TLP2601 TOSHIBA Photocoupler GaAℓAs Ired & Photo−IC TLP2601 Isolated Line Receiver Simplex / Multiplex Data Transmission Computer−Peripheral Interface Microprocessor System Interface Digital Isolation For A/D, D/A Conversion Direct Replacement For HCPL−2601 Unit in mm The TOSHIBA TLP2601 a photocoupler which combines a GaAℓAs IRed as the emitter and an integrated high gain, high speed photodetector. The output of the detector circuit is an open collector, Schottky clamped transistor. A Faraday shield integrated on the photodetector chip reduces the effects of capacitive coupling between the input LED emitter and the high gain stages of the detector. This provides an effective common mode transient immunity of 1000V/μs. • Input current thresholds: IF = 5mA max. • Isolation voltage: 2500Vrms min. • Switching speed: 10MBd • Common mode transient immunity: 1000V/μs min. • Guaranteed performance over temp.: 0°C~70°C • UL Recognized: UL1577, file No. E67349 TOSHIBA Weight: 0.54g Pin Configuration (top view) Truth Table (positive logic) Input Enable Output H H L L H H H L H L L H 11−10C4 1 8 2 7 3 6 5 4 SHIELD Schematic IF 2 A 0.01 to 0.1μF bypass capacitor must be connected between pins 8 and 5 (see Note 1). VF ICC IO + 8 6 3 VCC VO SHIELD 5 IE GND 7 VE 1 2007-10-01 TLP2601 Recommended Operating Conditions Characteristic Symbol Min. Typ. Max. Unit Input current, low level IFL 0 ⎯ 250 μA Input current, high level IFH 6.3 (*) ⎯ 20 mA Supply voltage**, output VCC 4.5 ⎯ 5.5 V High level enable voltage VEH 2.0 ⎯ VCC V Low level enable voltage VEL 0 ⎯ 0.8 V N ⎯ ⎯ 8 ⎯ Topr 0 ⎯ 70 °C Fan out (TTL load) Operating temperature Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. (*) 6.3mA is a guard banded value which allows for at least 20% CTR degradation. Initial input current threshold value is 5.0mA or less. **This item denotes operating ranges, not meaning of recommended operating conditions. Absolute Maximum Ratings (no derating required) Symbol Rating Unit Forward current IF 20 mA Reverse voltage VR 5 V Output current IO 25 mA Output voltage VO −0.5~7 V VCC 7 V VE 5.5 V Po 40 mW Operating temperature range Topr −40~85 °C Storage temperature range Tstg −55~125 °C Detector LED Characteristic Supply voltage (1 minute maximum) Enable input voltage (not to exceed VCC by more than 500mV) Output collector power dissipation Lead solder temperature (10s) (**) Isolation voltage (R.H.≤ 60%,AC 1min., (Note 10) Tsol BVS 260 °C 2500 Vrms 3540 Vdc Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (**) 1.6mm below seating plane. 2 2007-10-01 TLP2601 Electrical Characteristics (Ta = 0°C ~70°C unless otherwise noted) Characteristic Symbol Test Condition VCC = 5.5V, VO = 5.5V Min. Typ. Max. Unit ⎯ 1 250 μA ⎯ 0.4 0.6 V ⎯ 7 15 mA ⎯ 12 19 mA High level output current IOH Low level output voltage VOL High level supply current ICCH Low level supply current ICCL Low level enable current IEL VCC = 5.5V, VE = 0.5V ⎯ −1.6 −2.0 mA High level enable current IEH VCC = 5.5V, VE = 2.0V ⎯ −1 ⎯ mA High level enable voltage VEH 2.0 ⎯ ⎯ Low level enable voltage VEL ⎯ ⎯ 0.8 Input forward voltage VF IF = 10mA, Ta = 25℃ ⎯ 1.65 1.75 V BVR IR = 10μA, Ta = 25℃ 5 ⎯ ⎯ V CIN VF = 0, f = 1MHz ⎯ 45 ⎯ pF IF = 10mA ⎯ −2.0 ⎯ mV / °C II−O Relative humidity = 45% Ta=25℃, t = 5 second (Note 10) VI−O = 3000Vdc, ⎯ ⎯ 1 μA Resistance (input−output) RI−O VI−O = 500V, R.H.