CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT QUARTER 3, 1998 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 STANDARD STRESS TEST DESCRIPTIONS TEST DESCRIPTION HTOL HTOL2 HTSSL HTSSL2 DRET DRET2 PCT HAST TC TC2 HTS High Temp Op Life, 150ºC, 5.75V High Temp Op Life, 125ºC, 5.75V High Temp Steady State Life, 150ºC, 5.75V High Temp Steady State Life, 125ºC, 5.75V Data Retension Test, Data Bake 165ºC, Plastic Data Retension Test, Data Bake 250ºC, Hermetic Pressure Cooker Test, 121ºC, 100%RH, No Bias Hi-Accel Saturation Test, 140ºC, 85%RH, 5.5V Bias Temp Cycle, 125ºC to -40ºC Temp Cycle, 150ºC to -65ºC High Temp Storage, 165ºC, No Bias Page 2 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 WAFER FAB AREAS FAB # LOCATION CA TX MN FR San Jose, California Round Rock, Texas Bloomington, Minnesota MHS, France ASSEMBLY LOCATION ID COMPANY/LOCATION KOREA-A ASAT-B USA-C PHIL-D USA-E INDNS-F TAIWAN-G KOREA-H MALAY-J THLAND-K KOREA-L PHIL-M USA-N INDNS-O USA-P KOREA-Q PHIL-R USA-S TAIWAN-T MALAY-U USA-V USA-W ALPHA-X ALPHA-Y THLAND-Z Anam-Buchon/Korea Asat/Hongkong Cypress/USA Dynesem/Philippines Cypress-Minnesota/USA Astra/Indonesia ASE/Taiwan Hyundai/Korea ASE/Malaysia TMS/Thailand Anam-Seoul/Korea Anam/Philippines Express/USA Omedata/Indonesia Pantronix/USA Anam-Bupyong/Korea Cypress/Philippines ATM/USA OSE/Taiwan Unisem/Malaysia Aplus/USA Toshiba/USA Cypress Bangkok/Thailand Alphatech/Thailand Hana/Thailand Page 3 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 DESCRIPTION OF DATA TABLE COLUMN HEADINGS COLUMN HEADING DESCRIPTION OF COLUMN CONTENTS Division Test Test Condition Device ID Date Code Lot Number Function Description Technology Process Pkg Material Pkg Type Pkg Location # Pins Duration # Test # Failed Fail Mode Cypress Manufacturing Division Common code for the stress performed. See table on previous page for detail. Tem/humidity/bias condition for the stress. See table on previous for detail Cypress part number Week in which specific lot was marked/sealed/molded. Manufacturing (assembly) lot number Generic product family at Cypress Brief description of device function Fabrication process technology. Generic fabrication process Generic packaging material Common code for standard package configuration (PDIP=Plastic Dual-In-Line-Package). Country Location + Initial of assembly house (see table on prvious page for detail). Pin cont of package in which device is assembled. Data Readpoint of stress. For Temp Cycle (TC) = Cycles; all other stresses=Hours. Quantity of devices submitted to this stress/test. Quantity of devices failing at this specific readpoint. Failure analysis results from this test, if any. Page 4 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT RELIABILITY DATA SUMMARY (Q398) 1 Equivalent Total Device Hours/Cycles. Derating factors are used for lower stress condition. Page 5 of 39 Quarter 3, 1998 Issued: 11/12/98 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 RELIABILITY DATA SUMMARY (Q398) Page 6 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Technology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Divi- FuncAssembly ProWfr Pkg Assy No Dura Qty Qty Device Eval# D/C Lot No Description cess Loc type Loc Pin tion Test Fail Fail Mode --------------- ------- ---- ---------- ----------- ------ --- ---- ------- --- ---- ----- ---- ------------------------- BICMOS-SM1 CY7B991-JC DRET 165C/NO BIAS DCD CHNL M83027 9818 219803361 PSCB BiCMOS TX PLCC ALPHA-X 32 168 1000 76 76 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HAST 130/3.63V DCD CHNL CY7B9514V-AC 98051 9823 619803937 SONET/SHD BiCMOS TX TQFP CSPI-R 100 128 48 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/4.8V DCD CHNL CY7B9514V-AC 98051 9823 619803937 SONET/SHD BiCMOS TX TQFP CSPI-R 100 48 500 0 619805327 SONET/SHD BiCMOS TX TQFP CSPI-R 100 48 499 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/4.8V DCD CHNL CY7B9514V-AC CY7B991-VC 125C/5.75V DCD CHNL CY7B991-JC 98051 9823 619803937 SONET/SHD BiCMOS TX TQFP CSPI-R 100 80 500 120 120 0 0 619805327 SONET/SHD BiCMOS TX TQFP CSPI-R 100 80 500 120 120 0 0 97501 9819 219803586L PSCB BiCMOS TX PLCC ALPHA-X 32 48 48 80 500 353 647 120 120 0 0 0 0 98293 9827 219804875L PSCB BiCMOS TX PLCC ALPHA-X 32 48 48 450 600 0 0 98221 9822 219803965 PSCB BiCMOS TX PLCC ALPHA-X 32 96 96 430 570 0 0 219803966 PSCB BiCMOS TX PLCC ALPHA-X 32 96 96 140 860 0 0 9818 219803361 PSCB BiCMOS TX PLCC ALPHA-X 32 96 96 120 380 0 0 M83010 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 7 