TOSHIBA 2SK2613_10

2SK2613
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π-MOSIII)
2SK2613
Switching Regulator Applications, DC-DC Converter and
Motor Drive Applications
•
Unit: mm
Low drain-source ON-resistance: RDS (ON) = 1.4 Ω (typ.)
•
High forward transfer admittance: ⎪Yfs⎪ = 6.0 S (typ.)
•
Low leakage current: IDSS = 100 μA (max) (VDS = 800 V)
•
Enhancement-model: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Drain-source voltage
VDSS
1000
V
Drain-gate voltage (RGS = 20 kΩ)
VDGR
1000
V
Gate-source voltage
VGSS
±30
V
A
1. GATE
2. DRAIN (HEAT SINK)
3. SOURSE
150
W
JEDEC
―
EAS
910
mJ
JEITA
―
Avalanche current
IAR
8
A
Repetitive avalanche energy (Note 3)
EAR
15
mJ
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55 to 150
°C
DC
(Note 1)
ID
8
Pulse
(Note 1)
IDP
24
Drain power dissipation (Tc = 25°C)
PD
Single pulse avalanche energy
(Note 2)
Drain current
TOSHIBA
2−16C1B
Weight: 4.6 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and
Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
2
Thermal Characteristics
Characteristics
Symbol
Max
Unit
Thermal resistance, channel to case
Rth (ch-c)
0.833
°C/W
Thermal resistance, channel to ambient
Rth (ch-a)
50
°C/W
1
Note 1: Please use devices on condition that the channel temperature is below 150°C.
Note 2: VDD = 90 V, Tch = 25°C, L = 26.3 mH, RG = 25 Ω, IAR = 8 A
Note 3: Repetitive rating: Pulse width limited by max junction temperature
3
This transistor is an electrostatic sensitive device. Please handle with caution.
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2SK2613
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Typ.
Max
Unit
VGS = ±30 V, VDS = 0 V
⎯
⎯
±10
μA
V (BR) GSS
IG = ±10 μA, VDS = 0 V
±30
⎯
⎯
V
IDSS
VDS = 800 V, VGS = 0 V
⎯
⎯
100
μA
Drain cut-OFF current
Drain-source breakdown voltage
Min
IGSS
Gate leakage current
Gate-source breakdown voltage
Test Condition
V (BR) DSS
ID = 10 mA, VGS = 0 V
1000
⎯
⎯
V
Vth
VDS = 10 V, ID = 1 mA
2.0
⎯
4.0
V
Gate threshold voltage
Drain-source ON resistance
RDS (ON)
VGS = 10 V, ID = 4 A
⎯
1.4
1.7
Ω
Forward transfer admittance
⎪Yfs⎪
VDS = 20 V, ID = 4 A
2.0
6.0
⎯
S
Input capacitance
Ciss
⎯
2000
⎯
Reverse transfer capacitance
Crss
⎯
30
⎯
Output capacitance
Coss
⎯
200
⎯
⎯
20
⎯
⎯
40
⎯
⎯
30
⎯
⎯
100
⎯
⎯
65
⎯
⎯
40
⎯
⎯
25
⎯
Rise time
VDS = 25 V, VGS = 0 V, f = 1 MHz
tr
0V
ton
4.7 Ω
Turn-ON time
Switching time
Fall time
tf
Turn-OFF time
ID = 4 A
10 V
VGS
Total gate charge
(gate-source plus gate-drain)
Qg
Gate-source charge
Qgs
Gate-drain (“miller”) charge
Qgd
VOUT
RL = 100 Ω
Duty ≤ 1%, tw = 10 μs
toff
pF
ns
VDD ≈ 400 V
VDD ≈ 400 V, VGS = 10 V, ID = 8 A
nC
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Continuous drain reverse current (Note 1)
IDR
⎯
⎯
⎯
8
A
Pulse drain reverse current
IDRP
⎯
⎯
⎯
24
A
(Note 1)
Forward voltage (diode)
VDSF
IDR = 8 A, VGS = 0 V
⎯
⎯
−1.9
V
Reverse recovery time
trr
IDR = 8 A, VGS = 0 V,
⎯
1600
⎯
ns
Reverse recovery charge
Qrr
dIDR/dt = 100 A/μs
⎯
24
⎯
μC
Marking
TOSHIBA
K2613
Part No. (or abbreviation code)
Lot No.
Note 4
Note 4: A line under a Lot No. identifies the indication of product
Labels.
Not underlined: [[Pb]]/INCLUDES > MCV
Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Please contact your TOSHIBA sales representative for details as to
environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament
and of the Council of 27 January 2003 on the restriction of the use of
certain hazardous substances in electrical and electronic equipment.
