Document No.001-61466 Rev. *A ECN # 4012256 Cypress Semiconductor Package Qualification Plan QTP# 100603 May 2013 81-Ball Wafer Level Chip Scale Package (WLCSP) (3.8 x 3.8 x 0.53 mm) MSL1, 260C Amkor-Korea (GQ) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability Engineering, MTS (408) 943-2732 Mira Ben-Tzur Quality Engineering Director (408) 943-2675 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 5 Document No.001-61466 Rev. *A ECN # 4012256 PACKAGE QUALIFICATION HISTORY Qual Report 100603 Description of Qualification Purpose Qualify Amkor Korea for 81-ball WLCSP (Wafer Level Chip Scale Package) Package Technology at MSL1, 260C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 5 Date Comp May 10 Document No.001-61466 Rev. *A ECN # 4012256 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Test Condition (Temp/Bias) Stress/Test Constructional Analysis Acoustic Microscopy Test External Visual Highly Accelerated Saturation Test (HAST) Criteria: Meet external and internal characteristics of Cypress package J-STD-020 Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C MIL-PRF-38535, MILSTD-883, METHOD 2009, 130°C, 3.63V, 85%RH Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C Result P/F P P P P 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C P Pressure Cooker Test Solder ball Shear JESD22-B117 P MIL-STD-883C, Method 1010, Condition B, -55°C to 125°C Precondition: JESD22 Moisture Sensitivity Level 1 168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and JESD22A106B, Condition C, -55 C to 125C P Temperature Cycle Test Thermal Shock Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 5 P Document No.001-61466 Rev. *A ECN # 4012256 Reliability Test Data QTP #: Device Fab Lot # 100603 Assy Lot # Assy Loc Duration Samp Rej CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ COMP 15 0 CYWB0125ABX (7C071001BK) 4953165 611003749 AMKOR-GQ COMP 15 0 CYWB0125ABX (7C071001BK) 4952624 611003750 AMKOR-GQ COMP 15 0 CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ COMP 5 0 CYWB0125ABX (7C071001BK) 4953165 611003749 AMKOR-GQ COMP 5 0 611003748 AMKOR-GQ COMP 15 0 Failure Mechanism STRESS: ACOUSTIC, MSL1 STRESS: CONSTRUCTIONAL ANALYSIS STRESS: EXTERNAL VISUAL CYWB0125ABX (7C071001BK) 4953170 STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, PRE COND 168 HR 85C/85%RH, MSL1 CYWB0124ABX (7C071001AC) 4746765 610812072 AMKOR-GQ 128 71 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1 CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ 168 87 0 CYWB0124ABX (7C071001AC) 4746765 610812072 AMKOR-GQ 168 87 0 CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ COMP 5 0 CYWB0125ABX (7C071001BK) 4953165 611003749 AMKOR-GQ COMP 5 0 CYWB0125ABX (7C071001BK) 4952624 611003750 AMKOR-GQ COMP 5 0 STRESS: SOLDER BALL SHEAR STRESS: TC COND. B -55C TO 125C, PRE COND 168 HRS 85C/85%RH, MSL1 CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ 500 70 0 CYWB0125ABX (7C071001BK) 4953170 611003748 AMKOR-GQ 1000 70 0 CYWB0125ABX (7C071001BK) 4953165 611003749 AMKOR-GQ 500 77 0 CYWB0125ABX (7C071001BK) 4953165 611003749 AMKOR-GQ 1000 77 0 CYWB0125ABX (7C071001BK) 4952624 611003750 AMKOR-GQ 500 77 0 CYWB0125ABX (7C071001BK) 4952624 611003750 AMKOR-GQ 1000 77 0 611003748 AMKOR-GQ 200 80 0 STRESS: THERMAL SHOCK CYWB0125ABX (7C071001BK) 4953170 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 5 Document No.001-61466 Rev. *A ECN # 4012256 Document History Page Document Title: 100603: 81-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (3.8 X 3.8 X 0.53 MM) MSL1, 260C AMKOR-KOREA (GQ) Document Number: 001-61466 Rev. ECN No. ** 2932126 *A 4012256 Orig. of Change ILZ NSR Description of Change Initial spec release Removed VERSION 1.0 in the title page. Updated the Cypress technical contact information. Removed reference Cypress specs and replaced with industry standards in the reliability tests performed table. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 5