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- BICMOS-SM1 CY7B9514V-AC HTSSL 150C/3.63V DCD CHNL 98051 9823 619803937 SONET/SHD BiCMOS TX TQFP CSPI-R 100 80 168 80 80 0 0 619805327 SONET/SHD BiCMOS TX TQFP CSPI-R 100 80 168 80 80 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH DCD CHNL CY7B9514V-AC 98051 9823 619803937 SONET/SHD BiCMOS TX TQFP CSPI-R 100 168 50 0 CY7B991-JC M83024 9818 219803361 PSCB BiCMOS TX PLCC ALPHA-X 32 168 76 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C DCD CHNL CY7B9514V-AC 98051 9823 619803937 SONET/SHD BiCMOS TX TQFP CSPI-R 100 300 50 0 9828 619807608 SONET/SHD BiCMOS TX TQFP CSPI-R 100 300 55 0 CY7B991-JC M83026 9818 219803361 PSCB BiCMOS TX PLCC ALPHA-X 32 300 45 0 CY7B991-VC 97501 9819 219803586L PSCB BiCMOS TX PLCC ALPHA-X 32 300 50 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 8 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Technology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Divi- FuncAssembly ProWfr Pkg Assy No Dura Qty Qty Device Eval# D/C Lot No Description cess Loc type Loc Pin tion Test Fail Fail Mode --------------- ------- ---- ---------- ----------- ------ --- ---- ------- --- ---- ----- ---- ------------------------- FAMOS-E3 CY37256VP160-AC 98376 DRET 165C/NO BIAS PLD 37K 9823 619806102 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 168 552 76 76 0 0 9830 619808070 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 168 552 76 76 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HAST 130C/5.5V PLD 37K CY37256VP160-AC 98376 9823 619806102 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 128 43 0 3 Thermal EOS 9830 619808070 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 128 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/5.75V PLD 37K CY37256VP160-AC 98376 9823 619806102 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 48 80 500 250 116 88 0 0 0 9830 619808070 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 48 48 80 500 50 200 140 140 0 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL 150C/5.5V PLD 37K CY37256VP160-AC 98376 9823 619806102 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 80 168 76 76 0 0 9830 619808070 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 80 168 76 75 0 0 1 Latch-up Induced Overst ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------LTOL -30C/6.50V PLD 37K CY37256VP160-AC 98376 9823 619806102 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 230 500 750 45 45 45 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH PLD 37K CY37256VP160-AC 98376 9823 619806102 288 50 Page 9 of 39 256 MCEL-3V CMOS 0 TW TQFP KOREA-Q 160 168 50 0 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- FAMOS-E3 CY37256VP160-AC 98376 160 PCT 121C/100%RH PLD 37K 9830 619808070 256 MCEL-3V CMOS TW TQFP KOREA-Q 168 288 45 45 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C PLD 37K CY37256VP160-AC 98376 9823 619806102 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 300 50 0 9830 619808070 256 MCEL-3V CMOS TW TQFP KOREA-Q 160 300 50 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 10 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- FAMOS-P20 CY7C341-RMB 97453 9743 349705389 REPROG.PAL CMOS TX WPGA PHIL-M 84 184 184 10 40 0 0 CY7C344-HMB 97457 9742 349705317 REPROG.PAL CMOS TX CERQ PHIL-M 28 184 50 0 HTOL 150C/5.75V PLD MAX No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/5.75V PLD MAX CY7C341-JC M82035 9814 619803505 REPROG.PAL CMOS TX PLCC KOREA-A 84 500 1000 2000 120 120 120 0 0 0 M82038 9814 619803505 REPROG.PAL CMOS TX PLCC KOREA-A 84 96 284 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.5V PLD MAX CY7C341-JC M82036 9814 619803505 REPROG.PAL CMOS TX PLCC KOREA-A 84 96 500 120 120 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C PLD MAX CY7C341-RMB 97453 9743 349705389 REPROG.PAL CMOS TX WPGA PHIL-M 84 100 50 0 CY7C344-HMB 97457 9742 349705317 REPROG.PAL CMOS TX CERQ PHIL-M 28 100 46 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 11 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- FAMOS-P26 CY27C010-PC HTOL2 125C/5.75V MPD PROM M82050 9747 619709651 128K x 8 CMOS TX PDIP KOREA-H No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------32 500 1000 2000 120 120 119 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.5V MPD PROM CY27C010-PC M82021 9747 619709651 128K x 8 CMOS TX PDIP KOREA-H 32 96 500 120 120 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 12 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- SRAM/LOGIC-C2AN VIC068A-BC 144 DRET 165C/NO