NB4L7210 2.5V/3.3V Differential 2x10 Crosspoint Clock Driver with SDI Programmable Output Selects http://onsemi.com The NB4L7210 is a Clock input crosspoint fanout distribution device selecting between one of two input clocks on each of the 10 differential output pairs. A 10 Bit Serial Data Interface programs each output MUX to asynchronously select either Input clock. CLOCK inputs can accept LVCMOS, LVTTL, LVPECL, CML, or LVDS signal levels and incorporate an internal 50 ohms on die termination resistors. SCLK, SDATA, and SLOAD input can accept single ended LVPECL, CML, LVCMOS, LVTTL signals levels. SCLK and SDATA inputs operate up to 20 MHz. SLOAD input loads and latches the output select data. The SDATAOUT pin permits cascading multiple devices. Outputs are optimized for minimal output−to−output skew and low jitter. MARKING DIAGRAM* 52 1 1 QFN52 MN SUFFIX CASE 485M NB4L7210 A WL YY WW G Features • • • • • • • • • • • Typical Input Clock Frequency > 2 GHz 200 ps Typical Rise and Fall Times 800 ps Typical Propagation Delay Output to Output Skew 150 ps Additive RMS Phase Jitter of 0.2 ps Operating Range: VCC = 2.375 V to 3.6 V with VEE = 0 V Differential LVPECL Output Level (Typ 700 mV Peak−to−Peak) Low Profile 8x8 mm, 52 QFN Package 10GE WAN: 155.52 MHz / 622.08 MHz 10GE LAN: 161.1328 MHz These are Pb−Free Devices* 52 NB4L 7210 AWLYYWWG = Device Code = Assembly Site = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. Q0 Q0b VTCLK0 CLK0 CLK0b Q1 Q1b VTCLK0b Q8 VTCLK1 CLK1 CLK1b Q8b VTCLK1b Q9 Q9b VCC VEE SCLK SDATA SLOAD SDATAOUT Figure 1. Functional Block Diagram ORDERING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2009 August, 2009 − Rev. 7 1 See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Publication Order Number: NB4L7210/D GND GND Q2 Q2 VCC2 Q1 Q1 VCC1 Q0 Q0 VCC0 VCC SDATAOUT NB4L7210 52 51 50 49 48 47 46 45 44 43 42 41 40 Exposed Pad (EP) GND 1 39 VCC3 SLOAD 2 38 Q3 VTCLK0 3 37 Q3 CLK0 4 36 VCC4 35 Q4 CLK0 5 VTCLK0 6 GND 7 VTCLK1 8 32 Q5 CLK1 9 31 Q5 CLK1 10 30 VCC5 VTCLK1 11 29 Q6 34 Q4 NB4L7210 33 GND SDATA 12 28 Q6 GND 13 27 VCC6 GND GND Q7 Q7 Q8 VCC7 Q8 VCC8 Q9 Q9 VCC VCC9 SCLK 14 15 16 17 18 19 20 21 22 23 24 25 26 Figure 2. Pin Configuration (Top View) Table 1. PIN DESCRIPTION Pin Name I/O Description 1, 7, 13, 25, 26, 33, 40, 41 GND Supply Negative Supply pins must be all externally connected to a power supply to guarantee proper operation. 2 SLOAD LVCMOS, LVTTL Serial Load and Latch control input pin. Defaults LOW when float- 3, 6, 8, 11 VTCLK0, VTCLK0, VTCLK1, VTCLK1 Termination− Internal 50 Ohms Termination Resistor connection Pins. In the differential configuration when the input termination pins are connected to the common termination voltage. 4, 9 CLK0, CLK1 Differential LVPECL, CML, or LVDS CLOCK Input (TRUE). If no signal is applied then the device may be susceptible to self oscillation. 5, 10 CLK0, CLK1 Differential LVPECL, CML, or LVDS CLOCK Input (INVERT). If no signal is applied then the device may be susceptible to self oscillation. 