XCM410 Series ETR2426_003 2 Channel Voltage Detector (Sense Pin separated from VDD) ■GENERAL DESCRIPTION The XCM410 series is a multi combination module IC which comprises of two voltage detectors, XC6108 and XC6109 series. The two detectors inside are highly precise, low power consumption voltage detectors using laser trimming technology. The sense pin (VSEN) for channel 1 (VOUT1) is separated from power supply (VIN) so that it allows this pin to monitor added power supply. This feature enables output to maintain the state of detection even when voltage of the monitored power supply drops to 0V. The output configuration is N-channel open-drain. ■APPLICATIONS ■FEATURES ●Microprocessor reset circuitry High Accuracy ：±2％(Detect Voltage≧1.5V) ：±30mV(Detect Voltage＜1.5V) ●Charge voltage monitors Low Power Consumption ：1.7μA (TYP) (VOUT1=1.5V, VOUT2=3.3V, VIN=4.0V) ●Memory battery back-up switch circuits Detect Voltage Range ●Power failure detection circuits ：Channel1（Sensing pin:VSEN, Output pin:VOUT1) 0.8V～5.0V (0.1V increments) ：Channel2 (Sensing pin:VIN,Output pin: VOUT2) 1.1V～5.0V (0.1V increments) Operating Voltage Range ：1.0V～6.0V Detect Voltage Temperature Characteristics ：±100ppm/℃(TYP.) Output Configuration ：N-channel open drain Operating Temperature Range ：-40℃～85℃ Built-In 2 Detect Voltage Circuit Separated Sense Pin ：Channel1（Sensing pin:VSEN, Output pin:VOUT1) Package ：SOT-25 Environmentally Friendly ：EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUIT VIN VOUT2 VSS 2 VSEN VOUT1 1 Monitoring 別電源 Power R=100kΩ 3 4 5 R=100kΩ Supply SOT-25 (TOP VIEW) 1/13 XCM410 Series ■PIN CONFIGURATION VSEN VIN 5 4 1 2 VOUT1 5:VSEN 4:VIN XC6108 XC6109 3 VSS VOUT2 1:VOUT1 2:VSS 3:VOUT2 SOT-25 (TOP VIEW) ■PIN ASSIGNMENT PIN XCM410 FUNCTION XC6108 XC6109 1 2 3 4 5 VOUT1 VSS VOUT2 VIN VSEN Output 1 Ground Output 2 Input Voltage Sense VOUT - VSS VSS - VOUT VIN VIN VSEN - ■PRODUCT CLASSIFICATION ●Ordering Information XCM410①②③④⑤⑥-⑦(*1) DESIGNATOR DESCRIPTION SYMBOL ①② Output Configuration AA ③④ Detect Voltage 01～ Sequential numbers for two voltage detect combinations VDF1 Detect Voltage Range：0.8V ～ 5.0V (0.1V increments) VDF2 Detect Voltage Range：1.1V ～ 5.0V (0.1V increments) ⑤⑥-⑦ Packages Taping Type (*2) MR SOT-25 MR-G SOT-25 (*1) (*2) DESCRIPTION VOUT1/VOUT2：N-ch open drain output The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or representative. (Standard orientation: ⑤R-⑦, Reverse orientation: ⑤L-⑦) DESIGNATOR ③④ Detect Voltage 01 VDF1 VDF2 1.5 3.3 *This series are semi-custom products. 2/13 For other combinations, output voltages and etc., please ask Torex sales contacts. XCM410 Series ■BLOCK DIAGRAM VIN each block VSEN VOUT1 Vref VOUT2 Vref each block V SS ■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS Input Voltage Nch Open Drain Output Voltage Nch Open Drain VIN VOUT1 VOUT2 VSS-0.3～7.0 VSS-0.3～7.0 VSS-0.3～7.0 V Sense Pin Voltage VSEN VSS-0.3～7.0 V Output Current IOUT1 IOUT2 10 10 mA mA Pd 250 mW Ta Tstg -40～+85 -55～+125 Power Dissipation SOT-25 Operating Temperature Range Storage Temperature Range V o o C C 3/13 XCM410 Series ■ELECTRICAL CHARACTERISTICS ●XCM410AA Series PARAMETER SYMBOL Operating Voltage (*1) VIN Detect Voltage 1 (*2) VDF1 Detect Voltage 2 (*2) VDF2 CONDITIONS MIN. TYP. 1 MAX. UNITS 6 V - V ① V ② V ① V ② μA ③ μA ③ mA ④ mA ⑤ E-1 E-1 Hysteresis Width 1 VHYS1 