BIAS DCD VME M83031 9821 349800804 VME INTERF. CMOS MN PPGA PHIL-M 168 1000 80 80 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH DCD VME VIC068A-BC M83029 9821 349800804 VME INTERF. CMOS MN PPGA PHIL-M 144 168 80 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C DCD VME VIC068A-BC M83030 9821 349800804 VME INTERF. CMOS MN PPGA PHIL-M 144 300 50 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 13 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- SRAM/LOGIC-L20 CY7C611A-NC 160 DRET 165C/NO BIAS DCD VME M83003 9818 619804439 RISC CONTRL CMOS TX PQFP HK-B 168 1000 82 82 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC -40C TO 125C DCD VME CY7C611A-NC M83004 9818 619804439 RISC CONTRL CMOS TX PQFP HK-B 160 300 52 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 14 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- SRAM/LOGIC-L27 HTOL2 125C/5.75V DCD CHNL CY7C955-NI M83007 9729 619704922 TRANSCEIVER CMOS MN PQFP KOREA-L 128 96 273 1 1 Shorted Metal (Bridging 125C/6.5V DCD CHNL CY7C955-NC 98319 9833 619808961 TRANSCEIVER CMOS TX PQFP KOREA-L 128 48 48 241 806 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH DCD CHNL CY7C955-NI M83034 9732 619705642 TRANSCEIVER CMOS MN PQFP KOREA-L 128 168 80 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C DCD CHNL CY7C955-NI M83036 9732 619705642 TRANSCEIVER CMOS MN PQFP KOREA-L 128 300 50 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 15 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-L28 HAST No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 140C/3.63V CPD TTECH CY22751PVC M82055 9804 619800214 CLOCK SYN. CMOS MN SSOP CSPI-R 48 128 128 11 69 0 0 140C/5.5V DCD PCLOG CY82C693-NC 98209 9828 619807947 PC CHIPSET CMOS TX PQFP MALAY-J 208 128 45 0 619807948 PC CHIPSET CMOS TX PQFP MALAY-J 208 128 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/5.75V CPD TTECH CY2291SC 98195 9823 34980844/7 CLOCK SYN. CMOS TX SOIC PHIL-M 20 48 48 48 48 149 209 298 299 0 0 0 0 DCD PCLOG CY82C693-NC 98209 9828 619807947 PC CHIPSET CMOS TX PQFP MALAY-J 208 48 80 168 78 0 0 619807948 PC CHIPSET CMOS 500 75 0 3 EOS TX PQFP MALAY-J 208 48 80 500 785 168 78 73 70 0 0 0 5 EOS 0 9829 619808385 PC CHIPSET CMOS TX PQFP MALAY-J 208 48 167 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS 165C/NO BIAS DCD PCLOG CY82C693-NC 98209 9828 619807948 PC CHIPSET CMOS TX PQFP MALAY-J 208 336 1000 48 48 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL 150C/5.5V DCD PCLOG CY82C693-NC 98209 9828 619807948 PC CHIPSET CMOS TX PQFP MALAY-J 208 80 168 73 72 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------LTOL -30C/5.75V CPD FCT CY74FCT543TSOC 98209 9822 619805959/ BUS SWITCH Page 16 of 39 CMOS TX SOIC CSPI-R 24 500 45 0 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Technology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Divi- FuncAssembly ProWfr Pkg Assy No Dura Qty Qty Device Eval# D/C Lot No Description cess Loc type Loc Pin tion Test Fail Fail Mode --------------- ------- ---- ---------- ----------- ------ --- ---- ------- --- ---- ----- ---- ------------------------- ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------SRAM/LOGIC-L28 PCT 121C/100%RH CPD TTECH CY22751PVC M83017 9804 619800309 CLOCK SYN. CMOS MN SSOP CSPI-R 48 168 78 0 DCD PCLOG CY82C693-NC 98209 9828 619807948 PC CHIPSET CMOS TX PQFP MALAY-J 208 168 48 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C DCD PCLOG CY82C693-NC 98209 9828 619807947 PC CHIPSET CMOS TX PQFP MALAY-J 208 300 47 0 619807948 PC CHIPSET CMOS TX PQFP MALAY-J 208 300 48 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 17 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-L31 HAST No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 140C/3.63 CPD FCT CY74FCT163LD952 98298 - 619807278 16 BIT REG. CMOS MN TSSO CSPI-R 56 128 45 0 140C/3.63V CPD FCT CY74FCT163LD827 98133 9810 619802795 20 BIT BUF. CMOS MN TSSO TAIWAN-T 56 128 44 0 619802795S 20 BIT BUF. CMOS MN TSSO TAIWAN-T 56 128 128 46 46 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/3.8V CPD FCT CY74FCT163LD827 98133 9810 619802795 20 BIT BUF. CMOS MN TSSO TAIWAN-T 56 24 80 500 116 116 116 0 0 0 619802795S 20 BIT BUF. CMOS MN TSSO TAIWAN-T 56 24 24 80 80 500 500 116 116 116 116 116 116 0 0 0 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS 165C/NO BIAS CPD FCT CY74FCT163LD827 98133 CY74FCT163LD952 98298 9810 619802795 - 20 BIT BUF. CMOS MN TSSO TAIWAN-T 56 336 45 0 619802795S 20 BIT BUF. CMOS MN TSSO TAIWAN-T 56 336 336 44 47 0 0 619807278 MN TSSO