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2SK2613
ID – VDS
ID – VDS
20
Common source
Tc = 25°C
Pulse test
15
10
5.75
8
Drain current ID (A)
6.0
16
Drain current ID (A)
10
5.5
6
5.25
4
5.0
2
Common source
Tc = 25°C
Pulse test
15
10
6.5
6.25
12
6.0
5.75
8
5.5
5.25
4
VGS = 4.75 V
VGS = 5.0 V
0
0
4
8
12
Drain-source voltage
16
0
20
0
VDS (V)
20
100
VDS – VGS
VDS (V)
Common source
VSD = 20 V
Pulse test
Drain-source voltage
12
8
80
VDS (V)
20
16
Drain current ID (A)
60
Drain-source voltage
ID – VGS
20
40
25
4
100
Common source
Tc = 25°C
Pulse test
16
ID = 8 A
12
8
4
4
2
Tc = −55°C
0
0
2
4
6
Gate-source voltage
8
0
10
0
VGS (V)
4
8
12
Gate-source voltage
16
20
VGS (V)
⎪Yfs⎪ − ID
100
RDS (ON) − ID
10
Drain-source on-resistance
RDS (ON) (Ω)
Forward transfer admittance ⎪Yfs⎪
(S)
Common source
VSD = 20 V
Pulse test
10
25
Tc = −55°C
100
1
0.1
0.1
1
10
5
3
Drain current ID (A)
VGS = 10,15
1
0.5
0.3
0.1
0.1
100
Common source
Tc = 25°C
Pulse test
0.3
1
3
10
30
Drain current ID (A)
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2SK2613
RDS (ON) − Tc
IDR − VDS
100
(A)
Common source
VGS = 10 V
Pulse test
4
Drain reverse current IDR
Drain-source on -esistance RDS (ON)
(Ω)
5
3
ID = 8 A
2
4
2
1
10
1
10
0.1
3
1
0
−80
−40
0
40
80
Case temperature
0.01
160
0
Tc (°C)
−0.4
−0.2
5
Vth (V)
Ciss
Gate threshold voltage
1000
Coss
100
Common source
VGS = 0 V
f = 1 MHz
Tc = 25°C
10
0.1
Crss
1
10
100
Drain-source voltage
−1.0
−1.2
VDS (V)
Vth − Tc
Capacitance – VDS
(pF)
−0.8
−0.6
Drain-source voltage
10000
Capacitance C
VGS = 0, −1 V
1000
VDS (V)
Common source
VDS = 10 V
ID = 1 mA
Pulse test
4
3
2
1
0
−80
−40
0
40
80
120
160
Case temperature Tc (°C)
PD − Tc
Dynamic input/output characteristics
120
80
40
0
0
40
80
Case temperature
120
160
400
VDS
16
12
200
200
8
400
VGS
100
0
0
200
VDD = 100 V
300
20
4
20
40
60
80
VGS (V)
160
Common source
ID = 8 A
Tc = 25°C
Pulse test
Gate-source voltage
VDS (V)
500
Drain-source voltage
Drain power dissipation PD (W)
200
0
100
Total gate charge Qg (nC)
Tc (°C)
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2SK2613
rth − tw
Normalized transient thermal impedance
rth (t)/Rth (ch-c)
10
1
Duty = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
PDM
0.01
Single pulse
t
T
Duty = t/T
Rth (ch-c) = 0.833°C/W
0.001
10 μ
100 μ
1m
10 m
Pulse width
100 m
tw
1
(s)
Safe operating area
EAS – Tch
100
1000
100 μs *
10 ID max (continuous)
Drain current ID (A)
Avalanche energy EAS (mJ)
50
30 ID max (pulsed) *
1 ms *
5
3
DC Operation
Tc = 25°C
1
0.5
0.3
0.1
* Single nonrepetitive pulse
0.05
Tc = 25°C
0.03
Curves must be derated linearly
0.01
1
10
3
10
30
100
Drain-source voltage
300
600
400
200
0
25
VDSS max
with increase in temperature.
800
50
75
100
125
150
Channel temperature (initial) Tch (°C)
1000 3000 10000
VDS (V)
15 V
BVDSS
IAR
−15 V
VDS
VDD
Test circuit
RG = 25 Ω
VDD = 90 V, L = 26.3 mH
5
Waveform
Ε AS =
⎛
⎞
1
B VDSS
⎟
⋅ L ⋅ I2 ⋅ ⎜
⎜B
⎟
2
−
V
VDSS
DD
⎝
⎠
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2SK2613
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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