBL ADM Asynchronous Dual-Port SRAM ....................................... 21 4 K × 16 MoBL ADM Asynchronous Dual-Port SRAM ....................................... 21 Ordering Code Definitions ......................................... 21 Package Diagram ............................................................ 22 Acronyms ........................................................................ 23 Document Conventions ................................................. 23 Units of Measure ....................................................... 23 Document History Page ................................................. 24 Sales, Solutions, and Legal Information ...................... 25 Worldwide Sales and Design Support ....................... 25 Products .................................................................... 25 PSoC® Solutions ...................................................... 25 Cypress Developer Community ................................. 25 Technical Support ..................................................... 25 Page 2 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Pin Configurations Figure 1. 100-ball BGA pinout (Top View) 1 2 3 4 5 6 7 8 9 10 A A5 A8 A11 UB#R VSS ADV#R I/OR15 I/OR12 I/OR10 VSS B A3 A4 A7 A9 CE#R WE#R OE#R VDDIOR I/OR9 I/OR6 B C A0 A1 A2 A6 LB#R IRR1[3] I/OR14 I/OR11 I/OR7 VSS D ODR4 A10 A12[4] I/OR13 I/OR8 I/OR5 I/O2R D E VSS I/OR1 F SFEN# ODR2 BUSY#R INT#R VSS A C DNU ODR3 INT#L VSS VSS I/OR4 VDDIOR ODR1 BUSY#L DNU VCC VSS I/OR3 I/OR0 I/OL15 VDDIOL F E G ODR0 DNU DNU DNU OE#L I/OL3 I/OL11 I/OL12 I/OL14 I/OL13 G H DNU DNU DNU LB#L CE#L I/OL1 VDDIOL MSEL DNU I/OL10 H J DNU DNU DNU IRR0[5] VCC VSS I/OL4 I/OL6 I/OL8 I/OL9 J K DNU DNU DNU UB#L ADV#L WE#L I/OL0 I/OL2 I/OL5 I/OL7 K 1 2 3 4 5 6 7 8 9 10 Notes 3. This pin is A13 for CYDMX256A16 and CYDMX256B16. 4. This pin is DNU for CYDMX064A16 and CYDMX064B16. 5. This pin is DNU for CYDMX256A16 and CYDMX256B16. 6. DNU pins are “do not use” pins. No trace or power component can be connected to these pins. Document Number: 001-08090 Rev. *I Page 3 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Pin Definitions Left Port Right Port Description CS#L CS#R Chip select WE#L WE#R Read/Write Enable OE#L OE#R A0–A13 MSEL IOL0–IOL15 IOR0–IOR15 ADV#L ADV#R UB#L UB#R Output Enable Address (A0–A11 for 4K device; A0–A12 for 8K device; A0–A13 for 16K device) Right port interface mode select (0: Standard SRAM; 1: Address/Data Mux) Address/Data Bus Input/Output Address Latch Enable; ADV#R only use when R-port is in ADM mode Upper byte select (IO8–IO15) LB#L LB#R Lower byte select (IO0–IO7) INT#L INT#R Interrupt Flag BUSY#L BUSY#R SFEN# IRR0-IRR1 ODR0-ODR4 Busy Flag Special Function Enable Signal Input signals for input read registers for CYDMX128A16, CYDMX128B16, CYDMX064A16 and CYDMX064B16; IRR0 is DNU and IRR1 is A13 for CYDMX256A16 and CYDMX256B16. Output signals for output drive registers; These are open drained outputs. VCC Core power supply GND Ground VDDIOL Left port IO power supply VDDIOR Right port IO power supply DNU No Connect; Do not connect trace or power component to these pins. Functional Description The CYDMX256A16, CYDMX128A16, CYDMX064A16, CYDMX256B16, CYDMX128B16, and CYDMX064B16 are low power CMOS 16K/8K/4K × 16 dual-port static RAMs. The two ports are: one dedicated time multiplexed address and data (ADM) interface and one configurable standard SRAM or ADM interface. The two ports permit independent, asynchronous read and write access to any memory locations. Each port has independent control pins: Chip Select (CS#), Write Enable (WE#), and Output Enable (OE#). Two output flags are provided on each port (BUSY# and INT#). BUSY# flag is triggered when the port is trying to access the same memory location currently being accessed by the other port. The Interrupt flag (INT#) permits communication between ports or systems by means of a mailbox. Power-down feature is controlled independently on each port by a Chip Select (CS#) pin. The CYDMX256A16, CYDMX128A16, CYDMX064A16, CYDMX256B16, CYDMX128B16, and CYDMX064B16 are available in 100-ball 0.5-mm pitch Ball Grid Array (BGA) packages. Application areas include interprocessor and multiprocessor designs, communications status buffering, and dual-port video and graphics memory. Power Supply The core voltage (VCC) can be 1.8 V, 2.5 V, or 3.0 V, as long as it is lower than or equal to the IO voltage. Each port operates on Document Number: 001-08090 Rev. *I independent IO voltages. This is determined by