FAIRCHILD FP7G50US60

Power-SPMTM
FP7G50US60
tm
Transfer Molded Type IGBT Module
General Description
Fairchild’s New IGBT Modules ( Transfer Molded Type ) provide
low conduction and switching losses as well as short circuit
ruggedness. They are designed for applications such as Motor
control, Uninterrupted Power Supplies (UPS) and general
Inverters where short circuit ruggedness is a required feature.
Features
• Short Circuit rated 10us @Tc=100°C, Vge=15V
• High Speed Switching
• Low Saturation Voltage : Vce(sat) =2.2V @Ic=50A
Package Code : EPM7
• High Input Impedance
• Fast & Soft Anti-Parallel FWD
1
Application
2
3
• Welders
• AC & DC Motor Controls
• General Purpose Inverters
4
• Robotics
5
6
7
• Servo Controls
• UPS
Internal Circuit Diagram
Absolute Maximum Ratings
Symbol
VCES
VGES
IC
ICM (1)
IF
IFM
TSC
PD
TJ
Tstg
Viso
Mounting
Torque
Description
Collector-Emitter Voltage
Gate-Emitter Voltage
Collector Current
Pulsed Collector Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Short Circuit Withstand Time
Maximum Power Dissipation
Operating Junction Temperature
Storage Temperature Range
Isolation Voltage
Power Terminals Screw : M5
Mounting Screw : M5
©2008 Fairchild Semiconductor Corporation
FP7G50US60 Rev. A
@ TC = 25°C
@ TC = 100°C
@ TC = 100°C
@ TC = 25°C
@ AC 1minute
1
Rating
600
± 20
50
100
50
100
10
250
-40 to +125
-40 to +125
2500
2.0
2.0
Units
V
V
A
A
A
A
us
W
°C
°C
V
N.m
N.m
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FP7G50US60 Transfer Molded Type IGBT Module
July 2008
FP7G50US60 Transfer Molded Type IGBT Module
Pin Configuration and Pin Description
Top View
1
2
3
4
5
6
7
Internal Circuit Diagram
Pin Description
FP7G50US60 Rev. A
Pin Number
Pin Description
1
Emitter of Q1, IGBT,
Collector of Q2, IGBT
2
Emitter of Q2, IGBT
3
Collector of Q1, IGBT
4
Gate of Q1, IGBT
5
Emitter of Q1, IGBT
6
Gate of Q2, IGBT
7
Emitter of Q2, IGBT
2
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Symbol
Unless Otherwise Specified)
Parameter
Conditions
Min Typ Max Units
Off Characteristics
BVCES
Collector-Emitter Breakdown Voltage
∆BVCES/
∆TJ
VGE= 0V, IC = 250µA
600
-
-
V
Temperature Coeff. of Breakdown Voltage VGE= 0V, IC = 1mA
-
0.6
-
V
ICES
Collector Cut-off Current
VCE= VCES, VGE= 0V
-
-
250
uA
IGES
Gate-Emitter Leakage Current
VGE= VGES, VCE= 0V
-
-
± 100
nA
On Characteristics
VGE(th)
G-E Threshold Voltage
VGE = 0V, IC=50mA
5.0
6.0
8.5
V
VCE(sat)
Collector to Emitter Saturation Voltage
IC = 50A, VGE = 15V
-
2.2
2.8
V
Dynamic Characteristics
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Capacitance
VCE = 30V, VGE = 0V,
f = 1MHz
2920
pF
400
pF
75
pF
Switching Characteristics
td(on)
Turn-On Delay Time
-
58
-
ns
tr
Rise Time
-
40
-
ns
td(off)
Turn-Off Delay Time
-
107
-
ns
tf
Fall Time
-
140
-
ns
Eon
Turn-On Switching Loss
-
0.75
-
mJ
Eoff
Turn-Off Switching Loss
-
0.54
-
mJ
Ets
Total Switching Loss
-
1.29
-
mJ
td(on)
Turn-On Delay Time
-
53
-
ns
tr
Rise Time
-
40
-
ns
td(off)
Turn-Off Delay Time
-
106
-
ns
tf
Fall Time
-
274
-
ns
Eon
Turn-On Switching Loss
-
1.09
-
mJ
Eoff
Turn-Off Switching Loss
-
1.68
-
mJ
Ets
Total Switching Loss
-
2.77
-
mJ
Tsc
Short Circuit Withstand Time
10
-
-
us
Qg
Total Gate Charge
-
136
-
nC
Qge
Gate-Emitter Charge
-
26
-
nC
Qgc
Gate-Collector Charge
-
76
-
