CS8182 Micropower 200 mA Low Dropout Tracking Regulator/Line Driver The CS8182 is a monolithic integrated low dropout tracking regulator designed to provide adjustable buffered output voltage that closely tracks (±10 mV) the reference input. The output delivers up to 200 mA while being able to be configured higher, lower or equal to the reference voltages. The output has been designed to operate over a wide range (2.8 V to 45 V) while still maintaining excellent DC characteristics. The CS8182 is protected from reverse battery, short circuit and thermal runaway conditions. The device also can withstand 45 V load dump transients and −50 V reverse polarity input voltage transients. This makes it suitable for use in automotive environments. The VREF/ENABLE lead serves two purposes. It is used to provide the input voltage as a reference for the output and it also can be pulled low to place the device in sleep mode where it nominally draws less than 30A from the supply. • • • • • • • • • 200 mA Source Capability Output Tracks within ±10 mV Worst Case Low Dropout (0.35 V Typ. @ 200 mA) Low Quiescent Current Thermal Shutdown Short Circuit Protection Wide Operating Range Internally Fused Leads in SO−8 Package For Automotive and Other Applications Requiring Site and Change Control VIN 8 1 1 5 D2PAK−5 DPS SUFFIX CASE 936AC SO−8 DF SUFFIX CASE 751 PIN CONNECTIONS AND MARKING DIAGRAMS VOUT GND GND Adj 1 VIN GND GND VREF/ENABLE 8182 ALYW Features http://onsemi.com Tab GND Pin 1. VIN 2. VOUT 3. GND 4. Adj 5. VREF CS8182 AWLYWW 1 A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week VOUT ORDERING INFORMATION* Current Limit & SAT Sense Adj − ENABLE Package Shipping† CS8182YDF8 SO−8 95 Units/Rail SO−8 2500 Tape & Reel CS8182YDFR8 CS8182YDPS5 + VREF/ENABLE + GND Thermal Shutdown Device − D2PAK 5−PIN CS8182YDPSR5 D2PAK 5−PIN 50 Units/Rail 750 Tape & Reel *Consult your local sales representative for SO−8 with exposed pads package option. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 2.0 V Figure 1. Block Diagram Semiconductor Components Industries, LLC, 2004 August, 2004 − Rev. 21 1 Publication Order Number: CS8182/D CS8182 PACKAGE PIN DESCRIPTION Package Lead Number SO−8 D2PAK 5−PIN Lead Symbol 8 1 VIN 1 2 VOUT Regulated output. 2, 3, 6, 7 3 GND Ground. 4 4 Adj 5 5 VREF/ENABLE Function Input voltage. Adjust lead. Reference voltage and ENABLE input. MAXIMUM RATINGS Rating Value Unit Storage Temperature −65 to 150 °C Supply Voltage Range (continuous) −15 to 45 V Supply Voltage Range (normal, continuous) 3.4 to 45 V 45 V −10 to 45 V Maximum Junction Temperature 150 °C Package Thermal Resistance, SO−8: Junction−to−Case, RJC Junction−to−Ambient, RJA 25 110 °C/W °C/W 4.0 10−50** °C/W °C/W 2.0 200 kV V 240 peak 225 peak (Note 2) °C Peak Transient Voltage (VIN = 14 V, Load Dump Transient = 31 V) Voltage Range (Adj, VOUT, VREF/ENABLE) Package Thermal Resistance, D2PAK, 5−Pin: Junction−to−Case, RJC Junction−to−Ambient, RJA ESD Capability (Human Body Model) (Machine Model) Lead Temperature Soldering: (Note 1) Reflow: (SO−8) (D2PAK) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. 