Document No.002-03890 Rev. ** ECN # 4949578 Cypress Semiconductor Automotive Package Qualification Report QTP# 150418 VERSION ** September 2015 48L VGBGA (6x8x1.0mm) SAC-105 ball finish, Au Wire MSL3, 260C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.002-03890 Rev. ** ECN # 4949578 PACKAGE QUALIFICATION HISTORY QTP Number 150418 Description of Qualification Purpose Qualification of 48L VFBGA (6x8x1.0mm) in ASEK-Taiwan (G) using 0.8mil Au wire with KE-G2250 mold compound, Ablebond 2100A die attach material, 2L BT substrate material and SAC-105 solder finish at MSL3, 260C Reflow Temperature. 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Page 2 of 8 Date Sept 2015 Document No.002-03890 Rev. ** ECN # 4949578 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: BZ48A Package Outline, Type, or Name: 48L VFBGA (6x8x1.0mm) Mold Compound Name/Manufacturer: KE-G2250 / Kyocera Mold Compound Flammability Rating: V0 UL94 Mold Compound Alpha Emission Rate: 0.001 CPH/cm2 Oxygen Rating Index: >28% 28% Lead Frame Designation: N/A Lead Frame Material: N/A Substrate Material: BT Lead Finish, Composition / Thickness: SAC105 (SnAgCu) Die Backside Preparation Method/Metallization: Backgrind to 7mils Die Separation Method: Laser Groove + Mech’l Saw Die Attach Supplier: Ablestik Die Attach Material: Ablebond 2100A Bond Diagram Designation 001-95780 Wire Bond Method: Thermosonic Wire Material/Size: Au / 0.8mil Thermal Resistance Theta JA C/W: 30.68 C/W Package Cross Section Yes/No: Y Assembly Process Flow: 002-03864 Name/Location of Assembly (prime) facility: ASEK-Taiwan (G) MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Chipmos Taiwan (GO) Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 8 Document No.002-03890 Rev. ** ECN # 4949578 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Accelerated Saturation Test (HAST) Temperature Cycle Test Condition (Temp/Bias) AEC-Q100-008 and JESD22-A108, 125°C Dynamic Operating Condition, Vcc Max = 1.44V JESD22-A108, 125°C Dynamic Operating Condition, Vcc Max = 1.44V JESD22-A110, 130C, 5.55V, 85%RH Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C JESD22-A104, -65C to 150C Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C JESD22-A102, 121C, 100%RH, 15 Psig Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C Pressure Cooker Result P/F P P P P P Electrostatic Discharge Human Body Model (ESD-HBM) AEC-Q100-002 500V/1000V/1500V/2000V P Electrostatic Discharge Charge Device Model (ESD-CDM) AEC-Q100-011 250V/500V/ 750v (corner pins) P Wire Ball Shear AEC-Q100-001 P Wire Bond Pull Mil-Std 883, Method 2011 P Electrical Distribution AEC-Q100-009 P Latch up Sensitivity AEC-Q100-004 P Final Visual JESD22-B101B P Physical Dimensions JESD22-B100/108 P Solderability JESD22-B102 P Solder Ball Shear AEC Q100-010 P Post Temperature Cycle Wire Bond Pull Mil-Std 883, Method 2011 High Temperature Storage Life JESD22-A103, 150 C Test Dye Penetrant Test Criteria: No Package Crack Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package Acoustic J-STD-020 Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 8 P P P P Document No.002-03890 Rev. ** ECN # 4949578 Reliability Test Data QTP #: 150418 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej STRESS: ACOUSTIC, MSL3 CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G COMP 22 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G COMP 22 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G COMP 22 0 CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G COMP 150 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G COMP 150 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G COMP 150 0 CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G COMP 150 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G COMP 150 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G COMP 150 0 9507001 611516597 ASEK-G COMP 5 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY62147G30 (7A172147AO) BK48A STRESS: DYE PENETRANT TEST CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G COMP 15 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G COMP 15 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G COMP 15 0 STRESS: ELECTRICAL DISTRIBUTION CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G COMP 30 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G COMP 30 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G COMP 30 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 1.44V, Vcc Max CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 96 849 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G 96 849 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G 96 849 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 8 Failure Mechanism Document No.002-03890 Rev. ** ECN # 4949578 Reliability Test Data QTP #: 150418 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej STRESS: ESD-CHARGE DEVICE MODEL CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 250 3 0 CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 500 3 0 CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 750 3 0 STRESS: ESD-HUMAN BODY CIRCUIT CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 500 3 0 CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 1000 3 0 CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 2000 3 0 CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G COMP 2268 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G COMP 2349 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G COMP 2480 0 STRESS: FINAL VISUAL STRESS: HI-ACCEL SATURATION TEST, 130C, 5.55V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 96 85 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G 96 85 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G 96 85 0 611516597 ASEK-G 1000 85 0 STRESS: HIGH TEMPERATURE STORAGE CY62147G30 (7A172147AO) BK48A 9507001 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 125C, 1.44V, Vcc Max CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 1000 80 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G 1000 79 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G 1000 78 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 6 of 8 Failure Mechanism Document No.002-03890 Rev. ** ECN # 4949578 Reliability Test Data QTP #: 150418 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej STRESS: PRESSURE COOKER TEST CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 96 85 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G 96 85 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G 96 85 0 STRESS: PHYSICAL DIMENSION CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G COMP 30 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G COMP 30 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G COMP 30 0 611516597 ASEK-G 500 5 0 STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL CY62147G30 (7A172147AO) BK48A 9507001 STRESS: PRE/POST LFR CRITICAL PARAMETER CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G COMP 30+2 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G COMP 30+2 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G COMP 30+2 0 9507001 611516597 ASEK-G COMP 6 0 STRESS: STATIC LATCH-UP (+/-140mA 125C) CY62147G30 (7A172147AO) BK48A STRESS: SOLDER BALL SHEAR CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G COMP 150 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G COMP 150 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G COMP 150 0 CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G COMP 15 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G COMP 15 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G COMP 15 0 STRESS: SOLDERABILITY STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH CY62147G30 (7A172147AO) BK48A 9507001 611516597 ASEK-G 500 85 0 CY62147G30 (7A172147AO) BK48A 9507001 611516595 ASEK-G 500 85 0 CY62147G30 (7A172147AO) BK48A 9507001 611516596 ASEK-G 500 85 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Failure Mechanism Document No.002-03890 Rev. ** ECN # 4949578 Document History Page Document Title: Document Number: QTP#150418: AUTOMOTIVE 48L VGBGA (6X8X1.0MM) SAC-105 BALL FINISH, AU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G) 002-03890 Rev. ECN Orig. of No. Change ** 4949578 HSTO Description of Change Initial spec release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8