ONSEMI MBRA140

MBRA140T3
Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
. . . employing the Schottky Barrier principle in a large area
metal–to–silicon power diode. State of the art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity diodes in surface mount applications
where compact size and weight are critical to the system.
•
•
•
•
•
Small Compact Surface Mountable Package with J–Bent Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
Guardring for Stress Protection
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
40 VOLTS
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 70 mg (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
SMA
CASE 403D
PLASTIC
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Shipped in 12 mm tape, 5000 units per 13 inch reel
• Polarity: Cathode Lead Indicated by Either Notch in Plastic Body or
•
MARKING DIAGRAM
B14
Polarity Band
Marking: B14
B14 = Device Code
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40
V
Average Rectified Forward Current
(At Rated VR, TC = 95°C)
IO
1.0
Peak Repetitive Forward Current
(At Rated VR, Square Wave,
20 kHz, TC = 100°C)
IFRM
2.0
A
Non–Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz)
IFSM
30
A
Tstg, TC
–55 to +150
°C
TJ
–55 to +125
°C
dv/dt
10,000
V/s
Storage/Operating Case
Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated VR, TJ = 25°C)
 Semiconductor Components Industries, LLC, 2002
April, 2002 – Rev. 5
ORDERING INFORMATION
Device
Package
Shipping
SMA
5000/Tape & Reel
A
MBRA140T3
1
Publication Order Number:
MBRA140T3/D
MBRA140T3
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
RθJL
RθJA
35
86
°C/W
Thermal Resistance — Junction–to–Lead (Note 1.)
Thermal Resistance — Junction–to–Ambient (Note 1.)
ELECTRICAL CHARACTERISTICS
VF
Maximum Instantaneous Forward Voltage (Note 2
2.))
TJ = 25°C
TJ = 100°C
0.55
0.71
0.505
0.74
TJ = 25°C
TJ = 100°C
0.5
0.1
10
4.0
(IF = 1.0 A)
(IF = 2.0 A)
see Figure 2 for other Values
IR
Maximum Instantaneous Reverse Current
(VR = 40 V)
(VR = 20 V)
1. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4.
2. Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤ 2.0%.
10
I F, INSTANTANEOUS FORWARD CURRENT (AMPS)
i F , INSTANTANEOUS FORWARD CURRENT (AMPS)
see Figure 4 for other Values
TJ = 85°C
1.0
TJ = 125°C
TJ = 25°C
TJ = -40°C
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
10
1.0
TJ = 85°C
TJ = 25°C
TJ = 125°C
0.1
0
0.4
0.2
0.6
1.0
0.8
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.2
100E-3
10E-3
TJ = 125°C
1.0E-3
TJ = 85°C
I R , MAXIMUM REVERSE CURRENT (AMPS)
I R , REVERSE CURRENT (AMPS)
mA
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
100E-3
10E-3
TJ = 85°C
1.0E-3
100E-6
TJ = 25°C
100E-6
TJ = 25°C
10E-6
1.0E-6
Volts
0
10
20
30
40
10E-6
1.0E-6
0
10
20
30
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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2
40
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
IO , AVERAGE FORWARD CURRENT (AMPS)
1.6
dc
FREQ = 20 kHz
1.4
1.2
PFO , AVERAGE POWER DISSIPATION (WATTS)
MBRA140T3
SQUARE WAVE
1.0
Ipk/Io = 0.8
Ipk/Io = 5
0.6
Ipk/Io = 10
0.4
Ipk/Io = 20
0.2
0
0
20
40
60
80
100
120
140
1.0
0.9
SQUARE WAVE
0.8
dc
Ipk/Io = 0.7
Ipk/Io = 5
0.6
Ipk/Io = 10
0.5
0.4
Ipk/Io = 20
0.3
0.2
0.1
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
TL, LEAD TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
1.6
T, TIME (s)
1.0E+0
100E-3
10E-3
1.0E-3
10E-6
1.0E-3
100E-6
10E-3
1.0E+0
100E-3
10E+0
T, TIME (s)
Figure 7. Thermal Response
1000
C, CAPACITANCE (pF)
100E-6
100
TJ = 25°C
10
1.0
0
5.0
10
15
20
25
30
VR, REVERSE VOLTAGE (VOLTS)
Figure 8. Capacitance
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3
35
40
100E+0
1.0E+3
MBRA140T3
PACKAGE DIMENSIONS
SMA
CASE 403D–02
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D-01 OBSOLETE, NEW STANDARD IS
403D-02.
S
A
D
DIM
A
B
C
D
H
J
K
S
B
POLARITY INDICATOR OPTIONAL
AS NEEDED
INCHES
MIN
MAX
0.160
0.180
0.090
0.115
0.075
0.095
0.050
0.064
0.002
0.006
0.006
0.016
0.030
0.060
0.190
0.220
MILLIMETERS
MIN
MAX
4.06
4.57
2.29
2.92
1.91
2.41
1.27
1.63
0.05
0.15
0.15
0.41
0.76
1.52
4.83
5.59
C
K
J
H
0.157
4.0
0.0787
2.0
0.0787
2.0
inches
mm
SMA FOOTPRINT
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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4
MBRA140T3/D