CSPI-R 56 336 500 45 45 0 0 16 BIT REG. CMOS ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------T/S -55C TO 150C CPD FCT CY74FCT163LD952 98298 - 619807278 16 BIT REG. CMOS MN TSSO CSPI-R 56 100 200 45 45 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C CPD FCT CY74FCT163LD827 98133 9810 619802795 20 BIT BUF. CMOS MN TSSO TAIWAN-T 56 300 45 0 619802795S 20 BIT BUF. CMOS MN TSSO TAIWAN-T 56 300 44 0 Page 18 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-L31 CY74FCT163LD827 98133 9810 619802795S 20 BIT BUF. CMOS CY74FCT163LD952 98298 - TC2 -65C TO 150C CPD FCT No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- MN TSSO TAIWAN-T 56 300 45 0 619807278 16 BIT REG. CMOS MN TSSO CSPI-R 56 300 45 0 619807279 16 BIT REG. CMOS MN TSSO CSPI-R 56 300 45 0 619807280 16 BIT REG. CMOS MN TSSO CSPI-R 56 300 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 19 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-R28 HAST No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 130C/5.5 DCD FIFO CY7C4245-AC M82060 9981 619804361 4Kx18 FIFO CMOS MN TQFP KOREA-Q 64 128 76 0 130C/5.5V DCD FIFO CY7C4245-AC M82059 9727 619704335 4Kx18 FIFO CMOS MN TQFP KOREA-Q 64 128 76 0 140C/5.5 MPD COMDTY CY7C1009-VC MR83033 9802 619711572 256K x 4 CMOS MN SOJ CSPI-R 32 128 80 0 CY7C109-VC MR83093 9820 519805328 128K x 8 CMOS MN SOJ INDNS-O 32 128 80 0 DPORT CY7C136-JC M83022 9811 519802844 2K x 8 DP CMOS MN PLCC INDNS-O 52 128 80 0 FIFO CY7C4245-AC M83016 9750 619710221 4Kx18 FIFO CMOS MN TQFP KOREA-Q 64 128 76 0 97442 9735 349704960 128K x 8 CMOS MN TSOP KOREA-GQ 32 128 48 0 98191 9817 619803751 128K x 8 CMOS MN TSOP PHIL-GW 32 128 128 45 47 0 0 619803752 128K x 8 CMOS MN TSOP PHIL-GW 32 128 128 46 46 0 0 619803753 128K x 8 CMOS MN TSOP PHIL-GW 32 128 128 45 48 0 0 140C/5.5V DCD MPD COMDTY CY7C109-ZC CY7C188-VC MR83028 9821 619805225 32K x 9 CMOS MN SOJ CSPI-R 32 128 80 0 CY7C199-VC 98210 32K x 8 CMOS MN SOJ PHIL-GW 28 128 50 0 619805353L 32K x 8 CMOS MN SOJ PHIL-GW 28 128 128 50 50 0 0 - 619805353 CY7C199-ZC 98301 9821 619805266 32K x 8 CMOS MN TSOP CSPI-R 28 128 45 0 CY7C199-ZI MR82080 9808 619802112 32K x 8 CMOS MN TSOP CSPI-R 28 128 76 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 20 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncAssembly ProWfr Pkg Assy No Dura Qty Qty Technology Test Test Condition sion tion Device Eval# D/C Lot No Description cess Loc type Loc Pin tion Test Fail Fail Mode ---------------- ------ ---------------- ----- ----- --------------- ------- ---- ---------- ----------- ------ --- ---- ------- --- ---- ----- ---- ------------------------SRAM/LOGIC-R28 HTOL 150C/5.5V 150C/5.75V MPD MPD COMDTY CY7C199-VC 98210 - 619805353 32K x 8 CMOS MN SOJ PHIL-GW 28 80 120 0 619805353L 32K x 8 CMOS MN SOJ PHIL-GW 28 80 80 120 120 0 0 COMDTY CY7C185-VC 98296 9836 619810123 SML/64K CMOS TX SOJ CSPI-R 28 48 1512 0 CY7C197-VC 98236 9827 519807749 256K x 1 CMOS TX SOJ CSPI-R 24 48 1518 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/ MPD COMDTY CY7C109-VC MR83020 9820 519805328 128K x 8 CMOS MN SOJ INDNS-O 32 96 406 0 125C/5.75V DCD DPORT M80121 9742 519713305 2K x 8 DP CMOS MN PLCC INDNS-O 52 96 96 96 500 1000 2000 12 52 52 116 116 116 0 0 0 0 0 0 M82052 9704 349700386 2K x 8 DP CMOS MN PLCC PHIL-M 52 500 1000 2000 120 120 120 0 0 0 M83013 9811 519802844 2K x 8 DP CMOS MN PLCC INDNS-O 52 500 1000 2000 120 120 120 0 0 0 MR83001 9802 619711572 256K x 4 CMOS MN SOJ CSPI-R 32 96 477 0 CY7C188-VC MR83003 9821 619805225 32K x 9 CMOS MN SOJ CSPI-R 32 96 377 0 CY7C136-JC M83005 2K x 8 DP CMOS MN PLCC INDNS-O 52 96 96 143 357 0 0 MPD 125C/5.7V DCD CY7C136-JC COMDTY CY7C1009-VC DPORT 9811 519802844 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 21 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R28 HTS 165C/NO BIAS MPD Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- COMDTY CY7C109-ZC 98191 9817 619803751 128K x 8 CMOS MN TSOP PHIL-GW 32 336 45 0 CY7C199-VC 98210 - 32K x 8 CMOS MN SOJ PHIL-GW 28 336 500 50 44 0 0 619805353L 32K x 8 CMOS MN SOJ PHIL-GW 28 336 336 500 500 50 50 36 44 0 0 0 0 619805353 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.5V DCD DPORT CY7C136-JC M82015 9704 349700386 2K x 8 DP CMOS MN PLCC PHIL-M 52 96 500 120 120 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH DCD DPORT CY7C136-JC MPD COMDTY CY7C109-VC M83020 9811 519802844 2K x 8 DP CMOS MN PLCC INDNS-O 52 168 80 0 MR83091 9820 519805328 128K x 8 CMOS MN SOJ INDNS-O 32 168 80 0 CY7C185-VC 98296 9828 619807754 SML/64K CMOS TX SOJ CSPI-R 28 168 