nC
FP7G50US60 Rev. A
VCC = 300 V, IC = 50A,
RG = 5.9Ω, VGE = 15V
Inductive Load, TC = 25°C
VCC = 300 V, IC = 50A,
RG = 5.9Ω, VGE = 15V
Inductive Load, TC = 125°C
VCC = 300 V, VGE = 15V @ TC = 100°C
VCE = 300 V, IC = 50A, VGE = 15V
3
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FP7G50US60 Transfer Molded Type IGBT Module
Electrical Characteristics (TJ = 25°C,
Symbol
VFM
trr
Parameter
Unless Otherwise Specified)
Conditions
Diode Forward Voltage
IF = 50A
Min Typ Max Units
TC = 25°C
-
1.9
2.8
TC = 100°C
-
1.8
-
TC = 25°C
-
76
100
TC = 100°C
-
138
TC = 25°C
-
4
TC = 100°C
-
6
TC = 25°C
-
152
TC = 100°C
-
404
V
Diode Reverse Recovery Time
Irr
Diode Peak Reverse Recovery Current
Qrr
ns
IF = 50A
di / dt = 100 A/us
5.2
A
260
Diode Reverse Recovery Charge
nC
Thermal Characteristics
Symbol
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case (IGBT Part, per 1/2 Module)
-
0.4
°C/W
RθJC
Junction-to-Case (DIODE Part, per 1/2 Module)
-
1.0
°C/W
RθCS
Case-to-Sink
0.05
-
°C/W
Weight
Weight of Module
-
90
g
FP7G50US60 Rev. A
(Conductive grease applied)
4
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FP7G50US60 Transfer Molded Type IGBT Module
Electrical Characteristics of DIODE (TJ = 25°C,
Fig 2. Typical Saturation Voltage Characteristics
Fig 1. Typical Output Characteristics
IC, Collector Current[A]
20V
IC, Collector Current[A]
140
140
15V
12V
120
100
80
60
V GE = 10V
40
20
Common Emitter
o
TC = 25 C
0
0
2
4
6
120
100
Common Emitter
VGE = 15V
o
TC = 25 C
o
TC = 125 C
80
60
40
20
0
0.3
8
V CE , Collector-Emitter Voltage[V]
20
Fig 4. Load Current vs. Frequency
120
5
V CC = 300V
Load Current : peak of square wave
Com m on Em itter
V G E = 15V
100
Load Current [A]
4
100A
3
50A
2
I C = 30A
1
80
60
40
20
0
0
50
100
Duty cycle : 50%
o
T C = 100 C
Power Dissipation = 130W
0
0.1
150
1
o
VCE, Collector-Emitter Voltage[V]
20
Common Emitter
o
TC = 25 C
12
8
100A
4
50A
IC = 30A
0
0
4
8
12
16
20
VGE, Gate-Emitter Voltage[V]
FP7G50US60 Rev. A
100
1000
Fig 6. Saturation Voltage vs. VGE
Fig 5. Saturation Voltage vs. VGE
16
10
Frequency [Khz]
T C , Case Tem perature[ C]
VCE, Collector-Emitter Voltage[V]
10
VCE, Collector-Emitter Voltage[V]
Fig 3. Saturation Voltage vs. Case
Temperature at Variant Current Level
VCE, Collector-Emitter Voltage[V]
1
20
Common Emitter
o
TC = 25 C
16
12
8
100A
4
50A
IC = 30A
0
0
4
8
12
16
20
VGE, Gate-Emitter Voltage[V]
5
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FP7G50US60 Transfer Molded Type IGBT Module
Typical Performance Characteristics
6000
Fig 8. Turn-On Characteristics vs.
Gate Resistance
1000
Common Emitter
VGE = 0V, f = 1MHz
Common Emitter
VCC = 300V, VGE = +/- 15V
IC = 50A
o
Switching Time[ns]
Capacitance[pF]
T C = 25 C
Cies
4000
Coes
2000
Cres
o
TC = 25 C
o
100
Tr
10
0
0.5
1
10
1
30
10
RG, Gate Resistance[Ω ]
VCE, Collector-Emitter Voltage[V]
Fig 9. Turn-Off Characteristics vs.
Gate Resistance
1000
Fig 10. Switching Loss vs. Gate Resistance
100
Common Emitter
VCC = 300V, VGE = +/- 15V
IC = 50A
Switching Loss[mJ]
Switching Time[ns]
3000
o
T C = 25 C
o
T C = 125 C
Toff
Tf
100
Tf
30
1
10
Common Emitter
VCC = 300V, VGE = +/- 15V
IC = 50A
o
TC = 25 C
10
o
TC = 125 C
Eon
1
Eoff
0.1
50
1
10
RG, Gate Resistance[Ω ]
RG, Gate Resistance[Ω ]
Fig 12. Turn-Off Characteristics vs.