what is connected to the VDDIOL and VDDIOR pins. The supported IO standards are 1.8 V and 2.5 V LVCMOS and 3.0 V LVTTL. ADM Interface Read or Write Operation This description is applicable to both the left ADM port and right port configured as an ADM port. Three control signals, ADV#, WE#, and CS# are used to perform the read and write operations. Address signals are first applied to the IO bus along with CS# LOW. The addresses are loaded from the IO bus in response to the rising edge of the Address Latch Enable (ADV#) signal. It is necessary to meet the setup (tAVDS) and hold (tAVDH) times given in the AC specifications with valid address information to properly latch the addresses. After the address signals are latched in, a read operation is issued when WE# stays HIGH. The IO bus becomes High Z when the address signals meet tAVDH. The read data is driven on the IO bus tOE after the OE# is asserted LOW, and held until tHZOE or tHZCS after the rising edge of OE# or CS#, whichever comes first. A write operation is issued when WE# is asserted LOW. The write data is applied to the IO bus right after address meets the hold time (tAVDH). And write data is written with the rising edge of either WE# or CS#, whichever comes first, and meets data setup (tSD) and hold (tHD) times. Page 4 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Standard SRAM Interface Read or Write Operation This description is applicable to the right access port configured as standard SRAM port. Read and write operations with standard SRAM interface configuration is the same as the ADM port except addresses are presented on the A bus. Operation is controlled by CS#, OE#, and WE#. A read operation is issued when WE# is asserted HIGH. A write operation is issued when WE# is asserted LOW. The IO bus is the destination for read data and the source for write data when the read operation is issued. However, write data must be driven to IO when the write operation is issued. Byte Select Operation resets when the owner reads the contents of its own mailbox. The message written to the mailbox is user defined. Each port reads the other port’s mailbox without resetting the interrupt. The active state of the busy signal (to a port) prevents the port from setting the interrupt to the winning port. Also, an active busy to a port prevents that port from reading its own mailbox and resetting the interrupt to it. On power-up, both interrupts are set by default. An initialization program must be run to reset the interrupts. If an application does not require message passing, do not connect the interrupt pin to the processor’s interrupt request input pin. The fundamental word size is 16 bits. Each word is broken up into two 8-bit bytes. Each port has two active LOW byte enables: UB# and LB#. Activating or deactivating the byte enables alters the result of read and write operations to the port. During a write, byte enable asserted HIGH inhibits the corresponding byte to be updated in the addressed memory location. During a read, both byte enables are inputs to the asynchronous output enable control logic. When a byte enable is asserted HIGH, the corresponding data byte is tristated. Subsequently, when the byte enable is asserted LOW, the corresponding data byte is driven with the read data. The CYDMX256A16, CYDMX128A16, CYDMX064A16, CYDMX256B16, CYDMX128B16, and CYDMX064B16 provide on-chip arbitration to resolve simultaneous memory location access (collision). If both ports’ CS# signals are asserted and an address match occurs within each other, the busy logic determines which port has access. If tPS is violated, one of the two ports gains permission to the location, but it is not predictable which port gets the permission. BUSY# is asserted tBLA after an address match or tBLC after CS# is taken LOW. Chip Select Operation Input Read Register Each port has one active LOW chip select signal, CS#. CS# must be asserted LOW for the port to be considered active. To issue a valid read or write operation, the chip select input must be asserted LOW throughout the read or write cycle. When CS# is deasserted HIGH during a write, if tWRL, tSD, and tHD are not met, the contents of the addressed location is not altered. The Input Read Register (IRR) feature is available only for CYDMX128A16, CYDMX128B16, CYDMX064A16, and CYDMX064B16 devices. When SFEN# = VIL, the IRR captures the status of two external devices connected to the Input Read pins (IRR0 and IRR1) to address location 0x0000. Address 0x0000 is