IRF ST203C

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DISCRETE POWER DIODES and THYRISTORS
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Bulletin
I25176/A
ST203C..C SERIES
INVERTER GRADE THYRISTORS
Hockey Puk Version
Features
Metal case with ceramic insulator
International standard case TO-200AB (A-PUK)
All diffused design
370A
Center amplifying gate
Guaranteed high dV/dt
Guaranteed high dI/dt
High surge current capability
Low thermal impedance
High speed performance
Typical Applications
Inverters
Choppers
case style TO-200AB (A-PUK)
Induction heating
All types of force-commutated converters
Major Ratings and Characteristics
Parameters
ST203C..C
Units
370
A
55
°C
700
A
25
°C
@ 50Hz
5260
A
@ 60Hz
5510
A
@ 50Hz
138
KA2s
@ 60Hz
126
KA2s
1000 to 1200
V
20 to 30
µs
- 40 to 125
°C
IT(AV)
@ Ths
IT(RMS)
@ Ths
ITSM
I 2t
V DRM /V RRM
tq range
TJ
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ELECTRICAL SPECIFICATIONS
Voltage Ratings
Voltage
V DRM /V RRM , maximum
VRSM , maximum
I DRM /I RRM max.
Code
repetitive peak voltage
non-repetitive peak voltage
@ TJ = TJ max.
V
V
mA
10
1000
1100
12
1200
1300
Type number
ST203C..C
40
Current Carrying Capability
ITM
Frequency
ITM
ITM
180oel
180oel
Units
100µs
50Hz
400Hz
860
840
750
706
1340
1400
1160
1220
5620
2940
5020
2590
1000Hz
700
580
1350
1170
1750
1520
2500Hz
430
340
980
830
910
780
Recovery voltage Vr
Voltage before turn-on Vd
50
50
50
50
50
Rise of on-state current di/dt
50
50
-
-
-
-
A/µs
Heatsink temperature
40
55
40
55
40
55
°C
Equivalent values for RC circuit
47Ω / 0.22µF
V DRM
V DRM
50
V DRM
47Ω / 0.22µF
A
V
47Ω / 0.22µF
On-state Conduction
Parameter
I T(AV)
Max. average on-state current
@ Heatsink temperature
ST203C..C
Units Conditions
370 (140)
A
180° conduction, half sine wave
55 (85)
°C
double side (single side) cooled
I T(RMS) Max. RMS on-state current
700
DC @ 25°C heatsink temperature double side cooled
I TSM
Max. peak, one half cycle,
5260
t = 10ms
No voltage
non-repetitive surge current
5510
t = 8.3ms
reapplied
4420
t = 10ms
100% VRRM
4630
t = 8.3ms
reapplied
Sinusoidal half wave,
138
t = 10ms
No voltage
Initial TJ = TJ max
t = 8.3ms
reapplied
t = 10ms
100% VRRM
t = 8.3ms
reapplied
I2t
Maximum I2t for fusing
A
126
98
KA2s
89
I 2 √t
Maximum I2√t for fusing
1380
KA2√s
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t = 0.1 to 10ms, no voltage reapplied
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Fig. 3 - Current Ratings Characteristics
Fig. 4 - Current Ratings Characteristics
Fig. 5 - On-state Power Loss Characteristics
Fig. 6 - On-state Power Loss Characteristics
Fig. 7 - Maximum Non-repetitive Surge Current
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Fig. 8 - Maximum Non-repetitive Surge Current
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Fig. 9 - On-state Voltage Drop Characteristics
Fig. 11 - Reverse Recovered Charge Characteristics
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ST203C..C
Fig. 10 - Thermal Impedance ZthJ-hs Characteristics
Fig. 12 - Reverse Recovery Current Characteristics
Fig. 13 - Frequency Characteristics
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Fig. 14 - Frequency Characteristics
Fig. 15 - Frequency Characteristics
Fig. 16 - Maximum On-state Energy Power Loss Characteristics
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Fig. 17 - Gate Characteristics
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ST203C..C
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Data SheetSeries
On-state Conduction
Parameter
V TM
Max. peak on-state voltage
V T(TO)1 Low level value of threshold
voltage
V T(TO)2 High level value of threshold
voltage
rt1
ST203C..C Units
1.72
1.17
ITM= 600A, TJ = TJ max, tp = 10ms sine wave pulse
V
Low level value of forward
0.92
rt2
High level value of forward
slope resistance
0.83
IH
Maximum holding current
600
IL
Typical latching current
1000
(16.7% x π x IT(AV) < I < π x IT(AV)), TJ = TJ max.
(I > π x IT(AV)), TJ = TJ max.
1.22
slope resistance
Conditions
mΩ
(16.7% x π x IT(AV) < I < π x IT(AV)), TJ = TJ max.