Collector Current
Fig 11. Turn-On Characteristics vs.
Collector Current
1000
10000
Common Emitter
VCC = 300V, VGE = +/- 15V
IC = 50A
o
Switching Time[ns]
Switching Time[ns]
Ton
TC = 125 C
TC = 25 C
o
TC = 125 C
Ton
100
Tr
10
20
FP7G50US60 Rev. A
40
60
80
IC, Collector Current[A]
Common Emitter
VCC = 300V, VGE = +/- 15V
IC = 50A
o
1000
TC = 25 C
o
TC = 125 C
Toff
100
Tf
10
100
20
6
40
60
80
IC, Collector Current[A]
100
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FP7G50US60 Transfer Molded Type IGBT Module
Fig 7. Capacitance Characteristics
15
Switching Loss[uJ]
10000
VGE, Gate-Emitter Voltage[V]
Common Emitter
VCC = 300V, VGE = +/- 15V
IC = 50A
o
TC = 25 C
Eoff
o
TC = 125 C
1000
Eon
100
20
40
60
80
IC, Collector Current[A]
300 V
12
200 V
9
V CC = 100 V
6
3
Common Emitter
R L = 5.9 Ω
o
T C = 25 C
0
0
100
100
200
Q g, Gate Charge[nC]
Fig 15. SOA Characteristics
Fig 16. Turn-Off SOA Characteristics
100
IC MAX. (Pulsed)
IC, Collector Current[A]
IC, Collector Current[A]
300
50us
IC MAX. (Continuous)
100us
1ms
10
DC Operation
1
Single Nonrepetitive
o
Pulse TC = 25 C
Curves must be derated
linerarly with increase
in temperature
0.1
0.3
1
10
100
100
10
1
1000
1
100
1000
Fig 18. Transient Thermal Impedance
Fig 17. RBSOA Characteristics
Thermal Response, Zthjc[ C/W]
300
100
1
o
IC, Collector Current[A]
10
VCE, Collector-Emitter Voltage[V]
VCE, Collector-Emitter Voltage[V]
10
1
0.1
Safe Operating Area
o
VGE = 20V, TC = 100 C
Single Nonrepetitive
o
Pulse TJ = 125 C
VGE = 15V
RG = 5.9 Ω
0
100 200 300 400 500 600 700
VCE, Collector-Emitter Voltage[V]
FP7G50US60 Rev. A
7
0.1
0.01
o
1E-3
-5
10
TC = 25 C
IGBT :
DIODE :
-4
-3
-2
-1
0
10
10
10
10
10
10
Rectangular Pulse Duration[sec]
1
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FP7G50US60 Transfer Molded Type IGBT Module
Fig 14. Gate Charge Characteristics
Fig 13. Switching Loss vs. Collector
Irr, Peak Reverse Recovery Current[A]
Trr, Reverse Recovery Time[x10ns]
160
Fig 20. Reverse Recovery Characteristics
Common Cathode
VGE = 0V
IF, Forward Current[A]
o
TC = 25 C
120
o
TC = 125 C
80
40
0
0
1
2
3
4
VF, Forward Voltage[V]
FP7G50US60 Rev. A
8
30
Trr
10
Trr
Irr
Irr
Common Cathode
di/dt = 100A/us
o
TC = 25 C
o
TC = 100 C
1
0
20
40
60
IF, Forward Current[A]
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FP7G50US60 Transfer Molded Type IGBT Module
Fig 19. Forward Characteristics
5.08±0.50
1.00±0.10
5
4
0)
1.0
(R
80.00±0.30
0
(9
1.
65
)
9.60±0.10
12.20±0.30
(10.00)
(10.00)
(14.00)
(9.00)
(14.00)
(9.00)
(14.00)
(6.50)
10.40±0.30
)
12.20±0.30
°
(7
°)
(R
93.00±0.50
(6.50)
38.80±1.00
6
35.00±0.50
7
25.00±0.20
3
17.50±0.30
2
10.00±0.50
1
14.50+0.50
-0.80
(5°)
(R
2.7
5)
10.00±0.10
18.40±0.50
0.80+0.10
-0.05
16.22±0.50
(14°)
23.00±0.50
(14°)
23.00±0.50
(5°)
FP7G50US60 Rev. A
9
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FP7G50US60 Transfer Molded Type IGBT Module
23.50±0.50
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not intended to be an exhaustive list of all such trademarks.
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™
®
tm
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FACT®
FAST®
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®
tm
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QFET®
QS™
Quiet Series™
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Saving our world, 1mW at a time™
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SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™
®
The Power Franchise®
tm
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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THEREIN, WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I35