VISHAY SI4484EY-T1

Si4484EY
Vishay Siliconix
N-Channel 100-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
100
rDS(on) (W)
ID (A)
0.034 @ VGS = 10 V
6.9
0.040 @ VGS = 6.0 V
6.4
D
SO-8
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
G
S
Top View
Ordering Information: Si4484EY
Si4484EY-T1 (with Tape and Reel)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
100
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 175_C)a
TA = 25_C
TA = 85_C
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche Energy (Duty Cycle v1%)
Continuous Source Current (Diode
L = 0.1
0 1 mH
Conduction)a
TA = 85_C
Operating Junction and Storage Temperature Range
4.8
5.4
3.7
30
IAR
25
EAR
31
PD
V
6.9
IDM
IS
TA = 25_C
Maximum Power Dissipationa
ID
A
mJ
3.1
1.5
3.8
1.8
2.3
1.1
TJ, Tstg
Unit
A
W
_C
- 55 to 175
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
33
40
70
85
17
21
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71189
S-03951—Rev. C, 26-May-03
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Si4484EY
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
VGS(th)
VDS = VGS, ID = 250 mA
2
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 80 V, VGS = 0 V
1
VDS = 80 V, VGS = 0 V, TJ = 85_C
20
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
VDS w 5 V, VGS = 10 V
rDS(on)
Forward Transconductancea
Diode Forward Voltagea
V
nA
mA
30
A
VGS = 10 V, ID = 6.9 A
0.028
0.034
VGS = 6.0 V, ID = 6.4 A
0.032
0.040
gfs
VDS = 15 V, ID = 6.9 A
25
VSD
IS = 3.1 A, VGS = 0 V
0.8
1.2
24
30
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
VDS = 50 V, VGS = 10 V, ID = 6.9 A
7.6
nC
5.4
0.5
1.25
2.2
td(on)
16
30
tr
10
20
35
70
20
40
50
80
VDD = 50 V, RL = 50 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = 3.1 A, di/dt = 100 A/ms
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
30
30
VGS = 10 thru 6 V
5V
24
I D - Drain Current (A)
I D - Drain Current (A)
24
18
12
6
18
12
TC = 150_C
6
25_C
- 55_C
4V
0
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
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2
5
0
1
2
3
4
5
6
VGS - Gate-to-Source Voltage (V)
Document Number: 71189
S-03951—Rev. C, 26-May-03
Si4484EY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
2500
0.04
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
0.05
VGS = 6.0 V
0.03
VGS = 10 V
0.02
2000
Ciss
1500
1000
Crss
500
0.01
Coss
0.00
0
0
6
12
18
24
30
0
10
ID - Drain Current (A)
Gate Charge
40
50
60
On-Resistance vs. Junction Temperature
2.4
VDS = 50 V
ID = 6.9 A
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
30
VDS - Drain-to-Source Voltage (V)
10
8
6
4
2
VGS = 10 V
ID = 6.9 A
2.0
1.6
1.2
0.8
0
0
5
10
15
20
0.4
- 50
25
- 25
0
Qg - Total Gate Charge (nC)
25
50
75
100
125
150
175
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.06
r DS(on) - On-Resistance ( W )
30
I S - Source Current (A)
20
TJ = 175_C
10
TJ = 25_C
0.05
ID = 6.9 A
0.04
0.03
0.02
0.01
1
0.0
0.00
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Document Number: 71189
S-03951—Rev. C, 26-May-03
1.2
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
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Si4484EY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.5
50
40
ID = 250 mA
Power (W)
V GS(th) Variance (V)
0.0
- 0.5
30
20
- 1.0
10
- 1.5
- 50
- 25
0
25
50
75
100
125
150
175
0
0.01
0.1
1
TJ - Temperature (_C)
10
100
600
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 70_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
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4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
Document Number: 71189
S-03951—Rev. C, 26-May-03