TOREX XCM410AA01ML

XCM410 Series
ETR2426_001
2 Channel Voltage Detector (Sense Pin separated from VDD)
■GENERAL DESCRIPTION
The XCM410 series is a multi combination module IC which comprises of two voltage detectors, XC6108 and XC6109
series. The two detectors inside are highly precise, low power consumption voltage detectors using laser trimming technology.
The sense pin (VSEN) for channel 1 (VOUT1) is separated from power supply (VIN) so that it allows this pin to monitor added power supply.
This feature enables output to maintain the state of detection even when voltage of the monitored power supply drops to 0V.
The output configuration is N-channel open-drain.
■APPLICATIONS
■FEATURES
●Microprocessor reset circuitry
High Accuracy
●Charge voltage monitors
Low Power Consumption
:±2%(Detect Voltage≧1.5V)
:±30mV(Detect Voltage<1.5V)
:1.7μA (TYP)
(VOUT1=1.5V, VOUT2=3.3V, VIN=4.0V)
●Memory battery back-up switch circuits
Detect Voltage Range
●Power failure detection circuits
:Channel1 (VOUT1)
0.8V∼5.0V (0.1V increments)
:Channel 2 (VOUT2)
1.1V∼5.0V (0.1V increments)
Operating Voltage Range
:1.0V∼6.0V
Detect Voltage Temperature Characteristics
:±100ppm/℃(TYP.)
Output Configuration
:N-channel open drain
Operating Temperature Range
:-40℃∼85℃
Built-In 2 Detect Voltage Circuit
Separated Sense Pin
:Channel 1(VOUT1)
Small Package
:SOT-25
■TYPICAL APPLICATION CIRCUIT
VIN
VOUT2
VSS
2
VSEN
VOUT1
1
Monitoring
別電源
Power
R=100kΩ
3
4
5
R=100kΩ
Supply
SOT-25
(TOP VIEW)
1/13
XCM410 Series
■PIN CONFIGURATION
VSEN
VIN
5
4
1
2
VOUT1
5:VSEN
4:VIN
XC6108
XC6109
3
VSS
VOUT2
1:VOUT1
2:VSS
3:VOUT2
SOT-25
(TOP VIEW)
■PIN ASSIGNMENT
PIN
XCM410
FUNCTION
XC6108
XC6109
1
2
3
4
5
VOUT1
VSS
VOUT2
VIN
VSEN
Output 1
Ground
Output 2
Input Voltage
Sense
VOUT
-
VSS
VSS
-
VOUT
VIN
VIN
VSEN
-
■PRODUCT CLASSIFICATION
●Ordering Information
XCM410①②③④⑤⑥
DESIGNATOR
DESCRIPTION
SYMBOL
DESCRIPTION
①②
Output Configuration
AA
③④
Detect Voltage
01∼
⑤
Package
M
:SOT-25
⑥
Device Orientation
R
L
:Embossed tape, standard feed
:Embossed tape, reverse feed
:VOUT1/VOUT2:N-ch open drain output
:Sequential numbers for two voltage detect combinations
VOUT1 Detect Voltage Range:0.8V ∼ 5.0V (0.1V increments)
VOUT2 Detect Voltage Range:1.1V ∼ 5.0V (0.1V increments)
DESIGNATOR ③④ Detect Voltage
01
VOUT1
VOUT2
1.5
3.3
*This series are semi-custom products.
2/13
For other combinations, output voltages and etc., please ask Torex sales contacts.
XCM410
Series
■BLOCK DIAGRAM
VIN
each block
VSEN
VOUT1
Vref
VOUT2
Vref
each block
V SS
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
Nch Open Drain
Output Voltage
Nch Open Drain
VIN
VOUT1
VOUT2
VSS-0.3∼7.0
VSS-0.3∼7.0
VSS-0.3∼7.0
V
Sense Pin Voltage
VSEN
VSS-0.3∼7.0
V
Output Current
IOUT1
IOUT2
10
10
mA
mA
Pd
250
mW
Ta
Tstg
-40∼+85
-55∼+125
Power Dissipation
SOT-25
Operating Temperature Range
Storage Temperature Range
V
o
o
C
C
3/13
XCM410 Series
■ELECTRICAL CHARACTERISTICS
●XCM410AA Series
PARAMETER
SYMBOL
Operating Voltage
(*1)
VIN
Detect Voltage 1
(*2)
VDF1
Detect Voltage 2
(*2)
VDF2
CONDITIONS
MIN.
TYP.
1
MAX.