not available for standard memory accesses when SFEN# = VIL. When SFEN# = VIH, address 0x0000 is available for normal memory accesses. Either port accesses the contents of IRR with normal read operation from address 0x0000. During reads from the IRR, IO<1:0> are valid bits and IO<15:2> are don’t care. The IRR inputs are 1.8 V and 2.5 V LVCMOS or 3.0 V LVTTL, depending on the core voltage supply (VCC). An automatic power-down feature controlled by deactivating the chip select (CS# HIGH) permits the on-chip circuitry of each port to enter a very low standby power mode. Output Enable Operation Each port has one output enable signal, OE#. When OE# is asserted HIGH, IO bus is tri-stated after tHZOE. When OE# is asserted LOW, control of the IO bus is assumed by the asynchronous output enable logic (the logic is controlled by inputs WE#, CS#, UB#, and LB#). Mailbox Interrupts The upper two memory locations are used for message passing. The highest memory location (0xFFF for CYDMX064A16 and CYDMX064B16, 0x1FFF for CYDMX128A16 and CYDMX128B16, and 0x3FFF for CYDMX256A16 and CYDMX256B16) is the mailbox for the right port. The second highest memory location (0xFFE for CYDMX064A16 and CYDMX064B16, 0x1FFE for CYDMX128A16 and CYDMX128B16, and 0x3FFE for CYDMX256A16 and CYDMX256B16) is the mailbox for the left port. When one port writes to the opposite port’s mailbox, an interrupt signal is generated to the opposite port. The interrupt Document Number: 001-08090 Rev. *I Arbitration Logic Output Drive Register The Output Drive Register (ODR) determines the state of up to five external binary state devices by providing a path to VSS for the external circuit. These outputs are open drain. The five external devices operates at different voltages (1.5 V VDDIO 3.5 V) but the combined current cannot exceed 40 mA (8 mA maximum for each external device). The status of the ODR bits are set using standard write accesses from either port to address 0x0001 with a ‘1’ corresponding to on and ‘0’ corresponding to off. The status of the ODR bits are read with a normal read access to address 0x0001. When SFEN# = VIL, the ODR is active and address 0x0001 is not available for memory accesses. When SFEN# = VIH, the ODR is inactive and address 0x0001 is used for standard accesses. During reads and writes to ODR, IO<4:0> are valid and IO<15:5> are don’t care. Page 5 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Architecture The CYDMX256A16, CYDMX128A16, CYDMX064A16, CYDMX256B16, CYDMX128B16, and CYDMX064B16 consist of an array of 16K, 8K, and 4K words of 16 dual-ported SRAM cells, IO, address lines, and control signals (CS#, ADV#, OE#, and WE#). Between the two access ports, one is a dedicated time multiplexed address and data interface; the other is a pin selectable port to either standard SRAM or time multiplexed address and data interface. Independent control signals for each port permit simultaneous access to any location in memory. To handle the situation of writing and reading to the same location, a BUSY# pin is provided on each port. For port to port communication, an Interrupt (INT#) pin is also available on each port. Table 1. ADM Interface Read/Write with Byte Select Operations ADV# CS# WE# OE# UB# LB# X H X X X X IO0 - IO15 X X X H X X High Z Output disable X X X X H H High Z Upper and lower byte deselected Pulse L H L L L Data Out (IO0-IO15) Read upper and lower bytes Pulse L H L H L Data Out (IO0-IO7) High Z (IO8-IO15) Read lower byte only Pulse L H L L H High Z (IO0-IO7) Data Out (IO8-IO15) Read upper byte only Pulse L L X L L Data In (IO0-IO15) Write upper and lower bytes Pulse L L X H L Data In (IO0-IO7) High Z (IO8-IO15) Write lower byte only Pulse L L X L H High Z (IO0-IO7) Data In (IO8-IO15) Write upper byte only High Z Mode Deselected or power-down Table 2. Standard SRAM Interface Read/Write with Byte Select Operations CS# WE# OE# UB# H X X X X High Z Deselected or power-down X X H X X High Z Output disable X X X H H High Z Upper and lower byte deselected L H L L L Data Out (IO0-IO15) Read upper and lower bytes L H L H L Data Out (IO0-IO7) High Z (IO8-IO15) Read lower byte only L H L L H High Z (IO0-IO7) Data Out (IO8-IO15) Read upper byte only L L X L L Data In (IO0-IO15) Write upper and lower bytes L L X H L Data In (IO0-IO7) High Z (IO8-IO15) Write lower byte only L L X L H High Z (IO0-IO7) Data In (IO8-IO15) Write upper byte only Document Number: 001-08090 Rev. *I LB# IO0-IO15 Mode Page 6 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Table 