60 second maximum above 183°C. 2. −5°C/+0°C allowable conditions. *Depending on thermal properties of substrate. RJA = RJC + RCA http://onsemi.com 2 CS8182 ELECTRICAL CHARACTERISTICS (VIN = 14 V; VREF/ENABLE > 2.75 V; −40°C < TJ < +125°C; COUT ≥ 10 F; 0.1 < COUT−ESR < 1.0 @ 10 kHz, unless otherwise specified.) Test Conditions Parameter Min Typ Max Unit −10 −5.0 − − 10 5 mV mV Regular Output VREF − VOUT VOUT Tracking Error 4.5 V ≤ VIN ≤ 26 V, 100 A ≤ IOUT ≤ 200 mA, Note 3 VIN = 12 V, IOUT = 30 mA, VREF = 5.0 V, Note 3 Dropout Voltage (VIN − VOUT) IOUT = 100 A IOUT = 30 mA IOUT = 200 mA − − − 100 − 350 150 500 600 mV mV mV Line Regulation 4.5 V ≤ VIN ≤ 26 V, Note 3 − − 10 mV Load Regulation 100 A ≤ IOUT ≤ 200 mA, Note 3 − − 10 mV Adj Lead Current Loop in Regulation − 0.2 1.0 A Current Limit VIN = 14 V, VREF = 5.0 V, VOUT = 90% of VREF, Note 3 225 − 700 mA Quiescent Current (IIN − IOUT) VIN = 12 V, IOUT = 200 mA VIN = 12 V, IOUT = 100 A VIN = 12 V, VREF/ENABLE = 0 V − − − 15 75 30 25 150 55 mA A A Reverse Current VOUT = 5.0 V, VIN = 0 V − 0.2 1.5 mA Ripple Rejection f = 120 Hz, IOUT = 200 mA, 4.5 V ≤ VIN ≤ 26 V 60 − − dB Thermal Shutdown GBD 150 180 210 °C 0.80 2.00 2.75 V − 0.2 1.0 A VREF/ENABLE Enable Voltage Input Bias Current − VREF/ENABLE 3. VOUT connected to Adj lead. http://onsemi.com 3 CS8182 TYPICAL CHARACTERISTICS QUIESCENT CURRENT (mA) 18 16 14 12 10 8 6 4 2 0 0 20 40 60 80 100 120 140 160 180 200 OUTPUT CURRENT (mA) 1 100 0.9 90 QUIESCENT CURRENT (A) QUIESCENT CURRENT (mA) Figure 2. Quiescent Current vs. Output Current 0.8 0.7 0.6 0.5 0.4 I (VOUT) = 20 mA 0.3 0.2 0.1 0 5 10 15 20 70 60 50 40 30 20 VREF/ ENABLE = 0 V 10 I (VOUT) = 1 mA 0 80 0 25 30 35 40 45 0 5 VIN, INPUT VOLTAGE (V) 15 20 25 30 35 40 45 VIN, INPUT VOLTAGE (V) Figure 3. Quiescent Current vs. Input Voltage (Operating Mode) Figure 4. Quiescent Current vs. Input Voltage (Sleep Mode) 20 140 CURRENT INTO VOUT (mA) * Graph is duplicate for VIN > 1.6 V. **Dip (@5 V) shifts with VREF voltage. 18 CURRENT INTO VOUT (mA) 10 16 14 12 10 8 VIN = 6 V* VREF = 5 V** 6 4 2 VIN = 0 V 0 0 5 10 15 * Graph is duplicate for VIN > 1.6 V. **Dip (@5 V) shifts with VREF voltage. 120 100 VIN = 0 V 80 60 VIN = 6 V* VREF = 5 V** 40 20 0 20 25 0 FORCED VOUT VOLTAGE (V) 5 10 15 20 25 30 FORCED VOUT VOLTAGE (V) Figure 5. VOUT Reverse Current Figure 6. VOUT Reverse Current http://onsemi.com 4 35 40 CS8182 CIRCUIT DESCRIPTION ENABLE Function Output Voltage By pulling the VREF/ENABLE lead below 2.0 V typically, (see Figure 10 or Figure 11), the IC is disabled and enters a sleep state where the device draws less than 55 A from supply. When the VREF/ENABLE lead is greater than 2.75 V, VOUT tracks the VREF/ENABLE lead normally. The output is capable of supplying 200 mA to the load while configured as a similar (Figure 7), lower (Figure 9), or higher (Figure 8) voltage as the reference lead. The Adj lead acts as the inverting terminal of the op amp and the VREF lead as the non−inverting. The device can also be configured as a high−side driver as displayed in Figure 12. GND GND VREF/ ENABLE Adj RA Adj VOUT, 200 mA B+ CS8182 VIN C2** 10 F C1* 1.0 F GND VOUT GND GND GND R1 VREF/ ENABLE GND VREF C3*** 10 nF Figure 8. Tracking Regulator at Higher Voltages Figure 7. Tracking Regulator at the Same