VISHAY SI7456DP-T1

Si7456DP
Vishay Siliconix
N-Channel 100-V (D-S) MOSFET
FEATURES
D TrenchFETr Power MOSFETS
D New Low Thermal Resistance PowerPAKr
Package with Low 1.07-mm Profile
D PWM Optimized for Fast Switching
D 100% Rg Tested
PRODUCT SUMMARY
VDS (V)
100
rDS(on) (W)
ID (A)
0.025 @ VGS = 10 V
9.3
0.028 @ VGS = 6.0 V
8.8
APPLICATIONS
D Primary Side Switch for High Density DC/DC
D Telecom/Server 48-V, Full-/Half-Bridge DC/DC
D Industrial and 42-V Automotive
PowerPAK SO-8
D
S
6.15 mm
1
2
5.15 mm
S
3
S
4
G
G
D
8
7
D
6
D
5
S
D
N-Channel MOSFET
Bottom View
Ordering Information: Si7456DP-T1
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
100
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 85_C
Pulsed Drain Current
Avalanche Current
Single Avalanche Energy (Duty Cycle v1%)
L = 0.1
0 1 mH
Continuous Source Current (Diode Conduction)a
TA = 85_C
Operating Junction and Storage Temperature Range
5.7
6.7
4.1
40
IAS
30
EAS
PD
V
9.3
IDM
IS
TA = 25_C
Maximum Power Dissipationa
ID
45
A
mJ
4.3
1.6
5.2
1.9
2.7
1.0
TJ, Tstg
Unit
- 55 to 150
A
W
_C
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Case
Symbol
t v 10 sec
Steady State
Steady State
RthJA
RthJC
Typical
Maximum
19
24
52
65
1.5
1.8
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71603
S-31989—Rev. D, 13-Oct-03
www.vishay.com
1
Si7456DP
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
VGS(th)
VDS = VGS, ID = 250 mA
2
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 100 V, VGS = 0 V
1
VDS = 100 V, VGS = 0 V, TJ = 85_C
20
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
nA
mA
40
VDS w 5 V, VGS = 10 V
rDS(on)
V
A
VGS = 10 V, ID = 9.3 A
0.021
0.025
VGS = 6.0 V, ID = 8.8 A
0.023
0.028
gfs
VDS = 15 V, ID = 9.3 A
35
VSD
IS = 4.3 A, VGS = 0 V
0.8
1.2
36
44
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
VDS = 50 V, VGS = 10 V, ID = 9.3 A
10
nC
8.6
0.5
1.27
2.1
td(on)
20
40
tr
10
20
46
90
26
50
50
80
VDD = 50 V, RL = 50 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = 4.3 A, di/dt = 100 A/ms
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
40
40
VGS = 10 thru 6 V
5V
32
I D - Drain Current (A)
I D - Drain Current (A)
32
24
16
8
24
16
TC = 125_C
8
25_C
- 55_C
4V
0
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
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2
5
0
1
2
3
4
5
6
VGS - Gate-to-Source Voltage (V)
Document Number: 71603
S-31989—Rev. D, 13-Oct-03
Si7456DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
3500
3000
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
0.04
0.03
VGS = 6.0 V
0.02
VGS = 10 V
Ciss
2500
2000
1500
1000
0.01
Crss
500
0.00
Coss
0
0
8
16
24
32
40
0
10
ID - Drain Current (A)
30
40
50
60
VDS - Drain-to-Source Voltage (V)
Gate Charge
On-Resistance vs. Junction Temperature
10
2.6
VDS = 50 V
ID = 9.3 A
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
20
8
6
4
VGS = 10 V
ID = 9.3 A
2.3
2.0
1.7
1.4
1.1
2
0.8
0
0
6
12
18
24
30
0.5
- 50
36
- 25
0
Qg - Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
r DS(on) - On-Resistance ( W )
I S - Source Current (A)
50
0.08
40
TJ = 150_C
10
TJ = 25_C
1
0.0
25
TJ - Junction Temperature (_C)
0.06
ID = 9.3 A
0.04
0.02
0.00
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Document Number: 71603
S-31989—Rev. D, 13-Oct-03
1.2
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
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Si7456DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.5
50
40
ID = 250 mA
Power (W)
V GS(th) Variance (V)
0.0
- 0.5
- 1.0
30
20
10
- 1.5
- 50
- 25
0
25
50
75
100
125
150
0
0.01
0.1
1
TJ - Temperature (_C)
10
100
600
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 52_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
0.0001
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0.001
0.01
Square Wave Pulse Duration (sec)
0.1
1
Document Number: 71603
S-31989—Rev. D, 13-Oct-03