3. Interrupt Operation Example (Assumes BUSY#L = BUSY#R = HIGH) Left Port Function WE#L CS#L OE#L Set Right INT#R Flag L L Right Port AddressL X 0x3FFF INT#L WE#R CS#R OE#R [7] X X X AddressR INT#R X L X [7] H Reset Right INT#R Flag X X X X X X L L 0x3FFF Set Left INT#L Flag X X X X L L L X 0x3FFE[8] X H X X X X X Reset Left INT#L Flag X L L 0x3FFE [8] Table 4. Arbitration Winning Port CS#L CS#R Address Match Left/Right Port BUSY#L BUSY#R Function X X No Match H H Normal H X Match H H Normal X H Match H H Normal Match Note[9] Note[9] L L See See Write Inhibit[10] Table 5. Input Read Register Operation[11] SFEN# CS# WE# OE# UB# LB# H L H L L L ADDR IO0–IO1 IO2–IO15 L L H L X L x0000 VALID[13] X Mode x0000-Max VALID[12] VALID[12] Standard Memory Access IRR Read Table 6. Output Drive Register[15] SFEN# CS# WE# OE# UB# LB# ADDR IO0–IO4 IO5–IO15 L[12] L[12] VALID[12] Mode H L H X[16] x0000-Max VALID[12] L L L X X L x0001 VALID[13] X ODR Write[17] L L H L X L x0001 VALID[13] X ODR Read Standard Memory Access Notes 7. 0x3FFF for CYDMX256A16 and CYDMX256B16, 0x1FFF for CYDMX128A16 and CYDMX128B16, 0xFFF for CYDMX064A16 and CYDMX064B16. 8. 0x3FFE for CYDMX256A16 and CYDMX256B16, 0x1FFE for CYDMX128A16 and CYDMX128B16, 0xFFE for CYDMX064A16 and CYDMX064B16. 9. If it meets tPS, "L" if the CS# and address of the opposite port become stable BEFORE the current port; "H" if the CS# and address of the opposite port become stable AFTER the current port. If tPS is not met, either BUSY#L or BUSY#R results “L”. BUSY#L and BUSY#R cannot be “L” simultaneously. 10. Write operations to the left port are internally ignored when BUSY#L is driving LOW regardless of actual logic level on the pin; Write operations to the right port are internally ignored when BUSY#R is driving LOW regardless of actual logic level on the pin. 11. SFEN# = VIL for IRR reads. 12. UB# or LB# = VIL. If LB# = VIL, then IO<7:0> are valid. If UB# = VIL then IO<15:8> are valid. 13. LB# must be active (LB# = VIL) for these bits to be valid. 14. SFEN# active when either CS#L = VIL or CS#R = VIL. It is inactive when CS#L = CS#R = VIH. 15. SFEN# = VIL for ODR reads and writes. 16. Output enable must be low (OE# = VIL) during reads for valid data to be output. 17. During ODR writes data is also written to the memory. Document Number: 001-08090 Rev. *I Page 7 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 DC Input Voltage[19]............................. –0.5 V to VCC + 0.5 V Maximum Ratings Output Current into Outputs (LOW)............................. 90 mA Exceeding maximum ratings[18] may shorten the useful life of the device. User guidelines are not tested. Static Discharge Voltage......................................... > 2000 V Storage Temperature ................................ –65 °C to +150 °C Latch up Current.................................................... > 200 mA Ambient Temperature with Power Applied .......................................... –55 °C to +125 °C Operating Range Range Supply Voltage to Ground Potential..............–0.5 V to +3.3 V Ambient Temperature VCC –40 °C to +85 °C 1.8 V ± 100 mV 2.5 V ± 100 mV 3.0 V ± 300 mV Industrial DC Voltage Applied to Outputs in High Z State ....................... –0.5 V to VCC + 0.5 V Electrical Characteristics for VCC = 1.8 V Parameter Over the Operating Range VOH VOL VOL ODR VIH VIL IOZ ICEX ODR CYDMX256A16 CYDMX128A16 CYDMX256B16 CYDMX128B16 CYDMX064B16 CYDMX256A16 CYDMX128A16 CYDMX064A16 –65 –65 –90 Description P1 IO P2 IO Voltage Voltage Output HIGH voltage (IOH = –100 A) Min 1.8 V (any port) VDDIO – 0.2 Unit Typ Max Min Typ Max Min Typ Max – – VDDIO – 0.2 – – VDDIO – 0.2 – – V Output HIGH voltage (IOH = –2 mA) 2.5 V (any port) 2.0 – – 2.0 – – 2.0 – – V Output HIGH voltage (IOH = –2 mA) 3.0 V (any port) 2.1 – – 2.1 – – 2.1 – – V Output LOW voltage (IOL = 100 A 1.8 V (any port) – – 0.2 – – 0.2 – – 0.2 V Output HIGH voltage (IOH = 2 mA) – – 0.4 – – 0.4 – – 0.4 V 2.5 V (any port) Output HIGH voltage (IOH = 2 mA) 3.0 V (any port) – – 0.4 – – 0.4 – – 0.4 V ODR output LOW voltage (IOL = 8 mA 1.8 V (any port) – – 0.2 – – 0.2 – – 0.2 V 2.5 V (any port) – – 0.2 – – 0.2 – – 0.2 V 3.0 V (any port) – – 0.2 – – 0.2 – – 0.2 V 1.8 V (any port) 1.2 – VDDIO + 0.2 1.2 – VDDIO + 0.2 1.2 – VDDIO + 0.2 V 2.5 V (any port) 1.7 – VDDIO + 0.3 1.7 – VDDIO + 0.3 1.7 – VDDIO + 0.3 V 3.0 V (any port) 2.0 – VDDIO + 0.2 2.0 – VDDIO + 0.2 2.0 – VDDIO + 0.2 V Input HIGH voltage Input LOW voltage Output leakage current ODR output leakage current. VOUT = VDDIO 