12 SDATA LVCMOS, LVTTL Serial Data input pin (for BITS 0:9, a “0” selects CLK1, “1” selects CLK 0). Defaults LOW when floating open. 14 SCLK LVCMOS, LVTTL Serial Load Clock input pin. Defaults LOW when floating open. 15, 16, 19, 22, 27, 30, 36, 39, 44, 47, 50, 51 VCC, VCC9, VCC8, VCC7, VCC6, VCC5, VCC4, VCC3, VCC2, VCC1, VCC0 Supply 17, 20, 23, 28, 31, 34, 37, 42, 45, 48 Q[9−0] LVPECL Output (INVERT) 18, 21, 24, 29, 32, 35, 38, 43, 46, 49 Q[9−0] LVPECL Output (TRUE) 52 SDATAOUT LVCMOS, LVTTL Exposed Pad EP GND ing open. Positive Supply pins must be all externally connected to a power supply to guarantee proper operation. Serial Data output pin for cascade Exposed Pad. The thermally exposed pad (EP) on package bottom (see case drawing) must be attached to a sufficient heat− sinking conduit for proper thermal operation and must be connected to GND. http://onsemi.com 2 NB4L7210 10 MUXes SLOAD 10 Bit LATCH SDATA 10 Bit SHIFT Output Qx 9 8 7 6 5 4 3 2 1 0 BIT 9 8 7 6 5 4 3 2 1 0 MSB SDATAOUT SCLK SDATA REGISTER DATA BIT VALUE LSB 0 Selects CLK1 / CLK1 SDATA 10 BIT REGISTER 10 Bit SHIFT REGISTER 1 Selects CLK0 / CLK0 (B) (C) (A) Figure 3. Serial Data Interface Table 2. ATTRIBUTES Characteristic Value Input Default State Resistors None ESD Protection Human Body Model Moisture Sensitivity Pb−Free Package (Note 1) Flammability Rating > 2 kV QFN−52 Oxygen Index: 28 to 34 Level 1 UL 94 V−0 @ 0.125 in Transistor Count 2027 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Rating Unit VCC Positive Power Supply Parameter GND = 0 V Condition 1 6.0 V VI Positive Input GND = 0 V GND−0.3 ≤ VI ≤ VCC V IIN Input Current Through RT (50 W Resistor) Static Surge 35 70 mA mA VINPP Differential Input Voltage 2.5 V IOUT Output Current (Q / Q) Continuous Surge 25 50 mA TA Operating Temperature Range QFN−52 −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) (Note 2) 0 lfpm 500 lfpm QFN−52 QFN−52 25 19.6 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) 2S2P (Note 2) QFN−52 21 °C/W Tsol Wave Solder 265 °C Pb−Free Condition 2 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. JEDEC standard 51−6, multilayer board − 2S2P (2 signal, 2 power). 3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad. http://onsemi.com 3 NB4L7210 Table 4. DC CHARACTERISTICS (VCC = 2.375 V to 3.6 V, VEE = 0 V, TA = −40°C to +85°C (Note 4)) Symbol Min Typ Max Unit IEED GND Supply Current (All Outputs Loaded) Characteristic 110 150 200 mA RTIN Internal Input Termination Resistor 40 50 60 W VOH Output HIGH Voltage VCC−1145 VCC−1020 VCC−895 mV VOL Output LOW Voltage VCC−1945 VCC−1820 VCC−1695 mV IIH Input HIGH Current (VTx/VTx open) 8 150 mA IIL Input LOW Current (VTx/VTx open) 150 0.1 mA DIFFERENTIAL INPUTS DRIVEN SINGLE−ENDED (Figures 5, 6) Vth Input Threshold Reference Voltage Range (Note 5) GND +950 VCC − 150 mV VIH Single−Ended Input HIGH Voltage Vth + 150 VCC mV VIL Single−Ended Input LOW Voltage GND Vth − 150 mV VINAMP Single−Ended Input Amplitude 300 VCC DIFFERENTIAL INPUTS DRIVEN DIFFERENTIALLY (Figures 7, 8) VCMR Input Common Mode Range GND +950 VCC − 75 mV VIHD Differential Input HIGH Voltage VCMR + 75 VCC mV VILD Differential Input LOW Voltage GND VCMR − 75 mV VID Differential Input Voltage (VIHD − VILD) 150 2400 mV LVCMOS/LVTTL INPUTS (SCLK, SDATA, SLOAD) VIH Input HIGH Voltage 2.0 VCC V VIL Input LOW Voltage GND 0.8 V LVCMOS/LVTTL OUTPUTS (SDATAOUT) VOH Output HIGH Voltage @ IOH = −1.0 mA, RL = 20 kW to GND VOL Output LOW Voltage @ IOL = 1.0 mA, RL = 20 kW to GND 2.0 3.2 0.25 V 0.5 V NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and Output parameters vary 1:1 with VCC. Outputs loaded with 50 W to VCC − 2.0 V (See Figure 16) except SDATAOUT. 