(I > π x IT(AV)), TJ = TJ max.
mA
T J = 25°C, I T > 30A
T J = 25°C, V A= 12V, Ra = 6Ω, I G= 1A
Switching
Parameter
di/dt
Max. non-repetitive rate of rise
of turned-on current
td
tq
ST203C..C Units
1000
Typical delay time
Max. turn-off time
A/µs
0.8
Min
20
Max
30
µs
Conditions
TJ = TJ max., VDRM = rated VDRM
ITM = 2 x di/dt
TJ= 25°C, VDM = rated VDRM, ITM = 50A DC, tp= 1µs
Resistive load, Gate pulse: 10V, 5Ω source
TJ = TJ max, ITM = 300A, commutating di/dt = 20A/µs
VR = 50V, tp = 500µs, dv/dt: see table in device code
Blocking
Parameter
ST203C..C Units
dv/dt
Maximum critical rate of rise of
off-state voltage
500
V/µs
IRRM
IDRM
Max. peak reverse and off-state
leakage current
40
mA
Conditions
TJ = TJ max. linear to 80% VDRM, higher value
available on request
TJ = TJ max, rated V DRM/V RRM applied
Triggering
Parameter
PGM
Maximum peak gate power
ST203C..C Units
60
PG(AV) Maximum average gate power
10
IGM
Max. peak positive gate current
10
+VGM
Maximum peak positive
gate voltage
20
-VGM
Maximum peak negative
gate voltage
IGT
Max. DC gate current required
to trigger
VGT
Max. DC gate voltage required
to trigger
Conditions
W
TJ = TJ max, f = 50Hz, d% = 50
A
TJ = TJ max, tp ≤ 5ms
V
TJ = TJ max, tp ≤ 5ms
5
200
mA
TJ = 25°C, VA = 12V, Ra = 6Ω
3
V
IGD
Max. DC gate current not to trigger
20
mA
VGD
Max. DC gate voltage not to trigger
0.25
V
TJ = TJ max., rated VDRM applied
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ST203C..C Series
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Thermal and Mechanical Specification
Parameter
ST203C..C
TJ
Max. operating temperature range
-40 to 125
Tstg
Max. storage temperature range
-40 to 150
RthJ-hs Max. thermal resistance,
DC operation single side cooled
K/W
0.08
RthC-hs Max. thermal resistance,
wt
°C
0.17
junction to heatsink
F
Units Conditions
0.033
K/W
case to heatsink
0.017
Mounting force, ± 10%
4900
N
(500)
(Kg)
50
g
Approximate weight
Case style
TO - 200AB (A-PUK)
DC operation double side cooled
DC operation single side cooled
DC operation double side cooled
See Outline Table
∆RthJ-hs Conduction
(The following table shows the increment of thermal resistence RthJ-hs when devices operate at different conduction angles than DC)
Conduction angle
Sinusoidal conduction Rectangular conduction
Single Side Double Side
Units
Conditions
K/W
TJ = TJ max.
Single Side Double Side
180°
0.015
0.017
0.011
0.011
120°
0.018
0.019
0.019
0.019
90°
0.024
0.024
0.026
0.026
60°
0.035
0.035
0.036
0.037
30°
0.060
0.060
0.060
0.061
Ordering Information Table
Device Code
ST
20
3
C
12
C
H
H
1
1
2
3
4
5
6
7
8
9
10
1 - Thyristor
2 - Essential part number
3 - 3 = Fast turn off
4 - C = Ceramic Puk
5 - Voltage code: Code x 100 = VRRM (See Voltage Rating Table)
6 - C = Puk Case TO-200AB (A-PUK)
7 - Reapplied dv/dt code (for tq test condition)
8 - tq code
9 - 0 = Eyelet term. (Gate and Aux. Cathode Unsoldered Leads)
1 = Fast-on term. (Gate and Aux. Cathode Unsoldered Leads)
2 = Eyelet term. (Gate and Aux. Cathode Soldered Leads)
dv/dt - tq combinations available
dv/dt (V/µs) 20
20
CK
tq (µs) 25
CJ
30
CH
50
DK
DJ
DH
100
EK
EJ
EH
*Standard part number.
All other types available only on request.
3 = Fast-on term. (Gate and Aux. Cathode Soldered Leads)
10 - Critical dv/dt:
None = 500V/µsec (Standard value)
L
= 1000V/µsec (Special selection)
200
-FJ *
FH
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400
--HH
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Data SheetSeries
Outline Table
ANODE TO GATE
CREEPAGE DISTANCE: 7.62 (0.30) MIN.
STRIKE DISTANCE: 7.12 (0.28) MIN.
19 (0.75)
0.3 (0.01) MIN.
DIA. MAX.
13.7 / 14.4
(0.54 / 0.57)
0.3 (0.01) MIN.
19 (0.75)
GATE TERM. FOR
1.47 (0.06) DIA.
PIN RECEPTACLE
DIA. MAX.
38 (1.50) DIA MAX.
Case Style TO-200AB (A-PUK)
All dimensions in millimeters (inches)
2 HOLES 3.56 (0.14) x
1.83 (0.07) MIN. DEEP
6.5 (0.26)
4.75 (0.19)
25°± 5°
42 (1.65) MAX.
28 (1.10)
Fig. 1 - Current Ratings Characteristics
Fig. 2 - Current Ratings Characteristics
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