1.8 V (any port) –0.2 – 0.4 –0.2 – 0.4 –0.2 – 0.4 V 2.5 V (any port) –0.3 – 0.6 –0.3 – 0.6 –0.3 – 0.6 V 3.0 V (any port) –0.2 – 0.7 –0.2 – 0.7 –0.2 – 0.7 V 1.8 V 1.8 V –1 – 1 –1 – 1 –1 – 1 A 2.5 V 2.5 V –1 – 1 –1 – 1 –1 – 1 A 3.0 V 3.0 V –1 – 1 –1 – 1 –1 – 1 A 1.8 V 1.8 V –1 – 1 –1 – 1 –1 – 1 A 2.5 V 2.5 V –1 – 1 –1 – 1 –1 – 1 A 3.0 V 3.0 V –1 – 1 –1 – 1 –1 – 1 A Notes 18. The voltage on any input or IO pin cannot exceed the power pin during power-up. 19. Pulse width < 20 ns. Document Number: 001-08090 Rev. *I Page 8 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Electrical Characteristics for VCC = 1.8 V (continued) Parameter Over the Operating Range (continued) IIX CYDMX256A16 CYDMX128A16 CYDMX256B16 CYDMX128B16 CYDMX064B16 CYDMX256A16 CYDMX128A16 CYDMX064A16 –65 –65 –90 Description P1 IO P2 IO Voltage Voltage Input leakage current Min Typ Max Min Typ Max Min Unit Typ Max 1.8 V 1.8 V –1 – 1 –1 – 1 –1 – 1 A 2.5 V 2.5 V –1 – 1 –1 – 1 –1 – 1 A 3.0 V 3.0 V –1 – 1 –1 – 1 –1 – 1 A ICC Operating current (VCC = Max, IOUT = 0 mA) outputs disabled Ind. 1.8 V 1.8 V – 25 40 – 25 40 – 15 25 mA ISB1 Standby current Ind. (both ports TTL level) CE#L and CE#R VCC – 0.2, f = fMAX 1.8 V 1.8 V – 2 6 – 2 6 – 2 6 A ISB2 Standby current Ind. (One Port TTL level) CE#L or CE#R VIH, f = fMAX 1.8 V 1.8 V – 8.5 18 – 8.5 18 – 8.5 14 mA ISB3 Ind. Standby current (both ports CMOS level) CE#L and CE#R VCC 0.2 V, f = 0 1.8 V 1.8 V – 2 6 – 2 6 – 2 6 A ISB4 Standby current (one port CMOS level) CE#L or CE#R VIH, f = fMAX[20] 1.8 V 1.8 V – 8.5 18 – 8.5 18 – 8.5 14 mA Ind. Note 20. fMAX = 1/tRC = All inputs cycling at f = 1/tRC (except output enable). f = 0 means no address or control lines change. This applies only to inputs at CMOS level standby ISB3. Document Number: 001-08090 Rev. *I Page 9 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Electrical Characteristics for VCC = 2.5 V Parameter Over the Operating Range VOH CYDMX256A16 CYDMX128A16 CYDMX256B16 CYDMX128B16 CYDMX064B16 CYDMX256A16 CYDMX128A16 CYDMX064A16 –65 –65 –90 Description Output HIGH voltage (IOH = –2 mA) Unit P1 IO P2 IO Voltage Voltage Min Typ Max Min Typ Max Min Typ Max 2.5 V (any port) 2.0 – – 2.0 – – 2.0 – – V 3.0 V (any port) 2.1 – – 2.1 – – 2.1 – – V 2.5 V (any port) – – 0.4 – – 0.4 – – 0.4 V VOL Output LOW voltage (IOL = 2 mA 3.0 V (any port) – – 0.4 – – 0.4 – – 0.4 V VOL ODR ODR Output LOW voltage (IOL = 8 mA 2.5 V (any port) – – 0.2 – – 0.2 – – 0.2 V 3.0 V (any port) – – 0.2 – – 0.2 – – 0.2 V VIH Input HIGH voltage 2.5 V (any port) 1.7 – VDDIO + 0.3 1.7 – VDDIO + 0.3 1.7 – VDDIO + 0.3 V 3.0 V (any port) 2.0 – VDDIO + 0.2 2.0 – VDDIO + 0.2 2.0 – VDDIO + 0.2 V 2.5 V (any port) –0.3 – 0.6 –0.3 – 0.6 –0.3 – 0.6 V 3.0 V (any port) VIL Input LOW voltage IOZ Output leakage current ICEX ODR ODR output leakage current. VOUT = VCC 3.0 V 3.0 V –1 – 1 –1 – 1 –1 – 1 A IIX Input leakage current 2.5 V 2.5 V –1 – 1 –1 – 1 –1 – 1 A 3.0 V 3.0 V –1 – 1 –1 – 1 –1 – 1 A ICC Operating current Ind. (VCC = Max, IOUT = 0 mA) outputs disabled 2.5 V 2.5 V – 39 55 – 39 55 – 28 40 mA ISB1 Standby current (both ports TTL level) CE#L and CE#R VCC – 0.2, f = fMAX Ind. 2.5 V 2.5 V – 6 8 – 6 8 – 6 8 A ISB2 Standby current Ind. (one port TTL level) CE#L or CE#R VIH, f = fMAX 2.5 V 2.5 V – 21 30 – 21 30 – 18 25 mA ISB3 Standby current Ind. (both ports CMOS level) CE#L and CE#R VCC 0.2 V, f = 0 2.5 V 2.5 V – 4 6 – 4 6 – 4 6 A ISB4 Standby current (one port CMOS level) CE#L or CE#R VIH, f = fMAX[21] 2.5 V 2.5 V – 21 30 – 21 30 – 18 25 mA Ind. –0.2 – 0.7 –0.2 – 0.7 –0.2 – 0.7 V 2.5 V 2.5 V –1 – 1 –1 – 1 –1 – 1 A 3.0 V 3.0 V –1 – 1 –1 – 1 –1 – 1 A 2.5 V 2.5 V –1 – 1 –1 – 1 –1 – 1 A Note 21. fMAX = 1/tRC = All inputs cycling at f = 1/tRC (except output enable). f = 0 means no address or control lines change. This applies only to inputs at CMOS level standby ISB3. Document Number: 001-08090 Rev. *I Page 10 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Electrical Characteristics for 3.0 V Parameter Over the Operating Range CYDMX256A16 CYDMX128A16 CYDMX256B16 CYDMX128B16 CYDMX064B16 CYDMX256A16 CYDMX128A16 CYDMX064A16 –65 –65 –90 Description P1 IO P2 IO Voltage Voltage Min Typ Unit Max Min Typ Max Min Typ Max VOH Output HIGH voltage (IOH = –2 mA) 3.0 V (any port) 2.1 – – 2.1 – – 2.1 – – V VOL Output LOW voltage (IOL = 2 mA 3.0 V (any port) – – 0.4 – – 0.4 – – 0.4 V VOL ODR ODR output LOW voltage (IOL = 8 mA 3.0 V (any port) – – 0.2 – – 0.2 – – 0.2 V VIH Input HIGH voltage 3.0 V (any port) 2.0 – VDDIO + 0.2 2.0 – – VDDIO + 