UNITS
6
V
-
V
①
V
②
V
①
V
②
μA
③
μA
③
mA
④
mA
⑤
E-1
E-1
Hysteresis Width 1
VHYS1
VIN=1.0∼6.0V
Hysteresis Width 2
VHYS2
VDF2(T)=1.1∼5.0V
(*3)
VDF1
VDF1
VDF1
X0.02
X0.05
X0.08
VDF2
VDF2
VDF2
X0.02
X0.05
X0.08
CIRCUIT
VIN=VDF2×0.9
VSEN=VDF1×0.9
(*4)
Supply Current 1
ISS1
VDF2(T)=1.1V∼1.9V
1.4
3.3
VDF2(T)=2.0V∼3.9V
1.5
3.5
VDF2(T)=4.0V∼5.0V
1.6
3.6
VIN=VDF2×1.1
VSEN=VDF1×1.1
(*4)
Supply Current 2
ISS2
VDF2(T)=1.1V∼1.9V
1.8
3.6
VDF2(T)=2.0V∼3.9V
2.0
3.8
VDF2(T)=4.0V∼5.0V
3.1
4.0
VSEN=0V VDS=0.5V(N-ch)
Output Current 1
IOUT1
VIN=1.0V
0.1
0.7
VIN=2.0V
0.8
1.6
VIN=3.0V
1.2
2.0
VIN=4.0V
1.6
2.3
VIN=5.0V
1.8
2.4
VIN=6.0V
1.9
2.5
VDS=0.5V(N-ch)
Output Current 2
N-ch Driver
Leakage Current 1
N-ch Driver
Leakage Current 2
ILEAK1
ILEAK2
ΔVDF/
Temperature
(*1)
Characteristics
IOUT2
Sense Resistance
(*9)
Detect Delay 1
(*10)
Detect Delay 2
(*11)
VIN=1.0V
(*5)
0.1
0.7
VIN=2.0V
(*6)
0.8
1.6
VIN=3.0V
(*7)
1.2
2.0
VIN=4.0V
(*8)
1.6
2.3
VIN=6.0V, VSEN=6.0V,
VOUT=6.0V
VIN=6.0V
VOUT=6.0V
o
o
0.2
0.4
μA
④
0.2
0.4
μA
④
ppm/ C
o
①
-40 C≦Ta≦85 C
±100
RSEN
VSEN=5.0V VIN=0V
E-2
MΩ
⑥
tDF1
VIN=6.0V
30
230
μs
⑦
⑧
ΔTa・VDF
tDF2
VIN=6.0V→1.0V
30
230
μs
Release Delay 1
(*12)
tDR1
VIN=6.0V
30
200
μs
⑦
Release Delay 2
(*13)
tDR2
VIN=1.0V→6.0V
30
200
μs
⑧
NOTE:
*1: VOUT1・VOUT2: same characteristics.
*2: The detect voltage range for VDF1 (VOUT1): 0.8V∼5.0V. The detect voltage range for VDF2 (VOUT2): 1.1V∼5.0V.
*3: The detect voltage for VDF2(T) (VOUT2).
*4: Current flowing to the sense resistor is not included.
*5: VDF2(T)>1.0V
*6: VDF2(T)>2.0V
*7: VDF2(T)>3.0V
*8: VDF2(T)>4.0V
*9: Calculated from current value and voltage values at the both ends of the resistor.
*10: Time until VSEN=VDF1 reaches VOUT1=VINx0.1 when VSEN falls.
*11: Time until VIN=VDF2 reaches VOUT2=0.6V when VIN falls.
*12: Time until VSEN=VDF1+VHYS1 reaches VOUT1=VIN when VSEN rises.
*13: Time until VIN=VDF2+VHYS2 reaches VOUT2=5.4V when VIN rises.
4/13
XCM410
Series
■VOLTAGE CHART
E-1
PARAMETER
NOMINAL
DETECT VOLTAGE
VDF1(T),VDF2(T)
(V)
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
E-2
DETECT VOLTAGE
(V)
(*1)
SENSE RESISTANCE
(MΩ)
VDF1,VDF2
MIN.
0.770
0.870
0.970
1.070
1.170
1.270
1.370
1.470
1.568
1.666
1.764
1.862
1.960
2.058
2.156
2.254
2.352
2.450
2.548
2.646
2.744
2.842
2.940
3.038
3.136
3.234
3.332
3.430
3.528
3.626
3.724
3.822
3.920
4.018
4.116
4.214
4.312
4.410
4.508
4.606
4.704
4.802
4.900
RSEN
MAX.
0.830
0.930
1.030
1.130
1.230
1.330
1.430
1.530
1.632
1.734
1.836
1.938
2.040
2.142
2.244
2.346
2.448
2.550
2.652
2.754
2.856
2.958
3.060
3.162
3.264
3.366
3.468
3.570
3.672
3.774
3.876
3.978
4.080
4.182
4.284
4.386
4.488
4.590
4.692
4.794
4.896
4.998
5.100
MIN.