50 0 CY7C188-VC MR83029 9821 619805225 32K x 9 CMOS MN SOJ CSPI-R 32 168 70 0 CY7C197-VC 98236 256K x 1 CMOS TX SOJ CSPI-R 24 168 48 0 9827 519807749 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------T/S -55C TO 150C MPD COMDTY CY7C109-ZC 98191 9817 619803751 128K x 8 CMOS MN TSOP PHIL-GW 32 100 200 45 45 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C DCD DPORT CY7C136-JC M83021 9811 519802844 2K x 8 DP CMOS MN PLCC INDNS-O 52 300 50 0 FIFO CY7C4245-AC M83008 9750 619710221 4Kx18 FIFO CMOS MN TQFP KOREA-Q 64 300 48 0 Page 22 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R28 TC2 -65C TO 150C MPD Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C1009-VC CY7C109-ZC No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- MR82063 9807 619711668 256K x 4 CMOS MN SOJ CSPI-R 32 300 43 5 5 Open- Bond Lift (Die) MR83035 9802 619711572 256K x 4 CMOS MN SOJ CSPI-R 32 300 50 0 97442 9735 349704960 128K x 8 CMOS MN TSOP KOREA-GQ 32 300 48 0 349704961 128K x 8 CMOS MN TSOP KOREA-GQ 32 300 48 0 349704962 128K x 8 CMOS MN TSOP KOREA-GQ 32 300 48 1 1 Mixed Reject 9817 619803751 128K x 8 CMOS MN TSOP PHIL-GW 32 300 45 0 619803752 128K x 8 CMOS MN TSOP PHIL-GW 32 300 45 0 619803753 98191 128K x 8 CMOS MN TSOP PHIL-GW 32 300 45 0 CY7C185-VC 98296 9828 619807754 SML/64K CMOS TX SOJ CSPI-R 28 300 48 0 CY7C199-VC 98210 - 32K x 8 CMOS MN SOJ PHIL-GW 28 300 50 0 619805353L 32K x 8 CMOS MN SOJ PHIL-GW 28 300 300 50 50 0 0 CMOS MN TSOP CSPI-R 28 300 50 0 CY7C199-ZI 619805353 MR83067 9819 619805260 32K x 8 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 23 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R3 HAST 140C/5.5V MPD Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C1020-VC CY7C199-VC 98222 9801 619711135 MR83082 9816 619804270 No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 32K x16 CMOS MN SOJ CSPI-R 44 128 45 0 256K CMOS MN SOJ CSPI-R 28 128 80 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/6.5V DCD FIFO CY7C4265-JC CY7C4271-JC 97415 97415 9710 619700831S 16KX18 FIFO CMOS MN PLCC PHIL-M 68 48 428 0 9711 619700973S 16KX18 FIFO CMOS MN PLCC PHIL-M 68 48 363 1 1 Non Visual 9737 619707057S 32Kx9 FIFO CMOS MN PLCC KOREA-A 32 48 382 0 9819 219803518P 32Kx9 FIFO CMOS MN PLCC KOREA-A 32 48 863 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/5.75V MPD COMDTY CY7C1021-ZSC CY7C199-VC MR83044 9825 619806720 64K x16 CMOS MN TSOP CSPI-R 44 96 530 0 M80193 256K CMOS MN SOJ 28 96 500 1000 2000 111 103 103 102 0 5 EOS 0 1 1 Unknown Cause 0 9802 619711953 CSPI-R ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS 165C/NO BIAS MPD COMDTY CY7C1020-VC 98222 9801 619711135 32K x16 CMOS MN SOJ CSPI-R 44 336 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.5V MPD COMDTY CY7C199-VC M82005 9802 619711953 256K CMOS MN SOJ SYNC M82046 9804 519800339 64K x 18 CMOS MN PLCC INDNS-O CY7C1031-JC CSPI-R 28 96 500 108 108 0 0 52 96 500 120 120 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH MPD COMDTY CY7C199-VC MR83080 9816 619804270 Page 24 of 256K 39 CMOS MN SOJ CSPI-R 28 168 80 0 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------SRAM/LOGIC-R3 T/S -55C TO 150C MPD COMDTY CY7C1020-VC 98222 9801 619711135 32K x16 CMOS MN SOJ CSPI-R 44 100 200 45 45 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C MPD COMDTY CY7C1020-VC 98222 9801 619711135 32K x16 CMOS MN SOJ CSPI-R 44 300 45 0 619711136 32K x16 CMOS MN SOJ CSPI-R 44 300 45 0 9825 619806605 32K x16 CMOS MN SOJ CSPI-R 44 300 45 0 CY7C1021-VC MR83053 9817 619804496 64K x16 CMOS MN SOJ CSPI-R 44 300 53 0 CY7C199-VC MR83081 9816 619804270 256K CMOS MN SOJ CSPI-R 28 300 50 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 25 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-R31 CY7C1399-VC HAST 140C/3.3V 140C/5.5V MPD MPD SYNC SYNC CY7C1399-ZC No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- MR82038 9742 619708394 32K x 8 CMOS MN SOJ PHIL-M 28 128 128 26 58 0 0 MR83076 9816 619804105 32K x 8 CMOS MN SOJ PHIL-M 28 128 80 0 98206 9823 349800821 32K x 8 CMOS MN TSOP PHIL-M 28 128 45 0 349800822 32K x 8 CMOS MN TSOP PHIL-M 28 128 45 0 349800823 32K x 8 CMOS MN TSOP PHIL-M 28 128 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/5.75V MPD SYNC CY7C1399-ZC 98206 9823 349800821 32K x 8 CMOS MN TSOP PHIL-M 28 80 116 0 349800822 32K x 8 CMOS MN TSOP PHIL-M 28 80 116 0 349800823 32K x 8 CMOS MN TSOP PHIL-M 28 80 116 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/3.65V MPD SYNC CY7C1399-VC MR82003 9742 619708394 32K x 8 CMOS MN SOJ PHIL-M 28 96 493 