0.2 V VIL Input LOW voltage 3.0 V (any port) –0.2 – 0.7 –0.2 – 0.7 –0.2 – 0.7 V IOZ Output leakage current 3.0 V 3.0 V –1 – 1 –1 – 1 –1 – 1 A ICEX ODR ODR output leakage current. VOUT = VCC 3.0 V 3.0 V –1 – 1 –1 – 1 –1 – 1 A IIX Input leakage current 3.0 V 3.0 V –1 – 1 –1 – 1 –1 – 1 A ICC Ind. Operating current (VCC = Max, IOUT = 0 mA) outputs disabled 3.0 V 3.0 V – 49 70 – 49 70 – 42 60 mA ISB1 Standby current (both ports TTL level) CE#L and CE#R VCC – 0.2, f = fMAX Ind. 3.0 V 3.0 V 7 10 7 10 7 10 A Ind. 3.0 V 3.0 V 28 40 28 40 25 35 mA Standby current (one port TTL level) CE#L or CE#R VIH, f = fMAX Ind. 3.0 V 3.0 V 6 8 6 8 6 8 A Ind. 3.0 V 3.0 V 28 40 28 40 25 35 mA ISB2 ISB3 ISB4 VDDIO 2.0 + 0.2 Capacitance Parameter [22] Description CIN Input capacitance COUT Output capacitance Test Conditions Max Unit TA = 25 °C, f = 1 MHz, VCC = 3.0 V 9 pF 10 pF Note 22. Tested initially and after any design or process changes that may affect these parameters. Document Number: 001-08090 Rev. *I Page 11 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Figure 2. AC Test Loads and Waveforms 3.0 V/2.5 V/1.8 V 3.0 V/2.5 V/1.8 V R1 RTH = 6 k OUTPUT OUTPUT R1 OUTPUT C = 30 pF C = 30 pF R2 C = 5 pF R2 VTH = 0.8 V (a) Normal Load (c) Three-State Delay (Load 2) (b) Thévenin Equivalent (Load 1) (Used for tLZ, tHZ, tHZWE, and tLZWE including scope and jig) ALL INPUT PULSES 3.0 V/2.5 V 1.8 V R1 1022 13500 1.8 V R2 792 10800 GND 10% 90% 10% 90% 3 ns 3 ns Switching Characteristics for VCC = 1.8 V Over the Operating Range [23] Parameter CYDMX256A16 CYDMX128A16 CYDMX256B16 CYDMX128B16 CYDMX064B16 CYDMX256A16 CYDMX128A16 CYDMX064A16 –65 –65 –90 Description AD Mux Port Read Cycle Min Max Min Max Min Max Unit [24] tRC Read cycle time 65 – 65 – 90 – ns tACC1 Random access ADV# Low to data valid – 65 – 65 – 90 ns tACC2 Random access Address to data valid – 65 – 65 – 90 ns tACC3 Random access CS# to data valid – 65 – 65 – 90 ns tAVDA Random access ADV# High to data valid – 35 – 35 – 50 ns tAVD ADV# low pulse 15 – 15 – 20 – ns tAVDS Address setup to ADV# rising edge 15 – 15 – 20 – ns tAVDH Address hold from ADV# rising edge 3 – 3 – 5 – ns tCSS CS# setup to ADV# rising edge 7 – 7 – 10 – ns tOE OE# Low to data valid – 35 – 35 – 50 ns tLZOE[25] OE# Low to IO Low Z 3 – 3 – 5 – ns tHZOE OE# High to IO High Z – 15 – 15 – 25 ns tHZCS CS# High to IO High Z – 15 – 15 – 25 ns tDBE UB#/LB# Low to IO Valid – 35 – 35 – 50 ns tLZBE UB#/LB# Low to IO Low Z 3 – 3 – 5 – ns tHZBE UB#/LB# High to IO High Z – 15 – 15 – 25 ns tAVOE ADV# High to OE# Low 0 – 0 – 0 – ns Notes 23. All timing parameters are measured with Load 2 specified in Figure 2. 24. AD Mux port timing applies to left AD Mux port and right port configured to AD Mux port. 25. This parameter is guaranteed by not tested. Document Number: 001-08090 Rev. *I Page 12 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Switching Characteristics for VCC = 1.8 V (continued) Over the Operating Range [23] (continued) Parameter CYDMX256A16 CYDMX128A16 CYDMX256B16 CYDMX128B16 CYDMX064B16 CYDMX256A16 CYDMX128A16 CYDMX064A16 –65 –65 –90 Description AD Mux Port Write Cycle Min Max Min Max Min Max Unit [26] tWC Write cycle time 65 – 65 – 90 – ns tSCS CS# Low to write end 65 – 65 – 90 – ns tAVD ADV# Low pulse 15 – 15 – 20 – ns tAVDS Address setup to ADV# rising edge 15 – 15 – 20 – ns tAVDH Address hold from ADV# rising edge 3 – 3 – 5 – ns tCSS CS# setup to ADV# rising edge 7 – 7 – 10 – ns tWRL WE# pulse width 28 – 28 – 45 – ns tBW UB#/LB# Low to write end 28 – 28 – 45 – ns tSD Data setup to write end 20 – 20 – 30 – ns tHD Data hold from write end 0 – 0 – 0 – ns tLZWE WE# High to IO Low Z 0 – 0 – 0 – ns tAVWE ADV# High to WE# Low 0 – 0 – 0 – ns Standard Port Read Cycle[27] tRC Read cycle time 40 – 60 – 60 – ns tAA Address to data valid – 40 – 60 – 60 ns tOHA Output hold from address change 5 – 5 – 5 – ns tACS CS# to data valid – 40 – 60 – 60 ns OE# Low to data valid – 25 – 35 – 35 ns OE# Low to data Low Z 5 – 5 – 5 – ns tHZOE OE# High to data High Z – 10 – 30 – 30 ns tLZCS CS# Low to data Low Z 5 – 5 – 5 – ns tHZCS CS# High to data High Z – 10 – 30 – 30 ns tLZBE UB#/LB# Low to data Low Z 5 – 5 – 5 – ns tHZBE UB#/LB# High to data High Z – 10 – 30 – 30 ns tABE UB#/LB# access time – 40 – 60 – 60 ns 40 – 60 – 60 – ns tDOE tLZOE [28] Standard SRAM Port Write Cycle tWC Write cycle time tSCS CS# Low to Write End 30 – 50 – 50 – ns tAW Address valid to write end 30 – 50 – 50 – ns tHA Address hold from write end 0 – 0 – 0 – ns tSA Address setup to write