ONSEMI MBRM110LT3

MBRM110L
Surface Mount
Schottky Power Rectifier
POWERMITE
Power Surface Mount Package
The Schottky Powermite employs the Schottky Barrier principle
with a barrier metal and epitaxial construction that produces optimal
forward voltage drop–reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the Powermite has the same thermal performance as the SMA while
being 50% smaller in footprint area, and delivering one of the lowest
height profiles, < 1.1 mm in the industry. Because of its small size, it is
ideal for use in portable and battery powered products such as cellular
and cordless phones, chargers, notebook computers, printers, PDAs
and PCMCIA cards. Typical applications are ac/dc and dc–dc
converters, reverse battery protection, and “Oring” of multiple supply
voltages and any other application where performance and size are
critical.
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
10 VOLTS
Features:
•
•
•
•
•
•
ANODE
CATHODE
POWERMITE
CASE 457
PLASTIC
Ultra Low VF
1st in Marketplace with a 10 VR Schottky Rectifier
Low Profile – Maximum Height of 1.1 mm
Small Footprint – Footprint Area of 8.45 mm2
Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
ESD Protection: Human Body Model >4000 V (Class 3)
ESD Protection: Machine Model >400 V (Class C)
MARKING DIAGRAM
M
1L1
Mechanical Characteristics:
•
•
•
•
•
Powermite is JEDEC Registered as D0–216AA
Case: Molded Epoxy
Epoxy Meets UL 94V–O at 1/8″
Weight: 62 mg (approximately)
Lead and Mounting Surface Temperature for Soldering Purposes.
260°C Maximum for 10 Seconds
1L1 = Device Code
M = Date Code
ORDERING INFORMATION
Device
MBRM110LT1 POWERMITE
MAXIMUM RATINGS
October, 2001 – Rev. 0
Shipping
3,000/Tape & Reel
MBRM110LT3 POWERMITE 12,000/Tape & Reel
Please See the Table on the Following Page
 Semiconductor Components Industries, LLC, 2001
Package
1
Publication Order Number:
MBRM110L/D
MBRM110L
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VRRM
VRWM
VR
10
V
IO
1.0
A
Non–Repetitive Peak Surge Current
(Non–Repetitive peak surge current, halfwave, single phase, 60 Hz)
IFSM
50
A
Storage Temperature
Tstg
–55 to 125
°C
Operating Junction Temperature
TJ
–55 to 125
°C
dv/dt
10,000
V/s
Rtjl
Rtjtab
Rtja
35
23
277
°C/W
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (TL = 115°C, RJL = 35°C/W)
Voltage Rate of Change (Rated VR, TJ = 25°C)
THERMAL CHARACTERISTICS
Thermal Resistance – Junction–to–Lead (Anode) (Note 1)
Thermal Resistance – Junction–to–Tab (Cathode) (Note 1)
Thermal Resistance – Junction–to–Ambient (Note 1)
ELECTRICAL CHARACTERISTICS
VF
Maximum Instantaneous Forward Voltage (Note 2)
(IF = 0.1 A)
(IF = 1.0 A)
(IF = 2.0 A)
IR
Maximum Instantaneous Reverse Current (Note 2)
(VR = 5.0 V)
(VR = 10 V)
1. Mounted with minimum recommended pad size, PC Board FR4, See Figures 8 and 9.
2. Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤ 2%.
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2
TJ = 25°C
TJ = 100°C
0.280
0.365
0.415
0.175
0.275
0.325
TJ = 25°C
TJ = 100°C
0.2
0.5
30
60
V
mA
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
MBRM110L
10
TJ = 125°C
100°C
75°C
25°C
–55°C
1
0.1
0.1
0.2
0.3
0.4
0.6
0.5
0.7
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
10
TJ = 125°C
100°C
75°C
1
25°C
0.1
0.1
IR, INSTANTANEOUS REVERSE VOLTAGE (VOLTS)
IR, INSTANTANEOUS REVERSE VOLTAGE (VOLTS)
TJ = 125°C
1E–2
100°C
75°C
1E–4
25°C
1E–5
1E–6
1
2
3
4
5
6
7
0.4
0.6
0.5
0.7
Figure 2. Maximum Forward Voltage
1E–1
0
0.3
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
1E–3
0.2
–55°C
8
9
10
VR, REVERSE VOLTAGE (VOLTS)
1E+0
TJ = 125°C
1E–1
100°C
75°C
1E–2
1E–3
25°C
1E–4
1E–5
0
Figure 3. Typical Reverse Current
1
2
3
4
5
6
7
8
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Maximum Reverse Current
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3
9
10
IF , AVERAGE FORWARD CURRENT (AMPS)
MBRM110L
1.8
dc
1.6
1.4
SQUARE WAVE
1.2
1.0
0.8
0.6
0.4
0.2
0
0
20
60
40
80
100
120
140
TL, LEAD TEMPERATURE (°C)
500
C, CAPACITANCE (pF)
450
400
350
300
TJ = 25°C
f = 1 MHz
250
200
150
100
0
1
2
3
4
5
6
7
8
VR, REVERSE VOLTAGE (VOLTS)
9
10
PFO, AVERAGE POWER DISSIPATION (WATTS)
Figure 5. Current Derating – Junction to Lead
0.45
0.4
dc
0.35
0.3
SQUARE WAVE
0.25
0.2
0.15
0.1
0.05
0
0
Figure 6. Typical Capacitance
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 7. Forward Power Dissipation
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4
1.8
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
MBRM110L
1.0
50%
0.1
20%
10%
5.0%
0.01
2.0%
1.0%
0.001
0.00001
Rtjl(t) = Rtjl*r(t)
0.0001
0.001
0.01
0.1
1.0
10
100
T, TIME (s)
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 8. Thermal Response Junction to Lead
1.0
50%
0.1
20%
10%
5.0%
0.01
2.0%
Rtjl(t) = Rtjl*r(t)
1.0%
0.001
0.00001
0.0001
0.001
0.01
0.1
1.0
10
T, TIME (s)
Figure 9. Thermal Response Junction to Ambient
0.025
0.635
0.105
2.67
0.030
0.762
0.100
2.54
0.050
1.27
inches
mm
Minimum Recommended Footprint
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5
100
1,000
MBRM110L
PACKAGE DIMENSIONS
POWERMITE
PLASTIC PACKAGE
CASE 457–04
ISSUE D
F
0.08 (0.003)
C
–A–
J
M
T B
S
TERM. 1
–B–
K
TERM. 2
R
L
J
D
H
–T–
0.08 (0.003)
M
T B
S
C
S
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6
S
C
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
DIM
A
B
C
D
F
H
J
K
L
R
S
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
1.75
2.05 0.069
0.081
1.75
2.18 0.069
0.086
0.85
1.15 0.033
0.045
0.40
0.69 0.016
0.027
0.70
1.00 0.028
0.039
-0.05
+0.10 -0.002 +0.004
0.10
0.25 0.004
0.010
3.60
3.90 0.142
0.154
0.50
0.80 0.020
0.031
1.20
1.50 0.047
0.059
0.50 REF
0.019 REF
MBRM110L
Notes
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7
MBRM110L
POWERMITE is a registered trademark of and used under a license from MicroSemi Corporation
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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8
MBRM110L/D