Voltage GND GND R VOUT VREF(1 E) RA VOUT VREF VOUT, 200 mA Loads VOUT C2** GND 10 F C1* 1.0 F VREF/ ENABLE Adj 5.0 V C3*** 10 nF B+ VIN CS8182 C1* 1.0 F C3*** 10 nF R2 C1* 1.0 F GND GND R VREF/ ENABLE Adj VREF B+ VIN CS8182 GND VOUT, 200 mA Loads VOUT C2** GND 10 F RF GND B+ VIN CS8182 VOUT, 200 mA Loads VOUT C2** GND 10 F C3*** 10 nF VREF from MCU VOUT VREF( R2 ) R1 R2 Figure 9. Tracking Regulator at Lower Voltages NCV8501 VREF (5.0 V) 200 mA 100 nF 5.0 V To Load 10 F (e.g. sensor) GND GND Adj GND VIN CS8182 VOUT GND C1* 1.0 F C GND Adj GND VREF/ ENABLE VOUT I/O C3*** 10 nF B+ VIN CS8182 VIN 6.0 V−40 V Figure 10. Tracking Regulator with ENABLE Circuit GND GND VREF/ ENABLE C3*** 10 nF VOUT B VSAT Figure 11. Alternative ENABLE Circuit Figure 12. High−Side Driver * C1 is required if the regulator is far from the power source filter. ** C2 is required for stability. *** C3 is recommended for EMC susceptibility. http://onsemi.com 5 MCU CS8182 APPLICATION NOTES VOUT Short to Battery Figure 14. In this case the CS8182 supply input voltage is set at 7 V when a short to battery (14 V typical) occurs on VOUT which normally runs at 5 V. The current into the device (ammeter in Figure 14) will draw additional current as displayed in Figure 15. The CS8182 will survive a short to battery when hooked up the conventional way as shown in Figure 13. No damage to the part will occur. The part also endures a short to battery when powered by an isolated supply at a lower voltage as in Short to battery C2** 10 F B+ VOUT VIN GND GND CS8182 VOUT 70 mA Loads GND C1* 1.0 F GND VREF/ ENABLE Adj + Automotive Battery − typically 14 V 5.0 V + 5.0 V − C3*** 10 nF VOUT = VREF Figure 13. Short to battery A Loads VOUT B+ 70 mA C2** 10 F VOUT VIN GND GND GND Adj * C1 is required if the regulator is far from the power source filter. ** C2 is required for stability. *** C3 is recommended for EMC susceptibility. CS8182 Automotive Battery typically 14 V C1* 7V 1.0 F + − GND VREF/ ENABLE VOUT = VREF C3*** 10 nF 5.0 V + 5.0 V − Figure 14. 2.0 Switched Application 1.8 The CS8182 has been designed for use in systems where the reference voltage on the VREF/ENABLE pin is continuously on. Typically, the current into the VREF/ENABLE pin will be less than 1.0 A when the voltage on the VIN pin (usually the ignition line) has been switched out (VIN can be at high impedance or at ground.) Reference Figure 16. 1.4 1.2 1.0 0.8 Ignition Switch 0.6 0.4 VOUT 0.2 C2 10 F 0 5 6 7 8 9 10 1112 1314 15 1617 1819 20 2122 2324 25 26 VOUT VOLTAGE (V) VOUT VIN GND GND GND Figure 15. VOUT Short to Battery Adj CS8182 CURRENT (mA) 1.6 6 VBAT GND VREF/ ENABLE Figure 16. http://onsemi.com C1 1.0 F < 1.0 A VREF 5.0 V CS8182 External Capacitors The value of RJA can then be compared with those in the package section of the data sheet. Those packages with RJA’s less than the calculated value in equation 2 will keep the die temperature below 150°C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heat sink will be required. The output capacitor for the CS8182 is required for stability. Without it, the regulator output will oscillate. Actual size and type may vary depending upon the application load and temperature