start 0 – 0 – 0 – ns Notes 26. AD Mux port timing applies to left AD Mux port and right port configured to AD Mux port. 27. Standard SRAM port timing applies to right port configured to standard SRAM port. 28. This parameter is guaranteed by not tested. Document Number: 001-08090 Rev. *I Page 13 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Switching Characteristics for VCC = 1.8 V (continued) Over the Operating Range [23] (continued) Parameter CYDMX256A16 CYDMX128A16 CYDMX256B16 CYDMX128B16 CYDMX064B16 CYDMX256A16 CYDMX128A16 CYDMX064A16 –65 –65 –90 Description Min Max Min Max Min Unit Max tWRL Write pulse width 25 – 45 – 45 – ns tSD Data setup to write end 20 – 30 – 30 – ns tHD Data hold from write end 0 – 0 – 0 – ns tHZWE WE# Low to data High Z – 15 – 25 – 25 ns tLZWE WE# High to data Low Z 0 – 0 – 0 – ns Arbitration Timing tBLA BUSY# Low from address match – 30 – 50 – 50 ns tBHA BUSY# High from address mismatch – 30 – 50 – 50 ns tBLC BUSY# Low from CS# Low – 30 – 50 – 50 ns tBHC BUSY# High from CS# High – 30 – 50 – 50 ns tPS[29] Port setup from priority 5 – 5 – 5 – ns tBDD BUSY# High to data valid – 30 – 50 – 50 ns tWDD Write pulse to data delay – 55 – 85 – 85 ns tDDD Write data valid to read data valid – 45 – 70 – 70 ns Interrupt Timing tINS INT# set time – 35 – 55 – 55 ns tINR INT# reset time – 35 – 55 – 55 ns Note 29. Add 2 ns to this parameter if VCC and VDDIOR are < 1.8 V, and VDDIOL is > 2.5 V at temperature < 0 °C. Document Number: 001-08090 Rev. *I Page 14 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Switching Waveforms Figure 3. ADM Port Read Cycle (Either Port Access, WE# High) tACC2 tAVD S tAVDH Valid Address I/O[15:0] Valid Data tACC1 tAVD ADV# tAVDA tHZC S tACC3 t CSS CS# t HZOE tOE OE# tAVOE WE# tHZ BE tLZ BE UB#, LB# tDBE Figure 4. ADM Port Write Cycle (Either Port Access, WE# Controlled, OE# High) tAVD S I/O[15:0] ADV# tAVDH t SD Addr1<15..0> tHD WData1<15..0> tAVD tSCS CS# t CSS OE# tWRL WE# t AVWE UB#, LB# Document Number: 001-08090 Rev. *I tBW Page 15 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Figure 5. ADM Port Write Cycle (Either Port Access, CS# Controlled, OE# High) tAVD S I/O[15:0] ADV# t SD tAVDH Addr1<15..0> tHD WData1<15..0> tAVD tSCS CS# t CSS OE# tWRL WE# t AVWE UB#, LB# tBW Figure 6. Standard Port Read Cycle (Right Port Access, WE# High) t RC tAA Address t OHA Valid Address tACS CS# tLZCS tHZ CS tDOE OE# tLZOE tHZOE WE# t ABE UB#, LB# Data Out Document Number: 001-08090 Rev. *I tLZ BE tHZ BE Valid Data Page 16 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Figure 7. Standard Port Write Cycle (Right Port Access, WE# Controlled) tWC tAW Valid Address Address t SA tHA CS# OE# tWRL tH ZWE WE# UB#, LB# tLZWE t BW tSD tHD Valid Data Data Figure 8. Standard Port Write Cycle (Right Port Access, CS# Controlled) tWC tAW Valid Address Address t SA CS# tHA tSCS tLZCS OE# tWRL WE# UB#, LB# tH ZWE t BW tSD Data Document Number: 001-08090 Rev. *I tHD Valid Data Page 17 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Figure 9. Arbitration Timing Address Match Address L & R CS#R tPS CS#L tBLC tBHC BUSY#L Figure 10. Arbitration Timing (Address Controlled with Left ADM and Right Standard Configuration Left Address Valid First I/OL[15:0] ADV#L t AVDH Address L (Internal) Valid Left Address t PS Address Match Address R Mismatch t BLA tBH A BUSY#R Right Address Valid First I/OL[15:0] Valid Address ADV#L Data Valid Address t AVDH tAVDH Address L (Internal) Address Match Mismatch tPS Address R Valid Address tBLA tBHA BUSY#L Document Number: 001-08090 Rev. *I Page 18 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Figure 11. Arbitration Timing (Address Controlled with Left ADM and Right ADM Configuration) ADV#L tAVDH tAVDH Address L (Internal) Mismatch ADV#R t PS tAVDH Address R (internal) Address Match tBLA tBHA BUSY#R Figure 12. Read with BUSY# Timing I/OL[15:0] Valid Address Data Valid Address AVD#L WE#L Address R Address Match BUSY#R tBDD t DDD Data Out R Valid Data tWDD Document Number: 001-08090 Rev. *I Page 19 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Figure 13. Interrupt Timing Left Port Writes Right Mailbox to set INT#R I/OL[15:0] Right Mailbox Addr Write D ata tHD OE#L CS#L WE#L CS# or WE#, whichever assert HIGH first CS# or WE#, whichever assert LOW later t INS INT#R Right Port Reads Right Mailbox to Clear INT#R Address R Right Mailbox Addr CS#R OE#R WE#R CS#, OE# or WE#, whichever assert latest tINR INT#R Document Number: 001-08090 Rev. *I Page 20 