QTP 124105:24-LEAD QFN (4X4X0.6MM) NI/PDAU, CU WireMSL3, 260C REFLOW CML Auto line-(RA).pdf

Document No.001-87448 Rev. *A
ECN # 4389223
Cypress Semiconductor
Package Qualification Report
QTP# 124105 VERSION *A
May 2014
24-Lead QFN (4X4X0.6mm)
Ni/PdAu, Cu Wire
MSL3, 260°°C Reflow
CML Autoline-(RA)
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-87448 Rev. *A
ECN # 4389223
PACKAGE QUALIFICATION HISTORY
QTP
Number
124105
Description of Qualification Purpose
Qualification of USB Serial using the Larger Die in Existing
Package in LQ24A CML-RA Assembly with Bare Cu Wire.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
Date
May
2013
Document No.001-87448 Rev. *A
ECN # 4389223
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
LQ24A
Package Outline, Type, or Name:
24 – Quad Flat No Lead (QFN)
Mold Compound Name/Manufacturer:
GE7470L / Nitto
Mold Compound Flammability Rating:
UL-94 V-0
Mold Compound Alpha Emission Rate:
<0.1
Oxygen Rating Index: >28%
N/A
Lead Frame Designation:
FMP
Lead Frame Material:
COPPER
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
Ni/PdAu
Die Backside Preparation Method/Metallization:
Backgrind
Die Separation Method:
Saw
Die Attach Supplier:
Henkel
Die Attach Material:
QMI519
Bond Diagram Designation
001-83110
Wire Bond Method:
Thermosonic
Wire Material/Size:
Copper / 0.8 mil
Thermal Resistance Theta JA °C/W:
18.36
Package Cross Section Yes/No:
No
Assembly Process Flow:
11-21099
Name/Location of Assembly (prime) facility:
CML-RA
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML, Philippines (RA)
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No.001-87448 Rev. *A
ECN # 4389223
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Accelerated Saturation Test
(HAST)
Test Condition (Temp/Bias)
Result
P/F
Internal Visual
JEDEC STD 22-A110, 130 C, 85%RH, 1.85V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
JESD22-A102, 121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
JESD22-A103, 150 C, no bias
Precondition: JEsSD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
Criteria: Meet external and internal
characteristics of package
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
MIL-STD-883-2014
Ball Shear
JESD22-B116A, Cpk : 1.33, Ppk : 1.66
P
Bond Pull
MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66
P
X-Ray
MIL-STD-883 - 2012
P
Pressure Cooker Test
Temperature Cycle
High Temp Storage
Acoustic Microscopy
Constructional Analysis
Dye Penetrant Test
Thermal Shock
Die Shear
MIL-STD-883C, Method 1011, Condition B, -55 C to
125C and JESD22-A106B, Condition C, -55 C to
125C
MIL-STD-883, Method 2019
Per die size:
 <3000 sq. mils = 1.2 kgf
 30001-5000 sq. mils = 1.2 kgf
 >5001 sq. mils = 1.2 kgf
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 7
P
P
P
P
P
P
P
P
P
P
Document No.001-87448 Rev. *A
ECN # 4389223
Reliability Test Data
QTP #: 124105
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304559
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304560
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304559
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304560
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
COMP
30
0
CY7C65211 (7CC68402A)
4252341
611304559
CML Autoline -(RA)
COMP
30
0
CY7C65211 (7CC68402A)
4252341
611304560
CML Autoline -(RA)
COMP
30
0
4252341
611304559
CML Autoline -(RA)
COMP
5
0
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304559
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304560
CML Autoline -(RA)
COMP
15
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYIS
CY7C65211 (7CC68402A)
STRESS: DIE SHEAR TEST
STRESS: DYE PENETRATION TEST
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304559
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304560
CML Autoline -(RA)
COMP
15
0
STRESS: HI-ACCEL SATURATION TEST, 130C, 1.85V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
128
78
0
CY7C65211 (7CC68402A)
4307374
611310387M CML Autoline -(RA)
128
77
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No.001-87448 Rev. *A
ECN # 4389223
Reliability Test Data
QTP #: 124105
Device
Fab Lot #
Assy Lot # Assy Loc
Duration
Samp Rej
Failure Mechanism
STRESS: HIGH TEMP STORAGE, 150C
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
500
80
0
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
1000
79
0
STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
500
78
0
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
1000
77
0
CY7C65211 (7CC68402A)
4252341
611304559
CML Autoline -(RA)
500
77
0
CY7C65211 (7CC68402A)
4252341
611304559
CML Autoline -(RA)
1000
77
0
CY7C65211 (7CC68402A)
4252341
611304560
CML Autoline -(RA)
500
77
0
CY7C65211 (7CC68402A)
4252341
611304560
CML Autoline -(RA)
1000
77
0
CY7C65211 (7CC68402A)
4307374
611310387M CML Autoline -(RA)
500
77
0
CY7C65211 (7CC68402A)
4307374
611310387M CML Autoline -(RA)
1000
77
0
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
200
80
0
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
1000
80
0
4252341
611304559
CML Autoline -(RA)
COMP
5
0
STRESS: THERMAL SHOCK
STRESS: INTERNAL VISUAL
CY7C65211 (7CC68402A)
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3)
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
168
77
0
CY7C65211 (7CC68402A)
4307374
611310387M CML Autoline -(RA)
168
77
0
CY7C65211 (7CC68402A)
4252341
611304558
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304559
CML Autoline -(RA)
COMP
15
0
CY7C65211 (7CC68402A)
4252341
611304560
CML Autoline -(RA)
COMP
15
0
STRESS: XRAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-87448 Rev. *A
ECN # 4389223
Document History Page
Document Title:
QTP#124105: 24-LEAD QFN (4X4X0.6MM) NI/PDAU, CU WIRE MSL3, 260C REFLOW CML
AUTOLINE-(RA)
001-87448
Document Number:
Rev. ECN
Orig. of
No.