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS 165C/NO BIAS MPD SYNC CY7C1399-ZC 98206 9823 349800821 32K x 8 CMOS MN TSOP PHIL-M 28 336 500 45 40 0 0 349800822 32K x 8 CMOS MN TSOP PHIL-M 28 336 500 45 40 0 0 349800823 32K x 8 CMOS MN TSOP PHIL-M 28 336 500 45 40 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH MPD SYNC CY7C1399-VC MR82040 9742 619708394 32K x 8 CMOS MN SOJ PHIL-M 28 168 80 0 MR83074 9816 619804105 32K x 8 CMOS MN SOJ PHIL-M 28 168 80 0 Page 26 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------SRAM/LOGIC-R31 TC2 -65C TO 150C MPD SYNC CY7C1399-VC CY7C1399-ZC MR82039 9742 619708394 32K x 8 CMOS MN SOJ PHIL-M 28 300 50 0 MR83075 9816 619804105 32K x 8 CMOS MN SOJ PHIL-M 28 300 50 0 98206 9823 349800821 32K x 8 CMOS MN TSOP PHIL-M 28 300 45 0 349800822 32K x 8 CMOS MN TSOP PHIL-M 28 300 45 0 349800823 32K x 8 CMOS MN TSOP PHIL-M 28 300 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 27 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R32 HAST 140C/5.5V MPD Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY62128-SC CY7C109-VC 98154 98207 9821 619805763 No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 128K x 8 CMOS MN SOIC TAIWAN-G 32 128 50 0 619805764L 128K x 8 CMOS MN SOIC TAIWAN-G 32 128 50 0 619805765L 128K x 8 CMOS MN SOIC TAIWAN-G 32 128 50 0 9815 519803680 128K x 8(5) CMOS MN SOJ INDNS-O 32 128 44 0 1 Thermal EOS 519804082 128K x 8(5) CMOS MN SOJ INDNS-O 32 128 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/3.45V 150C/5.75V MPD MPD SYNC CY6157R202V0-ZC 98364 COMDTY CY62128-SC 98154 98265 9828 619808086 256K/2M ROM CMOS MN TSOP KOREA-GQ 32 48 3956 1 ***** FA IS PENDING ***** 619808087 256K/2M ROM CMOS MN TSOP KOREA-GQ 32 48 2679 0 9830 619808759 256K/2M ROM CMOS MN TSOP KOREA-GQ 32 48 2892 0 9821 619805763 128K x 8 CMOS MN SOIC TAIWAN-G 32 80 500 120 120 0 0 619805764L 128K x 8 CMOS MN SOIC TAIWAN-G 32 80 500 120 120 0 0 619805765L 128K x 8 CMOS MN SOIC TAIWAN-G 32 80 500 120 120 0 0 9827 619807408D 128K x 8 CMOS MN SOIC TAIWAN-G 32 48 1233 0 9828 619807508D 128K x 8 CMOS MN SOIC TAIWAN-G 32 48 1190 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/3.8V 125C/5.75 MPD MPD COMDTY CY62256V-ZC COMDTY CY62256-SNC MR82011 9807 619801398 32K x 8 CMOS MN TSOP CSPI-G 28 96 484 0 MR83007 9807 619801398 32K x 8 CMOS MN TSOP CSPI-G 28 96 500 0 MR82012 9809 519802034 32K x 8 CMOS CA NSOI INDNS-O 28 96 96 150 153 0 3 Test Program Revision 0 Page 28 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R32 HTOL2 Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 125C/5.75 MPD COMDTY CY7C109-VC MR83021 9825 519806900 128K x 8(5) CMOS MN SOJ INDNS-O 32 96 239 0 125C/5.75V MPD COMDTY CY62256V-NSC MR83022 9803 519800428 32K x 8 CMOS MN NSOI INDNS-O 28 96 453 0 125C/6.5V MPD COMDTY CY7C109-VC 97438 9745 519712349D 128K x 8(5) CMOS MN SOJ INDNS-O 32 96 742 0 9746 519712283D 128K x 8(5) CMOS MN SOJ INDNS-O 32 96 648 0 9752 519714712d 128K x 8(5) CMOS MN SOJ INDNS-O 32 96 849 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS 165C/NO BIAS MPD COMDTY CY62128-SC CY7C109-VC 98154 98207 9821 619805763 128K x 8 CMOS MN SOIC TAIWAN-G 32 336 50 0 619805764L 128K x 8 CMOS MN SOIC TAIWAN-G 32 336 50 0 619805765L 128K x 8 CMOS MN SOIC TAIWAN-G 32 336 1000 50 45 0 0 9815 519803680 128K x 8(5) CMOS MN SOJ INDNS-O 32 336 1000 45 40 0 0 519804082 128K x 8(5) CMOS MN SOJ INDNS-O 32 336 1000 45 40 0 0 519804109 128K x 8(5) CMOS MN SOJ INDNS-O 32 336 1000 45 40 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH MPD COMDTY CY62256-SNC CY62256V-NSC CY62256V-ZC MR83097 9820 519805349 32K x 8 CMOS CA NSOI INDNS-O 28 168 79 0 MR82076 9745 519712511 32K x 8 CMOS MN NSOI INDNS-O 28 96 168 80 77 0 1 Test Program Revision 0 MR83054 9803 499802341 32K x 8 CMOS MN NSOI INDNS-O 28 168 80 0 MR82070 9807 619801398 32K x 8 CMOS MN TSOP CSPI-G 28 168 80 0 MR83024 9807 619801398 32K x 8 CMOS MN TSOP CSPI-G 28 96 80 0 Page 29 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- SRAM/LOGIC-R32 PCT 121C/100%RH MPD Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C1009-ZC 98192 - 619804698 No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 128K x 8(5) CMOS MN TSOP PHIL-GW 32 168 45 0 619804698L 128K x 8(5) CMOS MN TSOP PHIL-GW 32 168 168 45 45 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C MPD COMDTY CY62128-SC CY62256V-NSC CY62256V-ZC CY7C1009-ZC CY7C109-VC 98154 9821 619805763 128K x 8 CMOS MN SOIC TAIWAN-G 32 300 50 0 619805764L 128K x 8 CMOS MN SOIC TAIWAN-G 32 300 50 0 619805765L 128K x 8 CMOS MN SOIC TAIWAN-G 32 300 50 0 MR82075 