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Ordering Information 16 K × 16 MoBL ADM Asynchronous Dual-Port SRAM Speed (ns) Ordering Code Package Name Package Type Operating Range 65 CYDMX256A16-65BVXI BZ100 100-ball Pb-free 0.5 mm pitch BGA Industrial 65 CYDMX256B16-65BVXI BZ100 100-ball Pb-free 0.5 mm pitch BGA Industrial 90 CYDMX256A16-90BVXI BZ100 100-ball Pb-free 0.5 mm pitch BGA Industrial 8 K × 16 MoBL ADM Asynchronous Dual-Port SRAM Speed (ns) Ordering Code Package Name Package Type Operating Range 65 CYDMX128A16-65BVXI BZ100 100-ball BGA Pb-free Industrial 65 CYDMX128B16-65BVXI BZ100 100-ball BGA Pb-free Industrial 4 K × 16 MoBL ADM Asynchronous Dual-Port SRAM Speed (ns) 90 Ordering Code CYDMX064A16-90BVXI Package Name BZ100 Package Type 100-ball BGA Pb-free Operating Range Industrial Ordering Code Definitions CYDM X XXX X XX - XX BV X I Temperature Range: I = Industrial X = Pb-free Package Type: BV = 100-ball BGA Latency in ns: 65 / 90 Bus Width Version Dual-Port density in Kb: 064 / 128 / 256 X = AD Mux interface No X = standard SRAM interface CYDM = Cypress MoBL Dual-Port Document Number: 001-08090 Rev. *I Page 21 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Package Diagram Figure 14. 100-ball VFBGA (6 × 6 × 1.0 mm) BZ100 Package Outline, 51-85209 51-85209 *D Document Number: 001-08090 Rev. *I Page 22 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Acronyms Acronym Document Conventions Description Units of Measure BGA Ball Grid Array CMOS Complementary Metal Oxide Semiconductor °C degree Celsius CS Chip Select MHz megahertz I/O Input/Output µA microampere LVCMOS Low Voltage Complementary Metal Oxide Semiconductor mA milliampere mm millimeter LVTTL Low Voltage Transistor-Transistor Logic ms millisecond ODR Output Drive Register mV millivolt OE Output Enable ns nanosecond SRAM Static Random Access Memory ohm TTL Transistor-Transistor Logic % percent VFBGA Very Fine-Pitch Ball Grid Array WE Write Enable Document Number: 001-08090 Rev. *I Symbol Unit of Measure pF picofarad V volt W watt Page 23 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Document History Page Document Title: CYDMX256A16/CYDMX256B16/CYDMX128A16/CYDMX128B16/CYDMX064A16/CYDMX064B16, 16 K/8 K/4 K × 16 MoBL® ADM Asynchronous Dual-Port Static RAM Document Number: 001-08090 Rev. ECN No. Orig. of Change Submission Date ** 462234 HKH New data sheet *A 491702 HKH Updated Switching Characteristics for VCC = 1.8 V: Removed none applicable timing tBW Revised standard port timing numbers Corrected typo *B 500425 HKH Updated Electrical Characteristics for VCC = 1.8 V: Updated DC data that are previously TBD. Description of Change Updated Electrical Characteristics for VCC = 2.5 V: Updated DC data that are previously TBD. Updated Switching Characteristics for VCC = 1.8 V: Added note for tLZOE that is guaranteed by design by not tested Updated tWC, tSCS to reflect bin spec Added note for special condition of tPS *C 2147866 YDT / HKH / AESA See ECN Relaxed -65 Standard port timing to match the standard port timing of -90. *D 3031102 VED 09/15/2010 Changed to post on the external web. No other change. *E 3053582 HKH 10/08/2010 Added Table of Contents. Added new devices CYDMX256B16, CYDMX128B16 and CYDMX064B16. Updated Ordering Information: Removed pruned device CYDMX064A16-65BVXI. Added Ordering Code Definitions. Updated sales links. *F 3209987 HKH 03/30/2011 Updated Ordering Information. Updated Package Diagram. Updated in new template. *G 3246085 HKH 05/02/2011 Added Acronyms and Units of Measure. *H 3401875 HKH 10/11/2011 Updated Ordering Information: Removed pruned device CYDMX064B16-65BVXI. *I 4418141 HBM 06/24/2014 Updated in new template. Completing Sunset Review. Document Number: 001-08090 Rev. *I Page 24 of 25 CYDMX256A16/CYDMX256B16 CYDMX128A16/CYDMX128B16 CYDMX064A16/CYDMX064B16 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Automotive Clocks & Buffers Interface Lighting & Power Control cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training cypress.com/go/plc Memory cypress.com/go/memory PSoC cypress.com/go/psoc Touch Sensing cypress.com/go/support cypress.com/go/touch USB Controllers Wireless/RF Technical Support cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2006-2014. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-08090 Rev. *I Revised June 24, 2014 Page 25 of 25 MoBL is a registered trademark of Cypress Semiconductor Corporation. All products and company names mentioned in this document may be the trademarks of their respective holders.