VIN=1.0～6.0V Hysteresis Width 2 VHYS2 VDF2(T)=1.1～5.0V (*3) VDF1 VDF1 VDF1 X0.02 X0.05 X0.08 VDF2 VDF2 VDF2 X0.02 X0.05 X0.08 CIRCUIT VIN=VDF2×0.9 VSEN=VDF1×0.9 (*4) Supply Current 1 ISS1 VDF2(T)=1.1V～1.9V 1.4 3.3 VDF2(T)=2.0V～3.9V 1.5 3.5 VDF2(T)=4.0V～5.0V 1.6 3.6 VDF2(T)=1.1V～1.9V 1.8 3.6 VDF2(T)=2.0V～3.9V 2.0 3.8 VDF2(T)=4.0V～5.0V 3.1 4.0 VIN=VDF2×1.1 VSEN=VDF1×1.1 (*4) Supply Current 2 ISS2 VSEN=0V VDS=0.5V(N-ch) Output Current 1 IOUT1 VIN=1.0V 0.1 0.7 VIN=2.0V 0.8 1.6 VIN=3.0V 1.2 2.0 VIN=4.0V 1.6 2.3 VIN=5.0V 1.8 2.4 VIN=6.0V 1.9 2.5 VDS=0.5V(N-ch) Output Current 2 N-ch Driver Leakage Current 1 N-ch Driver Leakage Current 2 ILEAK1 ILEAK2 ΔVDF/ Temperature (*1) Characteristics IOUT2 Sense Resistance (*9) ΔTa・VDF VIN=1.0V (*5) 0.1 0.7 VIN=2.0V (*6) 0.8 1.6 VIN=3.0V (*7) 1.2 2.0 VIN=4.0V (*8) 1.6 2.3 VIN=6.0V, VSEN=6.0V, VOUT=6.0V VIN=6.0V VOUT=6.0V o o 0.2 0.4 μA ④ 0.2 0.4 μA ④ ppm/ C o ① MΩ ⑥ -40 C≦Ta≦85 C ±100 RSEN VSEN=5.0V VIN=0V E-2 Detect Delay 1 (*10) tDF1 VIN=6.0V 30 230 μs ⑦ Detect Delay 2 (*11) tDF2 VIN=6.0V→1.0V 30 230 μs ⑧ Release Delay 1 (*12) tDR1 VIN=6.0V 30 200 μs ⑦ Release Delay 2 (*13) tDR2 VIN=1.0V→6.0V 30 200 μs ⑧ NOTE: *1: VOUT1･VOUT2: same characteristics. *2: The detect voltage range for VDF1 (VOUT1): 0.8V～5.0V. The detect voltage range for VDF2 (VOUT2): 1.1V～5.0V. *3: The detect voltage for VDF2(T) (VOUT2). *4: Current flowing to the sense resistor is not included. *5: VDF2(T)>1.0V *6: VDF2(T)>2.0V *7: VDF2(T)>3.0V *8: VDF2(T)>4.0V *9: Calculated from current value and voltage values at the both ends of the resistor. *10: Time until VSEN=VDF1 reaches VOUT1=VINx0.1 when VSEN falls. *11: Time until VIN=VDF2 reaches VOUT2=0.6V when VIN falls. *12: Time until VSEN=VDF1+VHYS1 reaches VOUT1=VIN when VSEN rises. *13: Time until VIN=VDF2+VHYS2 reaches VOUT2=5.4V when VIN rises. 4/13 XCM410 Series ■VOLTAGE CHART E-1 PARAMETER NOMINAL DETECT VOLTAGE VDF1(T),VDF2(T) (V) 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 E-2 DETECT VOLTAGE (V) (*1) SENSE RESISTANCE (MΩ) VDF1,VDF2 MIN. 0.770 0.870 0.970 1.070 1.170 1.270 1.370 1.470 1.568 1.666 1.764 1.862 1.960 2.058 2.156 2.254 2.352 2.450 2.548 2.646 2.744 2.842 2.940 3.038 3.136 3.234 3.332 3.430 3.528 3.626 3.724 3.822 3.920 4.018 4.116 4.214 4.312 4.410 4.508 4.606 4.704 4.802 4.900 RSEN MAX. 0.830 0.930 1.030 1.130 1.230 1.330 1.430 1.530 1.632 1.734 1.836 1.938 2.040 2.142 2.244 2.346 2.448 2.550 2.652 2.754 2.856 2.958 3.060 3.162 3.264 3.366 3.468 3.570 3.672 3.774 3.876 3.978 4.080 4.182 4.284 4.386 4.488 4.590 4.692 4.794 4.896 4.998 5.100 MIN. TYP. 10 20 13 24 15 28 (*1) When VDF1(T),VDF2(T)≦1.4V, detect accuracy is ±30mV. When VDF1(T),VDF2(T)≧1.5V, detect accuracy is ±2%. 5/13 XCM410 Series ■OPERATIONAL EXPLANATION Figure1 is typical application circuit, and Fifure2 is timing chart of figure1. Figure 1: Typical application circuit example Input Voltage: VIN Release Voltage: VDF2+VHYS2 Detect Voltage: VDF2 Minimum Operation Voltage: 1.0V Sense Pin Voltage: VSEN Release Voltage: VDF1+VHYS1 Detect Voltage: VDF1 Output Voltage: VOUT1 Output Voltage: VOUT2 Figure 2: The timing chart of Figure 1 ① As an early state, the VIN power supply pin and the VSEN sense pin are applied sufficiently high voltage (6.0V MAX.). While the sense pin voltage VSEN starts dropping to the detect voltage VDF1 (VSEN>VDF1), the output voltage