100603:81-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (3.8 X 3.8 X 0.53 MM) MSL1, 260C AMKOR-KOREA (GQ)

Document No.001-61466 Rev. *A
ECN # 4012256
Cypress Semiconductor
Package Qualification Plan
QTP# 100603
May 2013
81-Ball Wafer Level Chip Scale Package (WLCSP)
(3.8 x 3.8 x 0.53 mm)
MSL1, 260C
Amkor-Korea (GQ)
CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
Rene Rodgers
Reliability Engineering, MTS
(408) 943-2732
Mira Ben-Tzur
Quality Engineering Director
(408) 943-2675
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 5
Document No.001-61466 Rev. *A
ECN # 4012256
PACKAGE QUALIFICATION HISTORY
Qual
Report
100603
Description of Qualification Purpose
Qualify Amkor Korea for 81-ball WLCSP (Wafer Level Chip Scale Package) Package
Technology at MSL1, 260C
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 5
Date
Comp
May 10
Document No.001-61466 Rev. *A
ECN # 4012256
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Test Condition
(Temp/Bias)
Stress/Test
Constructional Analysis
Acoustic Microscopy Test
External Visual
Highly Accelerated Saturation Test
(HAST)
Criteria: Meet external and internal characteristics of Cypress package
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C
MIL-PRF-38535, MILSTD-883, METHOD 2009,
130°C, 3.63V, 85%RH
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C
Result
P/F
P
P
P
P
121°C, 100%RH, 15 Psig
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C
P
Pressure Cooker Test
Solder ball Shear
JESD22-B117
P
MIL-STD-883C, Method 1010, Condition B, -55°C to 125°C
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C
MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and JESD22A106B, Condition C, -55 C to 125C
P
Temperature Cycle Test
Thermal Shock
Company Confidential
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Page 3 of 5
P
Document No.001-61466 Rev. *A
ECN # 4012256
Reliability Test Data
QTP #:
Device
Fab Lot #
100603
Assy Lot #
Assy Loc
Duration
Samp
Rej
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
COMP
15
0
CYWB0125ABX (7C071001BK) 4953165
611003749
AMKOR-GQ
COMP
15
0
CYWB0125ABX (7C071001BK) 4952624
611003750
AMKOR-GQ
COMP
15
0
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
COMP
5
0
CYWB0125ABX (7C071001BK) 4953165
611003749
AMKOR-GQ
COMP
5
0
611003748
AMKOR-GQ
COMP
15
0
Failure Mechanism
STRESS: ACOUSTIC, MSL1
STRESS: CONSTRUCTIONAL ANALYSIS
STRESS: EXTERNAL VISUAL
CYWB0125ABX (7C071001BK) 4953170
STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, PRE COND 168 HR 85C/85%RH, MSL1
CYWB0124ABX (7C071001AC) 4746765
610812072
AMKOR-GQ
128
71
0
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
168
87
0
CYWB0124ABX (7C071001AC) 4746765
610812072
AMKOR-GQ
168
87
0
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
COMP
5
0
CYWB0125ABX (7C071001BK) 4953165
611003749
AMKOR-GQ
COMP
5
0
CYWB0125ABX (7C071001BK) 4952624
611003750
AMKOR-GQ
COMP
5
0
STRESS: SOLDER BALL SHEAR
STRESS: TC COND. B -55C TO 125C, PRE COND 168 HRS 85C/85%RH, MSL1
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
500
70
0
CYWB0125ABX (7C071001BK) 4953170
611003748
AMKOR-GQ
1000
70
0
CYWB0125ABX (7C071001BK) 4953165
611003749
AMKOR-GQ
500
77
0
CYWB0125ABX (7C071001BK) 4953165
611003749
AMKOR-GQ
1000
77
0
CYWB0125ABX (7C071001BK) 4952624
611003750
AMKOR-GQ
500
77
0
CYWB0125ABX (7C071001BK) 4952624
611003750
AMKOR-GQ
1000
77
0
611003748
AMKOR-GQ
200
80
0
STRESS: THERMAL SHOCK
CYWB0125ABX (7C071001BK) 4953170
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 5
Document No.001-61466 Rev. *A
ECN # 4012256
Document History Page
Document Title:
100603: 81-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (3.8 X 3.8 X 0.53 MM)
MSL1, 260C AMKOR-KOREA (GQ)
Document Number:
001-61466
Rev. ECN
No.
**
2932126
*A
4012256
Orig. of
Change
ILZ
NSR
Description of Change
Initial spec release
Removed VERSION 1.0 in the title page.
Updated the Cypress technical contact information.
Removed reference Cypress specs and replaced with industry
standards in the reliability tests performed table.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 5