MGSF1P02ELT1 Preferred Device Power MOSFET 750 mAmps, 20 Volts P–Channel SOT–23 These miniature surface mount MOSFETs low RDS(on) assure minimal power loss and conserve energy, making these devices ideal for use in space sensitive power management circuitry. Typical applications are dc–dc converters and power management in portable and battery–powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. • Low RDS(on) Provides Higher Efficiency and Extends Battery Life • Miniature SOT–23 Surface Mount Package Saves Board Space http://onsemi.com 750 mAMPS 20 VOLTS RDS(on) = 260 m P–Channel 3 MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Drain–to–Source Voltage Gate–to–Source Voltage – Continuous Symbol Value Unit VDSS 20 Vdc VGS ± 8.0 Vdc Drain Current – Continuous @ TA = 25°C – Pulsed Drain Current (tp ≤ 10 µs) ID IDM 750 2000 Total Power Dissipation @ TA = 25°C PD 400 mW Operating and Storage Temperature Range TJ, Tstg – 55 to 150 °C RθJA 300 °C/W TL 260 °C Thermal Resistance – Junction–to–Ambient Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds 1 mA 2 MARKING DIAGRAM 3 SOT–23 CASE 318 STYLE 21 1 PE W 2 W = Work Week PIN ASSIGNMENT Drain 3 1 2 Source Gate ORDERING INFORMATION Device Package Shipping MGSF1P02ELT1 SOT–23 3000 Tape & Reel MGSF1P02ELT3 SOT–23 10,000 Tape & Reel Preferred devices are recommended choices for future use and best overall value. Semiconductor Components Industries, LLC, 2000 November, 2000 – Rev. 2 1 Publication Order Number: MGSF1P02ELT1/D MGSF1P02ELT1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit V(BR)DSS 20 – – Vdc – – – – 1.0 10 OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage (VGS = 0 Vdc, ID = 10 µAdc) µAdc Zero Gate Voltage Drain Current (VDS = 16 Vdc, VGS = 0 Vdc) (VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125°C) IDSS Gate–Body Leakage Current (VGS = ± 8.0 Vdc, VDS = 0 Vdc) IGSS – – ±100 nAdc Gate Threshold Voltage (VDS = VGS, ID = 250 µAdc) VGS(th) 0.7 1.0 1.25 Vdc Static Drain–to–Source On–Resistance (VGS = 4.5 Vdc, ID = 0.75 Adc) (VGS = 2.5 Vdc, ID = 0.5 Adc) rDS(on) – – 0.22 0.40 0.26 0.50 ON CHARACTERISTICS (Note 1.) Ohms DYNAMIC CHARACTERISTICS Input Capacitance (VDS = 5.0 Vdc) Ciss – 140 – Output Capacitance (VDS = 5.0 Vdc) Coss – 130 – Transfer Capacitance (VDG = 5.0 Vdc) Crss – 50 – td(on) – 9.5 – tr – 32 – td(off) – 200 – tf – 200 – QT – 5500 – pC IS – – 0.6 A ISM – – 0.75 VSD – – 1.0 pF SWITCHING CHARACTERISTICS (Note 2.) Turn–On Delay Time Rise Time (VDD = 5 Vdc, ID = 1.0 Adc, RL = 5 Ω, RG = 6 Ω) Turn–Off Delay Time Fall Time Total Gate Charge (VDS = 16 Vdc, ID = 1.5 Adc, VGS = 4.0 Vdc) ns SOURCE–DRAIN DIODE CHARACTERISTICS Continuous Current Pulsed Current Forward Voltage (Note 2.) (VGS = 0 Vdc, IS = 0.6 Adc) 1. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%. 2. Switching characteristics are independent of operating junction temperature. V TYPICAL ELECTRICAL CHARACTERISTICS 1.5 1.4 1.2 1.0 0.8 2.25 V 1 0.75 0.6 TJ = 150°C 0.4 25°C 0.2 0 VGS = 2.5 V 1.25 I D , DRAIN CURRENT (AMPS) I D , DRAIN CURRENT (AMPS) 1.6 2.0 V 0.5 1.75 V 0.25 1.5 V -55°C 1 1.2 1.4 1.6 1.8 2 2.2 2.4 0 2.6 1.25 V 0 1 2 3 4 5 6 7 8 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) Figure 1. Transfer Characteristics Figure 2. On–Region Characteristics http://onsemi.com 2 9 10 MGSF1P02ELT1 0.6 VGS = 2.5 V 0.55 150°C 0.5 0.45 25°C 0.4 0.35 -55°C 0.3 0.25 0.2 0 0.05 0.15 0.1 0.2 0.25 0.3 0.35 0.4 0.45 0.5 RDS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS RDS(on) , DRAIN-TO-SOURCE RESISTANCE (OHMS) TYPICAL ELECTRICAL CHARACTERISTICS 0.4 VGS = 4.5 V 0.35 150°C 0.3 0.25 25°C 0.2 0.15 -55°C 0.1 0.05 0 0.1 0 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) RDS(on) , DRAIN-TO-SOURCE RESISTANCE (NORMALIZED) 1.5 VGS = 4.5 V ID = .75 A 1.2 VGS = 2.5 V ID = .5 A 1.1 1 0.9 0.8 0.7 0.6 -50 0 -25 25 50 100 75 125 8 0.8 6 ID = 1.5 A 4 2 0 150 VDS = 16 V TJ = 25°C 1 0 2 TJ, JUNCTION TEMPERATURE (°C) 3 4 5 6 7 8 9 QT, TOTAL GATE CHARGE (nC) Figure 6. Gate Charge Figure 5. On–Resistance Variation with Temperature 400 1 350 TJ = 150°C 0.1 25°C -55°C C, CAPACITANCE (pF) I D , DIODE CURRENT (AMPS) 0.7 0.6 Figure 4. On–Resistance versus Drain Current Figure 3. On–Resistance versus Drain Current 1.3 0.5 0.4 ID, DRAIN CURRENT (AMPS) ID, DRAIN CURRENT (AMPS) 1.4 0.3 0.2 0.01 VGS = 0 V f = 1 MHz TJ = 25°C Coss 300 250 200 Ciss 150 Crss 100 50 0.001 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 1 0 1 2 3 4 5 6 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VSD, DIODE FORWARD VOLTAGE (VOLTS) Figure 7. Body Diode Forward Voltage Figure 8. Capacitance Variation http://onsemi.com 3 7 MGSF1P02ELT1 INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 inches mm SOT–23 POWER DISSIPATION one can calculate the power dissipation of the device which in this case is 416 milliwatts. The power dissipation of the SOT–23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOT–23 package, PD can be calculated as follows: PD = PD = 150°C – 25°C 300°C/W = 416 milliwatts The 300°C/W for the SOT–23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 416 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT–23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. TJ(max) – TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, SOLDERING PRECAUTIONS • The soldering temperature and time shall not exceed 260°C for more than 10 seconds. • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling. The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. http://onsemi.com 4 MGSF1P02ELT1 PACKAGE DIMENSIONS SOT–23 (TO–236) CASE 318–08 ISSUE AF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 3 1 V B S 2 G C D H J K DIM A B C D G H J K L S V INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236 STYLE 21: PIN 1. GATE 2. SOURCE 3. DRAIN http://onsemi.com 5 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60 MGSF1P02ELT1 Notes http://onsemi.com 6 MGSF1P02ELT1 Notes http://onsemi.com 7 MGSF1P02ELT1 Thermal Clad is a registered trademark of the Bergquist Company. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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