≤ 60% (Note 10) 5×10 ⎯ Ω Capacitance (input−output) CI−O f = 1MHz, ⎯ pF IF = 250μA, VE = 2.0V VCC = 5.5V, IF = 5mA VE = 2.0V, IOL(sinking) = 13mA VCC = 5.5V, IF = 0, VE = 0.5V VCC = 5.5V, IF = 10mA VE = 0.5V (Note 11) V Input reverse breakdown voltage Input capacitance Input diode temperature coefficient Input−output insulation leakage current ΔVF/ΔTA ⎯ (Note 10) ⎯ 10 10 14 0.6 (**)All typ.values are at VCC = 5V, Ta = 25°C. 3 2007-10-01 TLP2601 Switching Characteristics (Ta = 25℃, VCC = 5 V) Characteristic Propagation delay time to high output level Propagation delay time to low output level Symbol tpHL tr Output fall time(90−10%) tf enable from VEH to VEL Propagation delay time of enable from VEL to VEH Test Condition tpLH Output rise time(10−90%) Propagation delay time of Test Circuit RL = 350Ω, CL = 15pF IF = 7.5mA 1 (Note 2), (Note 3), (Note 4)&(Note 5) RL = 350Ω, CL = 15pF tELH IF = 7.5mA 2 Min. Typ. Max. Unit ― 60 75 ns ― 60 75 ns ― 30 ― ns ― 30 ― ns ― 25 ― ns ― 25 ― ns 1000 10000 ― V/μs −1000 −10000 ― V/μs VEH = 3.0V VEL = 0.5V tEHL (Note 6)&(Note 7) VCM = 400V Common mode transient immunity at high output RL = 350Ω CMH VO(min.) = 2V level IF = 0mA, 3 (Note 9) VCM = 400V Common mode transient immunity at low output RL = 350Ω CML VO(max.) = 0.8V level IF = 7.5mA, 4 (Note 8) 2007-10-01 TLP2601 Test Circuit 1. 5V Pulse generator ZO = 50Ω tr = 5ns IF = 7.5mA Input IF IF = 3.75mA tpHL IF Monitoring node 1.5V VOL 8 VCC 2 7 3 6 4 47Ω VOH tpLH Output VO 1 5 GND 0.1μF Bypass tpHL and tpLH RL VO (*) CL Output monitoring node (*) CL is approximately 15pF which includes probe and stray wiring capacitance. Test Circuit 2. Pulse generator ZO = 50 Ω tr = 5ns 3.0V Input VE 7.5mA dc IF 1.5V tEHL VOH tELH Output VO 1.5V Input VE monitoring node 5V 1 VCC 8 2 7 3 6 4 5 GND 0.1μF Bypass tELH and tEHL (*) CL VOL RL VO Output monitoring node (*) CL is approximately 15pF which includes probe and stray wiring capacitance. Test Circuit 3. Transient Immunity and Typ. Waveforms. 90% VCM 10% 10% 90% tr tf IF 0V A B 5V VO VFF Switch at A : IF = 0mA VO VCC 8 2 7 3 6 4 Pulse gen. ZO = 50 Ω GND 5V 0.1μF Bypass 1 400V RL VO 5 VCM VOL Switch at B : IF = 5mA 5 2007-10-01 TLP2601 ΔVF / ΔTa – IF IF – V F -2.6 Forward voltage temperature coefficient ΔVF /ΔTa (mV/°C) Ta = 25°C 10 forward current IF (mA) 100 1 0.1 1.2 1.4 -2.0 -1.8 -1.6 100 VCC = 5V IF = 250μA (V) Ta = 25°C High level output current IOH (μA) 6 RL=350Ω 1kΩ 4kΩ 2 2 30 (mA) IOH – Ta VO – IF 1 10 3 Forward current IF (V) 8 4 1 0.3 1.8 1.6 Forward voltage VF Output voltage VO -2.2 -1.4 0.1 0.01 1.0 0 0 -2.4 3 4 Forward current IF 5 50 VCC = 5.5V 30 VO = 5.5V 10 5 3 6 1 (mA) 0 10 20 30 40 50 60 70 Ambient temperature Ta (°C) VOL – Ta VO – IF 8 IF = 5mA RL=350Ω 6 RL=4kΩ Ta = 70°C 4 0°C 2 0 0 1 2 3 Forward current IF 4 5 VCC = 5.5V 0.5 Low level output voltage VOL (V) Output voltage VO (V) VCC = 5V VE = 