5. Vth is applied to the complementary input when operating in single−ended mode. http://onsemi.com 4 NB4L7210 Table 5. AC CHARACTERISTICS (VCC = 2.375 V to 3.6 V, GND = 0 V, TA = −40°C to +85°C (Note 6)) Symbol Characteristic Min Typ Max Unit fin = 100 MHz fin = 1 GHz 650 530 800 790 875 960 mV CLK/CLK to Qx/Qx (Note 7) SCLK to SDATAOUT Measured at 1.5 V 610 6.5 725 20 875 30.8 ps ns −5 0 0 2 5 20 10 35 200 ps −150 1000 −115 SDATA to SCLK 325 345 SLOAD 2.0 VOUTPP Output Voltage Amplitude @ VINPPmin (See Figure 9) tPLH, tPHL Propagation Delay to (See Figure 9) tSKEW Duty Cycle Skew (Note 8) Within −Device Skew Device to Device Skew (Note 8) ts Setup Time Th Hold Time PWmin Minimum Pulse Width tJIT(Ø) RMS Phase Jitter, Integration Range 12 KHz to 20 MHz tJITTER TIE Rj (10,000 Cycles) VINPP Input Voltage Swing/Sensitivity (Differential Configuration, measured Single−ended on each input) tr , tf Output Risetime and Falltime SDATA to SCLK Measured at 1.5 V SCLK to SLOAD+ Measured at 1.5 V @155.52 MHz @ 622.08 MHz 365 ps ns fs See Fig 10 See Fig 11 @155.52 MHz @ 622.08 MHz Crosstalk RMS Jitter RMS (1000 Cycles) (Note 9) Qx/Qx (20% to 80%) SDATAOUT (0.8 V − 2.0 V) ps 1.7 0.63 3.9 ps 150 750 1200 mV 120 0.88 185 10 260 15 ps ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Measured by forcing VINPP (Typ 750 mVPP) from a 50% duty cycle clock source. Q/Q Outputs loaded with 50 W to VCC − 2.0 V (See Figure 16). SCLK, SDATA and SLOAD at LOW SDATAOUT loaded 20 kW and 15 pF to GND. 7. Measured from the input pair crosspoint to each single output pair crosspoint. 8. Duty cycle skew is measured between differential outputs using the deviations of the sum of Tpw− and Tpw+. 9. 155.52 MHz @ 750 mVPP input on measured output, 161.13 MHz @ 850 mVPP input on all other others. http://onsemi.com 5 NB4L7210 Programming Application Information for the SDI As shown in Figure 4, the SLOAD pulse Low to HIGH level transition transfers the data from the SHIFT register to the LATCH register. The SLOAD Pulse HIGH to LOW level transition will lock the new MUX select data values into the LATCH register. An initial program load cycle is recommended since the 10 bit register will power−up in a random state. SDATAOUT pin outputs the shift register LSB bit with each SCLK rising edge for porting to the SCLK of the next device in a cascade interconnect only. Cascade operation will require a complete data register loading of all devices to purge the shift registers of power up random state bits. To use the serial port, the SCLK signal samples the information on the SDATA line and indexes the data into a 10 bit shift register (See Figure 3). The register shifts once per rising edge of the SCLK input. The serial input SDATA bits must each meet setup and hold timing to their respective SCLK rising edge as specified in the AC Characteristics section of this document. (See Figure 4) The SDATA Least Significant Bit (LSB), D0, is indexed in first and the Most Least Significant Bit (LSB), D9, is indexed in last. A Pulse on the SLOAD pin after the SHIFT register is fully indexed (10 clocks) will load and lock the MUX select