Document No. 002-00093 Rev. ** ECN #: 4882334 Cypress Semiconductor Package Qualification Report QTP# 144503 VERSION ** August, 2015 300-mil 8LD PDIP Package Matte Sn Lead Finish, CuPd Wire UTL / Thailand FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Becky Thomas Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No. 002-00093 Rev. ** ECN #: 4882334 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number 140501 144503 Description of Qualification Purpose Qualification of the PDIP 8L (300mil) package at UTAC Thailand Limited (UTL), using 0.8mil CuPd bond wire, G600 mold compound, 8200T die attach, with matte Sn lead finish. Qualification of the PDIP 8L (300mil) package at UTAC Thailand Limited (UTL), using 0.8mil CuPd bond wire, G770HCD mold compound, 8200T die attach, with matte Sn lead finish. Date Aug 2014 Aug 2015 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No. 002-00093 Rev. ** ECN #: 4882334 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: PZ083 Mold Compound Flammability Rating: 8LD Green PDIP (300 mil) G770HCD / Sumitomo UL-94, V-0 Mold Compound Alpha Emission Rate: <0.1 Oxygen Rating Index: >28% 53% Lead Frame Designation: FMP Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: Matte Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Henkel Die Attach Material: 8200T Bond Diagram Designation 001-86140 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8 mil Thermal Resistance Theta JA C/W: 56 Package Cross Section Yes/No: No CP-CYP-002/PDIP Assembly Process Flow: Name/Location of Assembly (prime) facility: UTL / Thailand ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Sort: Cypress Minnesota, USA/ Class/Finish: UTL, Thailand Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No. 002-00093 Rev. ** ECN #: 4882334 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Data Retention (Plastic) Test Condition (Temp/Bias) Result P/F P Pressure Cooker Test 125 C, non-biased JESD22-A117 and JESD22-A103 JESD22-A102: 121 C, 100%RH, 15 PSIG Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C P Acoustic Microscopy P Flammability of Plastic J-STD-020 Time Zero Criteria: Meet external and internal characteristics of Cypress package follow ASTM D2863-77 and UL Standard 94 X-Ray MIL-STD-883 - 2012 P Constructional Analysis Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P P P Document No. 002-00093 Rev. ** ECN #: 4882334 Reliability Test Data QTP #: 144503 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: DATA RETENTION TEST, at 125C FM25V40-PGC 4421370 4421370TV1 UTAC - UT 500 80 0 FM25V40-PGC 4421370 4421370TV1 UTAC - UT 1000 80 0 FM25V40-PGC 4421370 4421370TV2 UTAC - UT 500 80 0 FM25V40-PGC 4421370 4421370TV2 UTAC - UT 1000 80 0 FM25V40-PGC 4421370 4421370TV3 UTAC - UT 500 80 0 FM25V40-PGC 4421370 4421370TV3 UTAC - UT 1000 80 0 STRESS: PRESSURE COOKER TEST, at 121 C, 100%RH, 15 PSIG FM25V40-PGC 4421370 4421370TV1 UTAC - UT 168 80 0 FM25V40-PGC 4421370 4421370TV2 UTAC - UT 168 80 0 STRESS: TEMPERATURE CYCLE TEST, Condition C, -65 C to 150 C FM25V40-PGC 4421370 4421370TV1 UTAC - UT 500 80 0 FM25V40-PGC 4421370 4421370TV1 UTAC - UT 1000 80 0 FM25V40-PGC 4421370 4421370TV2 UTAC - UT 500 80 