TYP.
10
20
13
24
15
28
(*1) When VDF1(T),VDF2(T)≦1.4V, detect accuracy is ±30mV.
When VDF1(T),VDF2(T)≧1.5V, detect accuracy is ±2%.
5/13
XCM410 Series
■OPERATIONAL EXPLANATION
Figure1 is typical application circuit, and Fifure2 is timing chart of figure1.
Figure 1: Typical application circuit example
Input Voltage: VIN
Release Voltage: VDF2+VHYS2
Detect Voltage: VDF2
Minimum Operation Voltage: 1.0V
Sense Pin Voltage: VSEN
Release Voltage: VDF1+VHYS1
Detect Voltage: VDF1
Output Voltage: VOUT1
Output Voltage: VOUT2
Figure 2: The timing chart of Figure 1
①
As an early state, the VIN power supply pin and the VSEN sense pin are applied sufficiently high voltage (6.0V MAX.).
While the sense pin voltage VSEN starts dropping to the detect voltage VDF1 (VSEN>VDF1), the output voltage VOUT1 keeps
high level (=VIN).
* If a pull-up resistor of the N-ch open drain is connected to added power supply different from the input voltage pin, the
high level will be a voltage value where the pull-up resistor is connected.
②
When the sense pin voltage keeps dropping and becomes equal to the detect voltage (VSEN =VDF1), the output voltage
changes into the low level (≦VIN×0.1). The detect delay time tDF1 is defined as time which ranges from VSEN=VDF1 to the
VOUT1 goes in low level.
③
The output voltage (VOUT1) maintains low level while the sense pin voltage increases again to reach the release voltage
(VSEN< VDF1 +VHYS1).
④
The release delay time tDR1 is defined as time which ranges from sense pin voltage reaches release voltage (VSEN≧
VDF1+VHYS1) to the VOUT1 goes in high level.
6/13
XCM410
Series
■OPERATIONAL EXPLANATION (Continued)
⑤
⑥
The output voltage VOUT1 maintains high level (=VIN) while the sense pin voltage more than detect voltage (VSEN>VDF1).
The VIN input voltage pin is applied sufficiently high voltage to the release voltage (VDF2+VHYS2). While the input pin
voltage VIN starts dropping to the detect voltage VDF2 (VIN > VDF2), the output voltage VOUT2 keeps high level (=VIN).
* If a pull-up resistor of the N-ch open drain is connected to added power supply different from the input voltage pin, the
high level will be a voltage value where the pull-up resistor is connected.
⑦
When the input pin voltage keeps dropping and becomes equal to the detect voltage (VIN = VDF2), the output voltage
changes into low level (≦VIN×0.1). The detect delay time tDF2 is defined as time which ranges from VIN =VDF to the VOUT
goes in low level.
⑧
While the input pin voltage keeps below the detect voltage VDF2, and 1.0V or more, the output voltage VOUT2 maintains low
level.
⑨
While the input pin voltage drops to 1.0V or less and it increases again to 1.0V or more, the output voltage (VOUT2) may not
be able to maintain low level. Such an operation is called “Undefined Operation”, and the output voltage from the VOUT2 pin
is called undefined operating voltage VUNS.
⑩
While the input pin voltage increases from 1.0V to the release voltage level (VIN<VDF2 +VHYS2), the output voltage (VOUT2)
maintains low level.
⑪
The release delay time tDR2 is defined as time which ranges from the VIN power supply voltage pin reaches release voltage
(VIN≧VDF2+VHYS2) to the VOUT2 goes in high level.
⑫
The output voltage VOUT2 maintains high level (=VIN) while the power supply voltage more than detect voltage (VIN>VDF2).
⑬
If a pull-up resistor Rpull1 of the N-ch open drain is connected to power supply VIN, output voltage VOUT1 becomes same to
the input voltage VIN. While the VIN power supply voltage drops below 1.0V and increases again to 1.0V or more, the
output voltage VOUT2 may not be able to maintain low level.
7/13
XCM410 Series
■NOTE ON USE
1. Use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent
damage to the device.
2. The power supply input pin voltage drops by the resistance between power supply and the VIN pin, and by through current
at operation of the IC. At this time, the IC may go into malfunction if the power supply input pin voltage falls below the
minimum operating voltage range.
3. When the sense voltage is less than 1.0V, be sure to separate the VIN pin and the sense pin, and to apply the voltage over
1.0V to the VIN pin.