2V IOL=16mA 0.4 12.8mA 9.6mA 6.4mA 0.3 6 0.2 (mA) 0 20 40 60 80 Ambient temperature Ta (°C) 6 2007-10-01 TLP2601 tpHL, tpLH – IF tpHL, tpLH – Ta 120 120 tpLH RL= 4kΩ RL=4kΩ tpLH 100 tpLH 80 1kΩ 350Ω tpLH tpHL 60 Propagation delay time tpHL, tpLH (ns) Propagation delay time tpHL, tpLH (ns) 100 350Ω 1kΩ 4kΩ 40 tpLH 80 350Ω 60 1kΩ tpHL 4kΩ 40 Ta = 25°C 20 9 7 11 13 15 Forward current IF 17 VCC = 5 V 20 VCC = 5V 0 5 350Ω 1kΩ IF = 7.5mA 19 0 0 (mA) 10 20 30 40 50 60 70 60 70 Ambient temperature Ta (°C) tEHL, tELH – Ta tr, tf – Ta 320 80 VCC = 5V IF = 7.5mA VCC = 5V 70 RL= 4kΩ tf 280 1kΩ tf 60 350Ω tf 40 350Ω tr 20 0 0 VEH = 3V RL= 4kΩ tELH IF = 7.5mA 60 80 Enable propagation delay time tEHL, tELH (ns) Rise, fall time tr, tf (ns) 300 1kΩ 4kΩ 10 20 30 40 50 60 50 40 1kΩ tELH 30 350Ω tELH 350Ω 20 70 tEHL 1kΩ 4kΩ 10 Ambient temperature Ta (°C) 0 0 10 20 30 40 50 Ambient temperature Ta (°C) 7 2007-10-01 TLP2601 Notes 1. The VCC supply voltage to each TLP2601 isolator must be bypassed by a 0.1μF capacitor of larger.This can be either a ceramic or solid tantalum capacitor with good high frequency characteristic and should be connected as close as possible to the package VCC and GND pins of each device. 2. tpHL ・ Propagation delay is measured from the 3.75mA level on the low to high transition of the input current pulse to the 1.5V level on the high to low transition of the output voltage pulse. 3. tpLH ・ Propagation delay is measured from the 3.75mA level on the high to low transition of the input current pulse to the 1.5V level on the low to high transition of the output voltage pulse. 4. tf ・ Fall time is measured from the 10% to the 90% levels of the high to low transition on the output pulse. 5. tr ・ Rise time is measured from the 90% to 10% levels of the low to high transition on the output pulse. 6. tEHL ・ Enable input propagation delay is measured from the 1.5V level on the low to high transition of the input voltage pulse to the 1.5V level on the high to low transition of the output voltage pulse. 7. tELH ・ Enable input propagation delay is measured from the 1.5V level on the high to low transition of the input voltage pulse to the 1.5V level on the low to high transition of the output voltage pulse. 8. CML ・ The maximum tolerable rate of fall of the common mode voltage to ensure the output will remain in the low output state (i.e., VOUT < 0.8V). Measured in volts per microsecond (V / μs). 9. CMH ・ The maximum tolerable rate of fall of the common mode voltage to ensure the output will remain in the high state (i.e., VOUT > 2.0V). Measured in volts per microsecond(V / μs). Volts/microsecond can be translated to sinusoidal voltages: V / μs = (dv CM ) = fCM VCM (p.p.) dt Max. Example: VCM = 318Vpp when fCM = 1MHz using CML and CMH = 1000V / μs data sheet specified minimum. 10. ・ Device considered a two−terminal device: Pins 1, 2, 3 and 4 shorted together, and Pins 5, 6, 7 and 8 shorted together. 11. Enable input ・ No pull up resistor required as the device has an internal pull up resistor. 8 2007-10-01 TLP2601 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 9 2007-10-01