VISHAY SI4942DY

Si4942DY
Vishay Siliconix
Dual N-Channel 40-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
40
D TrenchFETr Power MOSFET
rDS(on) (W)
ID (A)
0.021 @ VGS = 10 V
7.4
0.028 @ VGS = 4.5 V
6.4
APPLICATIONS
D Low Power Synchronous Rectifier
D Automotive 12-V Systems
D1
D2
SO-8
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
G1
G2
Top View
Ordering Information: Si4942DY
Si4942DY-T1 (with Tape and Reel)
S1
S2
N-Channel MOSFET
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
40
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current
Avalanche Current
L = 0.1 mH
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
5.3
5.8
4.3
IDM
30
IAS
25
IS
TA = 25_C
V
7.4
ID
PD
A
1.8
0.9
2.1
1.1
1.3
0.7
TJ, Tstg
Unit
W
_C
- 55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
50
60
90
110
28
34
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71887
S-03950—Rev. B, 16-May-03
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Si4942DY
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = 250 mA
1.0
IGSS
Typ
Max
Unit
3
V
VDS = 0 V, VGS = "20 V
"100
nA
VDS = 32 V, VGS = 0 V
1
VDS = 32 V, VGS = 0 V, TJ = 55_C
5
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
VDS w 5 V, VGS = 10 V
rDS(on)
Forward Transconductancea
Diode Forward Voltagea
30
mA
A
VGS = 10 V, ID = 7.4 A
0.017
0.021
VGS = 4.5 V, ID = 6.4 A
0.023
0.028
gfs
VDS = 15 V, ID = 7.4 A
25
VSD
IS = 1.8 A, VGS = 0 V
0.75
1.1
21
32
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
RG
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
VDS = 20 V, VGS = 10 V, ID = 5.7 A
3.3
nC
5.8
0.5
1.1
1.6
td(on)
13
20
tr
10
15
31
50
11
20
30
60
VDD = 20 V, RL = 20 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = 1.8 A, di/dt = 100 A/ms
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
30
30
VGS = 10 thru 5 V
25
4V
I D - Drain Current (A)
I D - Drain Current (A)
25
20
15
10
5
20
15
10
TC = 125_C
5
25_C
3V
- 55_C
0
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
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2
5
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
Document Number: 71887
S-03950—Rev. B, 16-May-03
Si4942DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
1600
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
0.040
0.030
VGS = 4.5 V
0.020
VGS = 10 V
1280
Ciss
960
640
0.010
Coss
320
0.000
Crss
0
0
5
10
15
20
25
30
0
8
ID - Drain Current (A)
Gate Charge
32
40
On-Resistance vs. Junction Temperature
1.8
VDS = 20 V
ID = 5.7 A
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
24
VDS - Drain-to-Source Voltage (V)
10
8
6
4
2
1.6
VGS = 10 V
ID = 7.4 A
1.4
1.2
1.0
0.8
0
0
5
10
15
20
0.6
- 50
25
- 25
0
Qg - Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.10
r DS(on) - On-Resistance ( W )
10
TJ = 150_C
1
TJ = 25_C
0.1
0.0
25
TJ - Junction Temperature (_C)
30
I S - Source Current (A)
16
0.08
0.06
ID = 7.4 A
0.04
0.02
0.00
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Document Number: 71887
S-03950—Rev. B, 16-May-03
1.2
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
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Si4942DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.6
50
0.4
40
ID = 250 mA
- 0.0
Power (W)
V GS(th) Variance (V)
0.2
- 0.2
30
20
- 0.4
- 0.6
10
- 0.8
- 1.0
- 50
- 25
0
25
50
75
100
125
0
0.001
150
0.01
1
0.1
TJ - Temperature (_C)
10
100
600
Time (sec)
Safe Operating Area
100
Limited
by rDS(on)
1 mS
I D - Drain Current (A)
10
10 mS
1
100 mS
0.1
TA = 25_C
Single Pulse
1S
10 S
dc
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 90_C/W
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
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4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 71887
S-03950—Rev. B, 16-May-03
Si4942DY
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
Document Number: 71887
S-03950—Rev. B, 16-May-03
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
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