9745 519712511 32K x 8 CMOS MN NSOI INDNS-O 28 300 50 0 MR83055 9803 499802341 32K x 8 CMOS MN NSOI INDNS-O 28 300 51 0 MR82069 9807 619801398 32K x 8 CMOS MN TSOP CSPI-G 28 300 50 0 MR83025 9807 619801398 32K x 8 CMOS MN TSOP CSPI-G 28 300 50 0 98192 128K x 8(5) CMOS MN TSOP PHIL-GW 32 300 45 0 619804698L 128K x 8(5) CMOS MN TSOP PHIL-GW 32 300 300 45 45 0 0 98207 - 619804698 9815 519803680 128K x 8(5) CMOS MN SOJ INDNS-O 32 300 45 0 519804082 128K x 8(5) CMOS MN SOJ INDNS-O 32 300 45 0 519804109 128K x 8(5) CMOS MN SOJ INDNS-O 32 300 44 1 1 Topside Crack MR82045 9807 519801541 128K x 8(5) CMOS MN SOJ INDNS-O 32 300 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 30 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-R32D HTOL No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 150C/3.80V MPD SYNC CY7C1399-VC 97508 9732 619706098 32K x 8 CMOS MN SOJ CSPI-R 28 48 1010 150C/5.75V MPD COMDTY CY7C1599-VC 97508 9740 619707953 32K x 8(5) CMOS MN SOJ CSPI-R 28 48 998 9746 619709540 32K x 8(5) CMOS MN SOJ CSPI-R 28 48 1534 0 1 1 EOS/1 Non Visual 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.5V MPD COMDTY CY7C1049-VC M82057 9747 619709647 512K x 8 CMOS MN SOJ KOREA-L 36 96 500 120 120 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 31 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R33 TC2 -65C TO 150C MPD Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C1021V33-VC No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- MR83015 9731 619705415 64K x16 CMOS MN SOJ TAIWN-G 44 300 60 0 MR83016 9740 619707946 64K x16 CMOS MN SOJ TAIWN-G 44 300 60 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 32 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R42 HTOL Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 150C/3.8V MPD COMDTY CY62148V-SC 98112 9826 619806743 512K x 8 CMOS MN SOIC TAIWAN-G 32 48 48 48 48 48 188 301 323 323 390 0 0 0 0 0 150C/5.75V MPD COMDTY CY62148-SC 98111 9827 619807424 512K x 8 CMOS MN SOIC TAIWAN-G 32 500 120 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/5.75V MPD COMDTY CY62148-SC 98111 9827 619807424 512K x 8 CMOS MN SOIC TAIWAN-G 32 96 1595 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH MPD COMDTY CY62148-SC CY62148V-SC 98111 9827 619807424 512K x 8 CMOS MN SOIC TAIWAN-G 32 168 48 0 98112 9826 619806743 512K x 8 CMOS MN SOIC TAIWAN-G 32 168 46 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C MPD COMDTY CY62148-SC CY62148V-SC 98111 9827 619807424 512K x 8 CMOS MN SOIC TAIWAN-G 32 300 48 0 98112 9826 619806743 512K x 8 CMOS MN SOIC TAIWAN-G 32 300 48 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 33 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R42D HAST 130C/3.63V 140C/ MPD MPD Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SYNCHR CY7C1350-AC No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 98231 9824 619805770 128K x 36 CMOS MN TQFP CSPI-R 100 128 256 45 44 1 1 Poly Fuse Defect 0 98357 619808643 128K x 36 CMOS MN TQFP CSPI-R 100 128 48 0 64K x16 CMOS MN TSOP KOREA-H 44 128 79 0 COMDTY CY7C1021V33-ZSC MR82050 9816 619803608 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/3.8V MPD SYNCHR CY7C1350-AC CY7C1352-AC 98357 98357 9824 619805770 128K x 36 CMOS MN TQFP CSPI-R 100 48 80 500 750 393 390 0 1 1 Unknown Cause/1 EOS 0 9828 619807192 128K x 36 CMOS MN TQFP CSPI-R 100 48 48 80 548 288 396 396 396 0 0 0 0 9832 619809153 128K x 36 CMOS MN TQFP CSPI-R 100 48 66 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/3.8V MPD COMDTY CY7C1021V33-VC 98261 9833 619808408 64K x16 CMOS MN SOJ CSPI-R 44 96 96 906 906 0 0 619808409 64K x16 CMOS MN SOJ CSPI-R 44 96 96 950 950 0 0 619808410 64K x16 CMOS MN SOJ CSPI-R 44 96 96 905 905 0 0 619808411 64K x16 CMOS MN SOJ CSPI-R 44 96 96 923 923 0 0 619808412 64K x16 CMOS MN SOJ CSPI-R 44 96 96 979 979 0 0 619808413 64K x16 CMOS MN SOJ CSPI-R 44 96 96 962 963 0 0 619808414 64K x16 CMOS MN SOJ CSPI-R 44 96 96 1040 1041 0 0 Page 34 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- SRAM/LOGIC-R42D HTOL2 125C/3.8V MPD Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C1021V33-VC 98261 No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 9833 619808415 64K x16 CMOS MN SOJ CSPI-R 44 96 96 1081 1081 0 0 619808416 64K x16 CMOS MN SOJ CSPI-R 44 96 96 986 986 0 0 CY7C1021V33-ZSC MR82047 9816 619803608 64K x16 CMOS MN TSOP KOREA-H 44 96 494 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS 165C/NO BIAS MPD SYNCHR CY7C1350-AC 98231 9824 619805769 128K x 36 CMOS MN TQFP CSPI-R 100 336 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH MPD COMDTY CY7C1021V33-ZSC MR82052 9816 619803608 64K x16 CMOS MN TSOP KOREA-H 44 168 76 0 MR83085 9812 619802905 64K x16 CMOS MN TSOP KOREA-H 44 168 80 0 98357 128K x 36 CMOS MN TQFP CSPI-R 100 168 288 45 45 0 0 SYNCHR CY7C1352-AC 619808642 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------T/S -55C TO 150C MPD SYNCHR CY7C1350-AC 98231 9824 619805769 128K x 36 CMOS MN TQFP CSPI-R 100 100 200 45 45 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C MPD COMDTY CY7C1021V33-ZSC MR82052 9816 619803608 64K x16 CMOS MN TSOP KOREA-H 44 300 50 0 MR83086 9812 619802905 64K x16 CMOS MN TSOP KOREA-H 44 300 50 0 98231 9824 619805769 128K x 36 CMOS MN TQFP CSPI-R 100 300 45 0 619805770 128K x 36 CMOS MN TQFP CSPI-R 100 300 45 0 9828 619807192 128K x 36 CMOS MN TQFP CSPI-R 100 300 45 0 9824 619805769 128K x 36 CMOS MN TQFP CSPI-R 100 300 45 0 SYNCHR CY7C1350-AC 98357 Page 35 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- SRAM/LOGIC-R42D TC2 -65C TO 150C MPD Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SYNCHR CY7C1350-AC 98357 No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 9824 619805770 128K x 36 CMOS MN TQFP CSPI-R 100 300 45 0 9828 619807192 128K x 36 CMOS MN TQFP CSPI-R 100 300 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 36 of 39 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-R42HD HAST CY7C1011-ZC 140C/5.5V MPD SYNC 98313 9817 619804340 128K x 16 CMOS MN TSOP KOREA-H No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------44 128 50 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/5.75 150C/5.75V MPD DCD MPD COMDTY CY7C1020-ZSC DPORT CY7C038-AC COMDTY CY7C1009-VC CY7C1020-ZSC SYNC CY7C1011-ZC 98077 98368 98382 98077 98313 9816 619803865 32K x16 CMOS MN TSOP KOREA-H 44 48 500 0 619803866 32K x16 CMOS MN TSOP KOREA-H 44 48 500 0 9817 619803867 32K x16 CMOS MN TSOP KOREA-H 44 48 500 0 9826 619806813 64K x 18 DP CMOS MN TQFP TAIWAN-G 100 48 289 0 9829 619808005 64K x 18 DP CMOS MN TQFP TAIWAN-G 100 48 1234 0 9834 619809780 256K x 4 CMOS MN SOJ CSPI-R 32 48 1000 1 ***** FA IS PENDING ***** 619809782 256K x 4 CMOS MN SOJ CSPI-R 32 48 1000 0 619809783 CSPI-R 256K x 4 CMOS MN SOJ 32 48 1000 0 9816 619803865 32K x16 CMOS MN TSOP KOREA-H 44 80 120 0 619803866 32K x16 CMOS MN TSOP KOREA-H 44 80 120 0 9817 619803867 32K x16 CMOS MN TSOP KOREA-H 44 80 120 0 9825 619806805 128K x 16 CMOS MN TSOP KOREA-H 44 48 1021 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/5.75V MPD COMDTY CY7C1021-VC 98263 9825 619807027 64K x16 CMOS MN SOJ SYNC 98313 9825 619806805 128K x 16 CMOS MN TSOP KOREA-H CY7C1011-ZC CSPI-R 44 96 1545 0 44 96 452 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS 165C/NO BIAS MPD SYNC CY7C1011-ZC 98297 9829 619807660 Page 37 of 128K x 16 39 CMOS MN TSOP CSPI-R 44 336 49 0 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------SRAM/LOGIC-R42HD PCT 121C/100%RH DCD DPORT MPD COMDTY CY7C1020-ZSC SYNC CY7C038-AC 98368 9824 619806221 64K x 18 DP CMOS MN TQFP TAIWAN-G 100 168 44 0 98077 9816 619803865 32K x16 CMOS MN TSOP KOREA-H 44 96 168 45 45 0 0 619803866 32K x16 CMOS MN TSOP KOREA-H 44 96 45 0 9817 619803867 32K x16 CMOS MN TSOP KOREA-H 44 96 45 0 CY7C109-VC MR83039 9806 519801396 128K x 8(5) CMOS MN SOJ INDNS-O 32 168 80 0 CY7C1011-ZC 98313 128K x 16 MN TSOP KOREA-H 44 168 50 0 9817 619804340 CMOS ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------T/S -55C TO 150C MPD SYNC CY7C1011-ZC 98297 9829 619807660 128K x 16 CMOS MN TSOP CSPI-R 44 100 200 50 50 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C DCD DPORT MPD COMDTY CY7C1020-ZSC SYNC CY7C038-AC 98368 9824 619806221 64K x 18 DP CMOS MN TQFP TAIWAN-G 100 300 48 0 98077 9816 619803865 32K x16 CMOS MN TSOP KOREA-H 44 300 45 0 619803866 32K x16 CMOS MN TSOP KOREA-H 44 300 45 0 9817 619803867 32K x16 CMOS MN TSOP KOREA-H 44 300 45 0 CY7C109-VC MR83040 9806 519801396 128K x 8(5) CMOS MN SOJ 32 300 50 0 CY7C1011-ZC 98297 9829 619807660 128K x 16 CMOS MN TSOP CSPI-R 44 300 50 0 619807703 128K x 16 CMOS MN TSOP CSPI-R 44 300 50 0 Page 38 of 39 INDNS-O CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 3, 1998 Issued: 11/12/98 Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 3, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-R42HD TC2 CY7C1011-ZC -65C TO 150C MPD SYNC No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 98297 9829 619807756 128K x 16 CMOS MN TSOP CSPI-R 44 300 50 0 98313 9817 619804340 128K x 16 CMOS MN TSOP KOREA-H 44 300 50 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 39 of 39