data values into the Latch register (See Figure 4). For each MUX (Output Q[0:9], a “0” bit value selects CLK1 and a “1” bit value selects CLK 0 (see Figure 3, “C”). SDATA to SCLOCK ts SCLK SDATA th C0 D0 C1 C2 C3 C4 D1 D2 D3 D4 C5 D5 C6 D6 C7 D7 C9 C8 D9 D8 MSB LSB SLOAD SDATA to SLOAD ts PWmin Figure 4. Serial Interface Timing Diagram http://onsemi.com 6 NB4L7210 VIH CLK Qx CLK Qx Vth VIL Vth Figure 5. Differential Input Driven Single−Ended Vth Schema VCC Vthmax VIHmax VILmax CLKx Vth VIHmin Vthmin VILmin CLKx GND Figure 6. Differential Input Driven Single−Ended Vth Diagram CLK Q CLK Q Figure 7. Differential Inputs Driven Differentially VCC VIH(MAX) VIL VIH VINPP = VIHD − VILD VCMR VIL VIH VIL(MIN) GND Figure 8. VCMR Diagram CLK VINPP = VIH − VIL CLK Q VOUTPP = VOH(Q) − VOL(Q) Q tPHL tPLH Figure 9. AC Reference Measurement http://onsemi.com 7 NB4L7210 Figure 10. With conditions of an Input (source) noise floor below the NB4L7210 device noise floor, additive Phase Noise with a 155.52 MHz Carrier (Agilent 8665A) is revealed. Note near zero additive Phase Noise below 100 kHz offset. From 100 kHz to 20 MHz additive (residual) integrated phase noise Jitter is about 200 fs RMS. Figure 11. With conditions of an Input (source) noise floor below the NB4L7210 device noise floor, additive Phase Noise with a 622.08 MHz Carrier (Agilent 8665A) is revealed. Note near zero additive Phase Noise below 50 kHz offset. From 50 kHz to 20 MHz additive (residual) integrated phase noise Jitter is about 200 fs RMS. http://onsemi.com 8 NB4L7210 VCC VCC CLK Z = 50 W LVTTL/ LVCMOS Driver NB4L7210 No Connect VREF 50 W VTCLK No Connect VTCLK 50 W Recommended VREF Values VREF CLK 60 pF VEE LVCMOS VCC − VEE 2 VCC LVTTL Figure 12. LVCMOS/LVTTL to NB4L7210 Receiver Interface VCC VCC CLK Z = 50 W VTCLK LVPECL Driver NB4L7210 VTCLK Recommended RT Values VCC 50 W Z = 50 W RT RT 3.3 V 120 W 2.5 V 50 W CLK RT 50 W VEE VEE VEE Figure 13. LVPECL to NB4L7210 Receiver Interface VCC VCC 50 W 50 W Q Z = 50 W CML Driver VCC VCC Q CLK VTCLK 50 W VTCLK 50 W Z = 50 W CLK VEE VEE Figure 14. CML to NB4L7210 Interface http://onsemi.com 9 NB4L7210 1.5 V NB4L7210 VCC VCC CLK Z = 50 W VTCLK LVDS Driver 50 W NB4L7210 VTCLK 50 W Z = 50 W CLK VEE VEE Figure 15. LVDS to NB4L7210 Receiver Interface Q Zo = 50 W D Receiver NB4L7210 Q Zo = 50 W D 50 W 50 W VTT VTT = VCC − 2.0 V Figure 16. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Package Shipping† NB4L7210MNG QFN−52 (Pb−Free) 46 Units / Rail NB4L7210MNTXG QFN−52 (Pb−Free) 2000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 NB4L7210 PACKAGE DIMENSIONS 52 PIN QFN 8x8 CASE 485M−01 ISSUE B D PIN ONE REFERENCE A ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. B E DIM A A1 A2 A3 b D D2 E E2 e K L 2X 0.15 C 2X 0.15 C A2 0.10 C A 0.08 C SEATING PLANE A3 A1 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.60 0.80 0.20 REF 0.18 0.30 8.00 BSC 6.50 6.80 8.00 BSC 6.50 6.80 0.50 BSC 0.20 --0.30 0.50 REF C D2 14 52 X L 26 27 13 E2 39 1 52 X K 52 40 e 52 X b NOTE 3 0.10 C A B 0.05 C The products described herein (NB4L7210), may be covered by U.S. patents including 6,362,644. There may be other patents pending. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 11 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NB4L7210/D