4. Note that a rapid and high fluctuation at the power supply input pin voltage may cause a wrong operation.
5. In N channel open drain output, VOUT voltages at detect and release are determined by resistance of a pull-up resistor
connected at the VOUT pin. Please choose proper resistance values with referring to Figure 3;
During detection:VOUT=Vpull / (1+Rpull / RON)
Vpull:Pull-up voltage
RON(*1):On-resistance of N channel driver M3 can be calculated as VDS / IOUT1 from electrical characteristics,
For example, when (*2) RON = 0.5 / 0.8×10-3 = 625Ω(MIN.)at VIN=2.0V, Vpull = 3.0V and VOUT ≦0.1V at detect,
Rpull= (Vpull /VOUT-1)×RON= (3 / 0.1-1)×625≒18kΩ
In this case, Rpull should be selected higher or equal to 18kΩ in order to keep the output voltage less than 0.1V during
detection.
(*1)
VIN is smaller RON is bigger, be noted.
(*2)
For calculation, minimum VIN should be chosen among the input voltage range.
During releasing:VOUT = Vpull / (1 + Rpull / ROFF)
Vpull:Pull-up voltage
ROFF:On-resistance of N channel driver M3 is 15MΩ(MIN.)when the driver is off (as to VOUT / ILEAK)
For example:when Vpull = 6.0V and VOUT ≧ 5.99V,
Rpull = (Vpull / VOUT-1)×Roff = (6/5.99-1)×15×106 ≒25 kΩ
In this case, Rpull should be selected smaller or equal to 25 kΩ in order to obtain output voltage higher than 5.99V
during releasing.
NOTE: Roff=VOUT/ILEAK
Figure 3: Test Circuit
8/13
XCM410
Series
■TEST CIRCUITS
Circuit ①
Circuit ②
Circuit ③
Circuit ④
Circuit ⑤
Circuit ⑥
Circuit ⑦
Waveform Measurement Point①
Waveform
Measurement
Point②
Waveform ①
Waveform ②
Circuit ⑧
Waveform Measurement Point①
Waveform ①
Waveform
Measurement
Point②
Waveform ②
9/13
XCM410 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1)Detect Voltage vs. Ambient Temperature
(2)Detect Voltage vs. Input Voltage
XC6108C25AGR
XC6108C25AGR
VIN=4.0V
2.55
Detect Voltage: VDF (V)
Detect Voltage: VDF (V)
2.55
2.50
Ta=25℃
85℃
2.50
-40℃
2.45
2.45
-50
-25
0
25
50
75
1.0
100
2.0
3.0
4.0
5.0
Ambient Temperature: Ta (℃)
(3)Hysteresis Voltage vs. Ambient Temperature
(4)Output Voltage vs. Sense Voltage
XC6108C25AGR
XC6108C25AGR
VIN=4.0V
Ta=25℃
Output Voltage: VOUT (V)
Hysteresis Voltage:
VHYS (V)
0.20
0.15
0.10
0.05
-50
-25
0
25
50
75
7.0
6.0
VIN=6.0V
5.0
4.0
4.0V
3.0
2.0
1.0
1.0V
0.0
-1.0
100
0
Ambient Temperature: Ta (℃)
2
3
4
5
6
(6)Output Current vs. Input Voltage
XC6108C25AGR
XC6108N25AGR
VDS(Nch)=0.5V
VSEN=VIN Pull-up=VIN R=100kΩ
4.0
Output Current: Iout (mA)
4.0
Output V oltage: V OUT (V )
1
Sense Voltage: VSEN (V)
(5)Output Voltage vs. Input Voltage
3.0
Ta=85℃
2.0
25℃
1.0
-40℃
0.0
3.5
Ta=-40℃
3.0
25℃
2.5
2.0
1.5
85℃
1.0
0.5
0.0
-1.0
0
0
0.5
1
1.5
2
2.5
Supply Voltage: VIN (V)
10/13
6.0
Supply Voltage: VIN (V)
1
2
3
4
5
3
Supply Voltage: VIN (V)
6
XCM410
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7)Leak Current vs. Ambient Temperature
(8)Leak Current vs. Output Voltage
XC6108N25AGR
XC6108N25AGR
VIN=VSEN=6.0V
Leak Carrent: ILE A K ( μ A )
Leak Carrent: ILE A K ( μ A )
VIN=VSEN=6.0V VOUT=6.0V
0.25
0.20
0.15
0.10
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃ )
100
0.25
0.20
0.15
0.10
0
1
2
3
4
5
6
Supply Voltage: VOUT (V)
11/13
XCM410 Series
■PACKAGING INFORMATION
●SOT-25
*The side of pins are not gilded, but nickel is used: Sn 5∼15μm
●SOT-25 Reference Pattern Layout
12/13
XCM410
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this catalog is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this catalog.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this catalog.
4. The products in this catalog are not developed, designed, or approved for use with such
equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this catalog within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this catalog may be copied or reproduced without the
prior permission of Torex Semiconductor Ltd.
13/13