VOUT1 keeps high level (=VIN). * If a pull-up resistor of the N-ch open drain is connected to added power supply different from the input voltage pin, the high level will be a voltage value where the pull-up resistor is connected. ② When the sense pin voltage keeps dropping and becomes equal to the detect voltage (VSEN =VDF1), the output voltage changes into the low level (≦VIN×0.1). The detect delay time tDF1 is defined as time which ranges from VSEN=VDF1 to the VOUT1 goes in low level. ③ The output voltage (VOUT1) maintains low level while the sense pin voltage increases again to reach the release voltage (VSEN< VDF1 +VHYS1). ④ The release delay time tDR1 is defined as time which ranges from sense pin voltage reaches release voltage (VSEN≧ VDF1+VHYS1) to the VOUT1 goes in high level. 6/13 XCM410 Series ■OPERATIONAL EXPLANATION (Continued) ⑤ ⑥ The output voltage VOUT1 maintains high level (=VIN) while the sense pin voltage more than detect voltage (VSEN>VDF1). The VIN input voltage pin is applied sufficiently high voltage to the release voltage (VDF2+VHYS2). While the input pin voltage VIN starts dropping to the detect voltage VDF2 (VIN > VDF2), the output voltage VOUT2 keeps high level (=VIN). * If a pull-up resistor of the N-ch open drain is connected to added power supply different from the input voltage pin, the high level will be a voltage value where the pull-up resistor is connected. ⑦ When the input pin voltage keeps dropping and becomes equal to the detect voltage (VIN = VDF2), the output voltage changes into low level (≦VIN×0.1). The detect delay time tDF2 is defined as time which ranges from VIN =VDF to the VOUT goes in low level. ⑧ While the input pin voltage keeps below the detect voltage VDF2, and 1.0V or more, the output voltage VOUT2 maintains low level. ⑨ While the input pin voltage drops to 1.0V or less and it increases again to 1.0V or more, the output voltage (VOUT2) may not be able to maintain low level. Such an operation is called “Undefined Operation”, and the output voltage from the VOUT2 pin is called undefined operating voltage VUNS. ⑩ While the input pin voltage increases from 1.0V to the release voltage level (VIN＜VDF2 +VHYS2), the output voltage (VOUT2) maintains low level. ⑪ The release delay time tDR2 is defined as time which ranges from the VIN power supply voltage pin reaches release voltage (VIN≧VDF2+VHYS2) to the VOUT2 goes in high level. ⑫ The output voltage VOUT2 maintains high level (=VIN) while the power supply voltage more than detect voltage (VIN>VDF2). ⑬ If a pull-up resistor Rpull1 of the N-ch open drain is connected to power supply VIN, output voltage VOUT1 becomes same to the input voltage VIN. While the VIN power supply voltage drops below 1.0V and increases again to 1.0V or more, the output voltage VOUT2 may not be able to maintain low level. 7/13 XCM410 Series ■NOTE ON USE 1. Use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device. 2. The power supply input pin voltage drops by the resistance between power supply and the VIN pin, and by through current at operation of the IC. At this time, the IC may go into malfunction if the power supply input pin voltage falls below the minimum operating voltage range. 3. When the sense voltage is less than 1.0V, be sure to separate the VIN pin and the sense pin, and to apply the voltage over 1.0V to the VIN pin. 4. Note that a rapid and high fluctuation at the power supply input pin voltage may cause a wrong operation. 