NSQA6V8AW5T2 Series Low Capacitance Quad Array for ESD Protection This integrated transient voltage suppressor device (TVS) is designed for applications requiring transient overvoltage protection. It is intended for use in sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its integrated design provides very effective and reliable protection for four separate lines using only one package. These devices are ideal for situations where board space is at a premium. http://onsemi.com 1 5 2 3 4 Features • ESD Protection: IEC61000−4−2: Level 4 • • • • • • MILSTD 883C − Method 3015−6: Class 3 Four Separate Unidirectional Configurations for Protection Low Leakage Current < 1 mA Power Dissipation: 380 mW Small SC−88A SMT Package Low Capacitance Pb−Free Package is Available SC−88A/SOT−323 CASE 419A MARKING DIAGRAM 4 Benefits • Provides Protection for ESD Industry Standards: IEC 61000, HBM • Minimize Power Consumption of the System • Minimize PCB Board Space 6x MG G 1 2 3 x = H for NSQA6V8AW5T2 X for NSQA12VAW5T2 M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) Typical Applications • • • • • 5 Instrumentation Equipment Serial and Parallel Ports Microprocessor Based Equipment Notebooks, Desktops, Servers Cellular and Portable Equipment ORDERING INFORMATION Device Package Shipping † NSQA6V8AW5T2 SC−88A 3000/Tape & Reel NSQA6V8AW5T2G NSQA12VAW5T2 NSQA12VAW5T2G SC−88A 3000/Tape & Reel (Pb−Free) SC−88A 3000/Tape & Reel SC−88A 3000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. 4 1 Publication Order Number: NSQA6V8AW5T2/D NSQA6V8AW5T2 Series MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Peak Power Dissipation 8 20 msec Double Exponential Waveform (Note 1) Steady State Power − 1 Diode (Note 2) Thermal Resistance − Junction−to−Ambient Above 25°C, Derate Symbol Value Unit PPK 20 W PD 380 mW 327 3.05 °C/W mW/°C RqJA Operating Junction Temperature Range TJ −40 to +125 °C Storage Temperature Range Tstg −55 to +150 °C Lead Solder Temperature − Maximum 10 Seconds Duration TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Non−repetitive current pulse per Figure 1. 2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%. Mounted on FR4 board with min pad. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) NSQA6V8AW5T2 Characteristic Symbol Min Typ Max Unit VBR 6.4 6.8 7.1 V IR − − 1.0 mA VC − − 13 V IPP − − 1.6 A CJ − − 12 6.7 15 9.5 pF VBR 11.4 12.0 12.7 V Leakage Current (VRWM = 9.0 V) IR − − 0.05 mA Zener Impedence (IT = 5 mA) ZZ − − 30 W VC − − 23 V IPP − − 0.9 A CJ − − 15 pF Breakdown Voltage (IT = 1 mA) (Note 3) Leakage Current (VRWM = 5.0 V) Clamping Voltage 1 (IPP = 1.6 A, 8 Maximum Peak Pulse Current (8 20 msec Waveform) 20 msec Waveform) Junction Capacitance − (VR = 0 V, f = 1 MHz) − (VR = 3.0 V, f = 1 MHz) NSQA12VAW5T2 Breakdown Voltage (IT = 5 mA) (Note 3) Clamping Voltage 1 (IPP = 0.9 A, 8 Maximum Peak Pulse Current (8 20 msec Waveform) 20 msec Waveform) Junction Capacitance − (VR = 0 V, f = 1 MHz) 3. VBR is measured at pulse test current IT. http://onsemi.com 2 NSQA6V8AW5T2 Series 110 % OF RATED POWER OR IPP Ppk, PEAK SURGE POWER (W) 100 10 1 1 10 100 100 90 80 70 60 50 40 30 20 10 0 1000 50 75 100 Figure 2. Power Derating Curve 150 14 0.14 0.12 0.10 0.08 0.06 0.04 0.02 12 TA = 25°C 10 8 6V 6 4 12 V 2 0 0 −60 −40 0 20 40 60 80 100 0 3 4 Figure 3. Reverse Leakage versus Temperature Figure 4. Capacitance 70 60 HALF VALUE IRSM/2 @ 20 ms 50 5 6 1 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 40 tP 20 2 BIAS VOLTAGE (V) 80 30 1 T, TEMPERATURE (°C) PEAK VALUE IRSM @ 8 ms tr 90 −20 IF, FORWARD CURRENT (A) 100 0.1 0.01 10 0 125 Figure 1. Pulse Width TYPICAL CAPACITANCE (pF) 1 MHz FREQUENCY IR, REVERSE LEAKAGE (mA) 25 TA, AMBIENT TEMPERATURE (°C) 0.16 % OF PEAK PULSE CURRENT 0 t, TIME (ms) TA = 25°C 0.001 0 20 40 60 0.6 80 0.8 1.0 1.2 1.4 t, TIME (ms) VF, FORWARD VOLTAGE (V) Figure 5. 8 × 20 ms Pulse Waveform Figure 6. Forward Voltage http://onsemi.com 3 1.6 1.8 NSQA6V8AW5T2 Series PACKAGE DIMENSIONS SC−88A/SOT−323/SC−70 5−LEAD PACKAGE CASE 419A−02 ISSUE J A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 3 D 5 PL 0.2 (0.008) B M DIM A B C D G H J K N S M N J INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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