Document No.001-89444 Rev. *A ECN # 4516853 Cypress Semiconductor Package Qualification Report QTP# 033203 VERSION*A September 2014 <16-Lead SOIC (150mils) Pb-Free, MSL3, 260C Solder Reflow Amkor-Phil FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 6 Document No.001-89444 Rev. *A ECN # 4516853 PACKAGE QUALIFICATION HISTORY Qual Report 033203 033203 Description of Qualification Purpose Qualify Amkor for <16-Lead SOIC (150mils) Pb-Free, MSL1, 260C Solder Reflow Temperature @ Amkor-Philippines Cypress established policy requiring MSL and Reflow Peak Temperature alignment for Cypress and its Assembly Subcontractors. Downgrade from MSL1 to MSL3. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 6 Date Comp. Dec 03 Mar 07 Document No.001-89444 Rev. *A ECN # 4516853 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: S1615 16-Lead Small Outline IC (SOIC) Sumitomo 6600H V-O per UL 94 Oxygen Rating Index: >28% Lead Frame Material: Copper Lead Finish, Composition / Thickness: Pure Tin Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8290 Die Attach Method: Eutectic Bond Diagram Designation 10-02699 Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0 mils Thermal Resistance Theta JA °C/W: 121.6°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 49-41999M Name/Location of Assembly (prime) facility: Amkor- Philippines (Phil-M) MSL3 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 6 Document No.001-89444 Rev. *A ECN # 4516853 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) High Accelerated Saturation Test (HAST) 130°C, 3.63V, 85%RH Precondition: JESD22 Moisture Sensitivity MSL 1 Temperature Cycle 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C Precondition: JESD22 Moisture Sensitivity MSL 1 Result P/F P P Pressure Cooker 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL 1 168 Hrs., 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C P High Temperature Storage 150C, no bias P Acoustic Microscopy J-STD-020 P X-Ray MIL-STD-883 - 2012 P Solderability J-STD-002, JESD22-B102 P External Visual MIL-PRF-38535, MILSTD-883, METHOD 2009 P Adhesion of Lead Finish MIL-STD-883, Method 2025 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 6 Document No.001-89444 Rev. *A ECN # 4516853 Reliability Test Data QTP #: 033203 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism ACOUSTIC, MSL1 CY2292SC 2322742 610340131 PHIL-M COMP 15 0 CY2292SC 2322742 610340131M PHIL-M COMP 15 0 CY2292SC 2322742 610340131M1 PHIL-M COMP 15 0 STRESS: ADHESION OF LEAD FINISH CY27022SC 9214305 610239606 PHIL-M COMP 5 0 CY27022SC 9214305 610239608 PHIL-M COMP 5 0 STRESS: EXTERNAL VISUAL CY2292SC 2322742 610340131M PHIL-M COMP 15 0 CY2292SC 2322742 610340131M1 PHIL-M COMP 15 0 STRESS: SOLDERABILITY CY2292SC 2322742 610340131 PHIL-M COMP 5 0 CY2292SC 2322742 610340131M PHIL-M COMP 5 0 2322742 610340131 PHIL-M COMP 15 0 STRESS: X-RAY CY2292SC STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.63V , PRE-COND. 168 HRS., 85C/85%RH, MSL1 CY2292SC 2322742 610340131 PHIL-M 128 42 0 CY2292SC 2322742 610340131M PHIL-M 128 48 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND. 168 Hrs., 85C/85%RH, MSL1 CY2292SC STRESS: 2322742 610340131 PHIL-M 168 48 0 TC CONDITION C, -65C TO 150C, PRE COND. 168 HRS., 85C/85%RH, MSL1 CY2292SC 2322742 610340131 PHIL-M 300 50 0 CY2292SC 2322742 610340131 PHIL-M 500 50 0 CY2292SC 2322742 610340131 PHIL-M 1000 49 0 CY2292SC 2322742 610340131M PHIL-M 300 50 0 CY2292SC 2322742 610340131M PHIL-M 500 49 0 CY2292SC 2322742 610340131M PHIL-M 1000 48 0 CY2292SC 2322742 610340131M1 PHIL-M 300 50 0 CY2292SC 2322742 610340131M1 PHIL-M 500 50 0 CY2292SC 2322742 610340131M1 PHIL-M 1000 50 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 6 Document No.001-89444 Rev. *A ECN # 4516853 Document History Page Document Title:QTP#033203: <16-Lead SOIC (150mils) Pb-Free, MSL3, 260C Solder Reflow Amkor-Phil Document Number: 001-89444 Rev. ECN Orig. of No. Change ** 4140895 HSTO *A 4516853 HSTO Distribution: WEB Posting: Description of Change Initial Specification Release Initiate report as per memo LGQ-695 Align qualification report based on the new template in the front page None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 6