0 FM25V40-PGC 4421370 4421370TV2 UTAC - UT 1000 80 0 FM25V40-PGC 4421370 4421370TV3 UTAC - UT 500 80 0 FM25V40-PGC 4421370 4421370TV3 UTAC - UT 1000 80 0 UTAC - UT UTAC - UT UTAC - UT COMP COMP COMP 15 15 15 0 0 0 4421370TV1 UTAC - UT COMP 5 0 4421370 4421370TV1 UTAC - UT COMP COMP 0 4421370 4421370 4421370 4421370TV1 4421370TV2 4421370TV3 UTAC - UT UTAC - UT UTAC - UT COMP COMP COMP 15 15 15 0 0 0 STRESS: ACOUSTIC MICROSCOPY / Time Zero FM25V40-PGC FM25V40-PGC FM25V40-PGC 4421370 4421370 4421370 4421370TV1 4421370TV2 4421370TV3 STRESS: CONSTRUCTIONAL ANALYSIS FM25V40-PGC 4421370 STRESS: FLAMMABILITY of PLASTIC FM25V40-PGC STRESS: X-RAY FM25V40-PGC FM25V40-PGC FM25V40-PGC Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No. 002-00093 Rev. ** ECN #: 4882334 Reliability Test Data QTP #: 140501 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej 611346958 611346957 611346956 UTAC - UT UTAC - UT UTAC - UT N/A N/A N/A 10 10 10 0 0 0 611346958 611346957 611346956 UTAC - UT UTAC - UT UTAC - UT N/A N/A N/A 10 10 10 0 0 0 611346958 611346957 611346956 UTAC - UT UTAC - UT UTAC - UT N/A N/A N/A 5 5 5 0 0 0 611346958 611346957 611346956 UTAC - UT UTAC - UT UTAC - UT N/A N/A N/A 496 469 976 0 0 0 96 96 96 77 76 77 0 0 0 116 116 0 0 Failure Mechanism STRESS: BALL SHEAR FM25V20A-PG FM25V20A-PG FM25V20A-PG 4346426 4346426 4346426 STRESS: BOND PULL FM25V20A-PG FM25V20A-PG FM25V20A-PG 4346426 4346426 4346426 STRESS: CONSTRUCTIONAL ANALYSIS FM25V20A-PG FM25V20A-PG FM25V20A-PG 4346426 4346426 4346426 STRESS: FINAL VISUALINSPECTION FM25V20A-PG FM25V20A-PG FM25V20A-PG 4346426 4346426 4346426 STRESS: HIGH ACCELERATED SATURATION TEST (HAST) FM25V20A-G 4351641 611406873 UTAC - UT FM25V20A-G 4351641 611406872 UTAC - UT FM25V20A-G 4351641 611406871 UTAC - UT STRESS: HIGH TEMPERATURE OPERATING LIFE- LATENT FAILURE RATE FM25V20A-G 4346426 611346960 UTAC - UT 168 FM25V20A-G 4346426 611346960 UTAC - UT 1000 STRESS: HIGH TEMPERATURE STORAGE FM25V20A-PG FM25V20A-PG FM25V20A-PG 4346426 4346426 4346426 611346958 611346957 611346956 UTAC - UT UTAC - UT UTAC - UT 1000 1000 1000 77 77 77 0 0 0 611346958 611346957 611346956 UTAC - UT UTAC - UT UTAC - UT N/A N/A N/A 5 5 5 0 0 0 611346958 611346957 611346956 UTAC - UT UTAC - UT UTAC - UT 168 168 168 77 77 77 0 0 0 STRESS: INTERNAL VISUAL FM25V20A-PG FM25V20A-PG FM25V20A-PG 4346426 4346426 4346426 STRESS: PRESSURE COOKER TEST FM25V20A-PG FM25V20A-PG FM25V20A-PG 4346426 4346426 4346426 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No. 002-00093 Rev. ** ECN #: 4882334 Reliability Test Data QTP #: 140501 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej UTAC - UT UTAC - UT 500 500 77 77 0 0 Failure Mechanism STRESS: TEMPERATURE CYCLE TEST FM25V20A-PG FM25V20A-PG 4346426 4346426 611346958 611346957 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.002-00093 Rev. ** ECN # 4882334 Document History Page Document Title: QTP #144503: QUALIFICATION OF THE PDIP 8L (300MIL) PACKAGE AT UTL, USING 0.8MIL CUPD BOND WIRE, G770HCD, 8200T, WITH MATTE SN Document Number: 002-00093 Rev. ECN Orig. of No. Change ** 4882334 BECK Description of Change Initial Release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8