Order this document by MRF9002R2/D SEMICONDUCTOR TECHNICAL DATA The RF Sub–Micron MOSFET Line N–Channel Enhancement–Mode Lateral MOSFET 1.0 GHz, 2 W, 26 V LATERAL N–CHANNEL BROADBAND RF POWER MOSFET Designed for broadband commercial and industrial applications with frequencies to 1.0 GHz. The high gain and broadband performance of this device make it ideal for large–signal, common–source amplifier applications in 26 volt base station equipment. • Typical Performance at 960 MHz, 26 Volts Output Power — 2 Watts Per Transistor Power Gain — 18 dB Efficiency — 50% • Designed for Maximum Gain and Insertion Phase Flatness • Capable of Handling 10:1 VSWR, @ 26 Vdc, 960 MHz, 2 Watts CW Output Power CASE 978–03 PLASTIC PFP–16 • Excellent Thermal Stability • Characterized with Series Equivalent Large–Signal Impedance Parameters • Available in Tape and Reel. R2 Suffix = 1,500 Units per 16 mm, 13 inch Reel. PIN CONNECTIONS NOTE: Exposed backside flag is source terminal for transistors. MAXIMUM RATINGS Symbol Value Unit Drain–Source Voltage Rating VDSS 65 Vdc Gate–Source Voltage VGS –0.5, +15 Vdc Total Dissipation Per Transistor @ TC = 25°C PD 4 Watts Storage Temperature Range Tstg –65 to +150 °C Operating Junction Temperature TJ 150 °C Symbol Max Unit RθJC 12 °C/W THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction to Case, Single Transistor MOISTURE SENSITIVITY LEVEL Test Methodology Per JESD 22–A113 Rating 3 NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed. REV 3 MOTOROLA RF DEVICE DATA Motorola, Inc. 2002 MRF9002R2 1 ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Gate Threshold Voltage (VDS = 10 Vdc, ID = 20 µAdc) VGS(th) 2.4 — 4 Vdc Gate Quiescent Voltage (VDS = 26 Vdc, ID = 25 mAdc) VGS(Q) 3 — 5 Vdc Drain–Source On–Voltage (VGS = 10 Vdc, ID = 0.1 Adc) VDS(on) — 0.3 — Vdc Gps 15 18 — dB Drain Efficiency @ P1dB (VDD = 26 Vdc, IDQ = 25 mA, f = 960.0 MHz) η 35 50 — % Input Return Loss @ P1dB (VDD = 26 Vdc, IDQ = 25 mA, f = 960.0 MHz) IRL — –15 –9 dB Power Output, 1 dB Compression Point (VDD = 26 Vdc, IDQ = 25 mA, f = 960.0 MHz) P1dB 34 37 — dBm ON CHARACTERISTICS FUNCTIONAL TESTS (Per Transistor in Motorola Test Fixture, 50 ohm system) Common–Source Amplifier Power Gain @ P1dB (VDD = 26 Vdc, IDQ = 25 mA, f = 960.0 MHz) Output Mismatch Stress (VDD = 26 Vdc, Pout = 2 W CW, IDQ = 25 mA, f = 960.0 MHz, VSWR = 10:1, All Phase Angles at Frequency of Tests) MRF9002R2 2 Ψ No Degradation In Output Power MOTOROLA RF DEVICE DATA $ & # "! # $ # # # & # % # $ & % # # # !"! !"! $ & # "! ! "! % $ & % # % # # # $ & % !"! Figure 1. MRF9002R2 Broadband Test Circuit Schematic Table 1. MRF9002R2 Broadband Test Circuit Component Designations and Values Designators Description C1–C6 33 pF Chip Capacitors (0805) C7–C12 1.0 µF, 35 V Tantalum Capacitors, B Case, Kemet C13 8.2 pF Chip Capacitor (0805) C14, C15 10 pF Chip Capacitors (0805) C16, C17 2.7 pF Chip Capacitors (0805) C18 3.3 pF Chip Capacitor (0805) L1–L6 12 nH Chip Inductors (0805) R1–R3 0 W Chip Resistors (0805) Z1, Z11 1.16 x 28.5 mm Microstrip Z2, Z7, Z12 0.65 x 5.6 mm Microstrip Z3, Z8, Z13 0.65 x 2.6 mm Microstrip Z4, Z14 1.16 x 19.5 mm Microstrip Z5, Z15 1.16 x 17.5 mm Microstrip Z6 1.16 x 12.9 mm Microstrip Z9 1.16 x 27.2 mm Microstrip Z10 1.16 x 4.3 mm Microstrip PCB Etched Circuit Board Raw PCB Material Rogers RO4350, 0.020″, 2.5″, x 2.5″, er = 3.5 Bedstead Copper Heatsink MOTOROLA RF DEVICE DATA MRF9002R2 3 !"