Change
**
3991634 HSTO
*A
4389223 HSTO
Distribution: WEB
Posting:
Description of Change
Initial spec release
Align qualification report based on the new template in the front page.
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
Similar pages
QTP 101208:48-LEAD SSOP, KEG3000 M/C, NIPDAU, MSL3, 260C REFLOW CML-RA
QTP 102610:48-LEAD QFN (7X7X1.0 MM) NIPDAU, MSL3, 260C REFLOW CML-RA
QTP 114407:68-LEAD SAW QFN (QUAD FLAT NO-LEAD), (8 X 8 X 1.0MM), NIPDAU, MSL3, 260C REFLOW CML-RA
QTP 9380 32-Lead Saw QFN (Quad Flat No-Lead) (5 x 5 x 1mm) NiPdAu,MSL3, 260°C Reflow CML-RA .pdf
QTP# 082902:32-LEAD SAW QFN (QUAD FLAT NO-LEAD) (5 X 5 X 0.93MM), NIPDAU, MSL3 260C REFLOW, CML-RA
Qtp 92006 56-lead Saw Qfn (quad Flat No-lead) (8 X 8 X 1.0mm) Nipdau, Msl3, 260°c Reflow, Cml-ra.pdf
092002:32-LEAD - SAW QFN (QUAD FLAT NO-LEAD) (5 X 5 X 0.6MM) NIPDAU, MSL3, 260C REFLOW CML-RA
QTP 112104:32 QFN (5X5X0.6 MILS) / 36 QFN (5X5X0.6 MILS), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP 112603:16 QFN (3X3X0.6MM), NIPDAU-AG, MSL3 260C REFLOW ASEK- TAIWAN
QTP 140204 - 48 VFBGA (6x8x1.0mm) SAC 105, CuPd Wire MSL3, 260C Reflow CML-RA.pdf
QTP102902:24L SOIC 300 MILS PACKAGE, KEG3000, MSL3, 260C REFLOW, CML-RA
QTP NO 063711 20/28-LEAD (SSOP) (209MILS), NIPDAU, MSL3, 260C, CML-RA.pdf
QTP 112107:48QFN 7X7X1MM (LT48A, LT48C AND LT48D), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN
QTP#153305:48L TQFP (7x7x1.4mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow OSE-Taiwan (T)
QTP 023407 8-16 SOIC, MSL3, 235C, 260C, NIPDAU, CML-RA.pdf
QTP 110908:20L/24L QSOP, NIPDAU, MSL3 260C REFLOW JCET- CHINA (JT)
QTP#152602:100L TQFP (14X20X1.4MM) PURE SN LEADFINISH, CUPD WIRE, MSL3, 260C REFLOW, ASEK-TAIWAN (G)
QTP 94101 56-Lead QFN (Quad Flat No-Lead) (8 x 8 x 1.0 mm) NiPdAu-Ag, MSL3, 260C Reflow, Amkor- Philippines (MB).pdf
QTP 134802 24 QFN (4x4x0.6mm) Pure Sn, CuPd Wire MSL3, 260°C Reflow ASE-Taiwan (G).pdf
QTP 112302.pdf
QTP 133306 TQFP (14x14x1.4mm) Pure Sn Cupd Wire Msl3 260C Reflow Ase Taiwan (G).pdf
QTP 153701:New Package Qualification of the BKK 24 FBGA, with CuPd, KMC-3580LVA, CRM-1577DB, SAC 305, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4.pdf