5. In N channel open drain output, VOUT voltages at detect and release are determined by resistance of a pull-up resistor connected at the VOUT pin. Please choose proper resistance values with referring to Figure 3; During detection：VOUT=Vpull / (1+Rpull / RON) Vpull：Pull-up voltage RON(*1)：On-resistance of N channel driver M3 can be calculated as VDS / IOUT1 from electrical characteristics, For example, when (*2) RON = 0.5 / 0.8×10-3 = 625Ω（MIN.）at VIN=2.0V, Vpull = 3.0V and VOUT ≦0.1V at detect, Rpull= (Vpull /VOUT-1)×RON= (3 / 0.1-1)×625≒18ｋΩ In this case, Rpull should be selected higher or equal to 18kΩ in order to keep the output voltage less than 0.1V during detection. (*1) VIN is smaller RON is bigger, be noted. (*2) For calculation, minimum VIN should be chosen among the input voltage range. During releasing：VOUT = Vpull / (1 + Rpull / ROFF) Vpull：Pull-up voltage ROFF：On-resistance of N channel driver M3 is 15MΩ（MIN.）when the driver is off (as to VOUT / ILEAK) For example：when Vpull = 6.0V and VOUT ≧ 5.99V, Rpull = (Vpull / VOUT-1)×Roff = (6/5.99-1)×15×106 ≒25 kΩ In this case, Rpull should be selected smaller or equal to 25 kΩ in order to obtain output voltage higher than 5.99V during releasing. NOTE: Roff=VOUT/ILEAK Figure 3: Test Circuit 8/13 XCM410 Series ■TEST CIRCUITS Circuit ① Circuit ② Circuit ③ Circuit ④ Circuit ⑤ Circuit ⑥ Circuit ⑦ Waveform Measurement Point① Waveform Measurement Point② Waveform ① Waveform ② Circuit ⑧ Waveform Measurement Point① Waveform ① Waveform Measurement Point② Waveform ② 9/13 XCM410 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1)Detect Voltage vs. Ambient Temperature (2)Detect Voltage vs. Input Voltage XC6108C25AGR XC6108C25AGR VIN=4.0V 2.55 Detect Voltage: VDF (V) Detect Voltage: VDF (V) 2.55 2.50 Ta=25℃ 85℃ 2.50 -40℃ 2.45 2.45 -50 -25 0 25 50 75 1.0 100 2.0 3.0 4.0 5.0 Ambient Temperature: Ta (℃) (3)Hysteresis Voltage vs. Ambient Temperature (4)Output Voltage vs. Sense Voltage XC6108C25AGR XC6108C25AGR VIN=4.0V Ta=25℃ Output Voltage: VOUT (V) Hysteresis Voltage: VHYS (V) 0.20 0.15 0.10 0.05 -50 -25 0 25 50 75 7.0 6.0 VIN=6.0V 5.0 4.0 4.0V 3.0 2.0 1.0 1.0V 0.0 -1.0 100 0 Ambient Temperature: Ta (℃) 2 3 4 5 6 (6)Output Current vs. Input Voltage XC6108C25AGR XC6108N25AGR VDS(Nch)=0.5V VSEN=VIN Pull-up=VIN R=100kΩ 4.0 Output Current: Iout (mA) 4.0 Output V oltage: V OUT (V ) 1 Sense Voltage: VSEN (V) (5)Output Voltage vs. Input Voltage 3.0 Ta=85℃ 2.0 25℃ 1.0 -40℃ 0.0 3.5 Ta=-40℃ 3.0 25℃ 2.5 2.0 1.5 85℃ 1.0 0.5 0.0 -1.0 0 0 0.5 1 1.5 2 2.5 Supply Voltage: VIN (V) 10/13 6.0 Supply Voltage: VIN (V) 1 2 3 4 5 3 Supply Voltage: VIN (V) 6 XCM410 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7)Leak Current vs. Ambient Temperature (8)Leak Current vs. Output Voltage XC6108N25AGR XC6108N25AGR VIN=VSEN=6.0V Leak Carrent: ILE A K ( μ A ) Leak Carrent: ILE A K ( μ A ) VIN=VSEN=6.0V VOUT=6.0V 0.25 0.20 0.15 0.10 -50 -25 0 25 50 75 Ambient Temperature: Ta (℃ ) 100 0.25 0.20 0.15 0.10 0 1 2 3 4 5 6 Supply Voltage: VOUT (V) 11/13 XCM410 Series ■PACKAGING INFORMATION ●SOT-25 *The side of pins are not gilded, but nickel is used: Sn 5～15μm ●SOT-25 Reference Pattern Layout 12/13 XCM410 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 13/13