! "! $ $ $ $ % % % "! Pin 1 !"! % % % ' (')* +(, $ $ "! !"! Figure 2. MRF9002R2 Broadband Test Circuit Component Layout MRF9002R2 4 MOTOROLA RF DEVICE DATA TYPICAL CHARACTERISTICS "./ "./ 9(!"!(":( 1,4 - $ 0 12 3 0 4 5 0 ')* $6786 4 4 $ 0 12 5 0 ')* $6786 ' "./ 0 : "" 3 0 4 5 0 ')*9 5 0 ')* 4 4 4 $ 0 12 5 0 ')*9 5 0 ')* 4 "./ 9(!"!(":( 1,4 <1 <1< /= <1< /= <1< $ 0 12 5 0 ')*9 5 0 ')* "6 0 1,4 1,4 $ 0 12 3 0 4 $6786 1,4 "./9 !"! ": 1,4 59 3!; ')* Figure 7. Intermodulation Distortion Products versus Output Power Figure 8. Output Power versus Frequency MOTOROLA RF DEVICE DATA Figure 6. Intermodulation Distortion versus Output Power "./9 !"! ": 1,4 "" $9 $! $!""%; %$ '9 '!%($( 1,2 Figure 5. Power Gain and Intermodulation Distortion versus Supply Voltage Figure 4. Power Gain versus Output Power Figure 3. Output Power and Power Gain versus Input Power - 9((":(( 1, 4 "./9 !"! ": 1,4 "69 "! ": 1,4 4 '9 '!%($( 1,2 '9 '!%($( 1,2 - 9((":(( 1, - 9((":(( 1, MRF9002R2 5 -- 9 "( -- <-- $9 $! $!""%; %$ Figure 9. Capacitance versus Drain Source Voltage MRF9002R2 6 MOTOROLA RF DEVICE DATA # 0 Ω 5 0 ')* # 0 Ω 5 0 ')* ')* #6 5 0 ')* #6 #%? ')* #6 5 0 ')* 5 0 ')* 5 0 ')* ')* ')* ')* #%? #%? ')* $$$ @61 $$ 0 9 3 0 49 "./ 0 : "" f MHz ZOL* Ω Zin Ω 925 4.5 – j13.3 23.4 – j9.2 960 4.3 – j15.3 23.2 – j10.4 Zin 985 4.1 – j15.8 23.0 – j11.1 ZOL* = Complex conjugate of the optimum load impedance at a given output power, voltage, IMD, bias current and frequency. 0 9 3 0 49 "./ 0 : "" f MHz ZOL* Ω Zin Ω 925 6.0 – j12.3 19.7 – j27.8 960 5.9 – j14.3 22.0 – j23.9 985 5.8 – j16.5 22.5 – j25.4 /> = Complex conjugate of source impedance. #%? @- 2=-6 A@-1 6 /<@155- A/6 7@69 ././ <9 1<@6 55262B @61 6/<41.8@/6 1-/</6 6./ '@/2=67 /<C ././ '@/2=67 /<C +2 !61< -/ 0 9 3 0 49 "./ 0 : "" f MHz ZOL* Ω Zin Ω 925 4.3 – j12.2 23.1 – j6.5 960 4.3 – j14.0 22.8 – j8.4 985 3.9 – j15.9 22.6 – j9.3 Figure 10. Series Equivalent Input and Output Impedance MOTOROLA RF DEVICE DATA MRF9002R2 7 NOTES MRF9002R2 8 MOTOROLA RF DEVICE DATA NOTES MOTOROLA RF DEVICE DATA MRF9002R2 9 NOTES MRF9002R2 10 MOTOROLA RF DEVICE DATA PACKAGE DIMENSIONS h X 45 _ A E2 14 x e D e/2 D1 E1 8X AAA ' B BOTTOM VIEW E , $ ÉÉ ÇÇÇ ÇÇÇ ÉÉ b1 Y c A A2 c1 b # " ! " H @@@ 222 q W !#! " W L SECT W–W L1 C ' A1 $ $> %% '$> '%%' '$$ %$ " $' ;'9 !' "% ) $ % ,' % $ :) ) % :) ) % D$ ) "%$ ,; ) ,' ) " % '$$ %! '% "!$ %%:,% "!$ $ " $ '$$ %! '% '$') ' !' "% ) '$ A $ %! ', "!$ %%:,% ', "!$ $ % D$$ ) A '$ 'D'!' '% !'$ , , ' !' "% ) q (,$ (,$ ((_ ((_ $%%% %$% DETAIL Y CASE 978–03 ISSUE B PLASTIC PFP–16 MOTOROLA RF DEVICE DATA MRF9002R2 11 Motorola reserves the right to make changes without further notice to any products herein. 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MOTOROLA and the logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334 Technical Information Center: 1–800–521–6274 HOME PAGE: http://www.motorola.com/semiconductors/ MRF9002R2 12 ◊ MRF9002R2/D MOTOROLA RF DEVICE DATA