range. Capacitor effective series resistance (ESR) is also a factor in the IC stability. Worst−case is determined at the minimum ambient temperature and maximum load expected. The output capacitor can be increased in size to any desired value above the minimum. One possible purpose of this would be to maintain the output voltage during brief conditions of negative input transients that might be characteristic of a particular system. The capacitor must also be rated at all ambient temperatures expected in the system. To maintain regulator stability down to −40°C, a capacitor rated at that temperature must be used. More information on capacitor selection for SMART REGULATORs is available in the SMART REGULATOR application note, “Compensation for Linear Regulators,” document number SR003AN/D, available through our website at http://www.onsemi.com. IIN VIN VOUT IQ Figure 17. Single Output Regulator with Key Performance Parameters Labeled Heatsinks A heatsink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RJA: The maximum power dissipation for a single output regulator (Figure 17) is: PD(max) {VIN(max) VOUT(min)} IOUT(max) (1) where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current, for the application,and IQ is the quiescent current the regulator consumes at IOUT(max). Once the value of PD(max) is known, the maximum permissible value of RJA can be calculated: RJA 150°C TA PD IOUT Control Features Calculating Power Dissipation in a Single Output Linear Regulator VIN(max)IQ SMART REGULATOR RJA RJC RCS RSA (3) where: RJC = the junction−to−case thermal resistance, RCS = the case−to−heatsink thermal resistance, and RSA = the heatsink−to−ambient thermal resistance. RJC appears in the package section of the data sheet. Like RJA, it is a function of package type. RCS and RSA are functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heatsink manufacturers. (2) http://onsemi.com 7 CS8182 PACKAGE DIMENSIONS SOIC−8 DF SUFFIX CASE 751−07 ISSUE AB NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. −X− A 8 5 0.25 (0.010) S B 1 M Y M 4 K −Y− G C N DIM A B C D G H J K M N S X 45 SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 Figure 18. SOIC−8 http://onsemi.com 8 mm inches MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 CS8182 PACKAGE DIMENSIONS D2PAK−5 DP SUFFIX CASE 936AC−01 ISSUE O A TERMINAL 6 E U K S V B M H L W DIM A B C D E G H K L M N P R S U V W P G D NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH AND METAL BURR. 4. PACKAGE OUTLINE INCLUSIVE OF PLATING THICKNESS. 5. FOOT LENGTH MEASURED AT INTERCEPT POINT BETWEEN DATUM A AND LEAD SURFACE. N R −A− C http://onsemi.com 9 INCHES MIN MAX 0.396 0.406 0.330 0.340 0.170 0.180 0.026 0.036 0.045 0.055 0.067 REF 0.580 0.620 0.055 0.066 0.000 0.010 0.098 0.108 0.017 0.023 0.090 0.110 0 8 0.095 0.105 0.30 REF 0.305 REF 0.010 MILLIMETERS MIN MAX 10.05 10.31 8.38 8.64 4.31 4.57 0.66 0.91 1.14 1.40 1.70 REF 14.73 15.75 1.40 1.68 0.00 0.25 2.49 2.74 0.43 0.58 2.29 2.79 0 8 2.41 2.67 7.62 REF 7.75 REF 0.25 CS8182 SMART REGULATOR is a registered trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 10 For additional information, please contact your local Sales Representative. CS8182/D