VISHAY SI3443DV-T1

Si3443DV
Vishay Siliconix
P-Channel 2.5-V (G-S) MOSFET
VDS (V)
–20
20
rDS(on) ()
ID (A)
0.065 @ VGS = –4.5 V
4.4
0.090 @ VGS = –2.7 V
3.7
0.100 @ VGS = –2.5 V
3.5
(4) S
TSOP-6
Top View
1
6
(3) G
3 mm
2
5
3
4
(1, 2, 5, 6) D
2.85 mm
P-Channel MOSFET
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
–20
Gate-Source Voltage
VGS
12
Continuous Drain Current (TJ = 150C)a
ID
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
TA = 25C
TA = 70C
Operating Junction and Storage Temperature Range
V
4.4
TA = 25C
3.5
TA = 70C
Maximum Power Dissipationa
Unit
IDM
20
IS
–1.7
A
2.0
PD
W
1.3
TJ, Tstg
–55 to 150
C
Symbol
Limit
Unit
RthJA
62.5
C/W
Parameter
Maximum Junction-to-Ambienta
Notes
a. Surface Mounted on FR4 Board, t 5 sec.
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Document Number: 70713
S-54948—Rev. B, 29-Sep-97
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Si3443DV
Vishay Siliconix
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = –250 mA
–0.6
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
a
D i S
Drain-Source
On-State
O S
Resistance
R i
Forward
Transconductancea
Diode Forward Voltagea
ID(on)
V
"100
VDS = 0 V, VGS = "12 V
VDS = –20 V, VGS = 0 V
–1
VDS = –20 V, VGS = 0 V, TJ = 70C
–5
VDS = –5 V, VGS = –4.5 V
–15
mA
A
VGS = –4.5 V, ID = –4.4 A
0.058
0.065
VGS = –2.7 V, ID = –3.7 A
0.080
0.090
VGS = –2.5 V, ID = –3.5 A
0.087
0.100
gfs
VDS = –10 V, ID = –4.4 A
10
VSD
IS = –1.7 A, VGS = 0 V
rDS(on)
nA
W
S
–1.2
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
8.5
VDS = –10
10 V,
V VGS = –4.5
45V
V, ID = –4.4
44A
Gate-Drain Charge
Qgd
1.7
Turn-On Delay Time
td(on)
15
Rise Time
Turn-Off Delay Time
tr
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
VDD = –10
10 V
V,, RL = 10 W
ID ^ –1.0
1 0 A,
A VGEN = –4.5
45V
V, RG = 6 W
IF = –1.7 A, di/dt = 100 A/ms
15
nC
C
2.8
50
32
60
57
100
40
80
40
80
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
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Document Number: 70713
S-54948—Rev. B, 29-Sep-97
Si3443DV
Vishay Siliconix
Output Characteristics
Transfer Characteristics
20
20
TC = –55C
3V
16
16
I D – Drain Current (A)
I D – Drain Current (A)
VGS = 5, 4.5, 4, 3.5 V
2.5 V
12
8
2V
4
125C
12
25C
8
4
1.5 V
0
0
0
1
2
3
4
5
0
0.5
VDS – Drain-to-Source Voltage (V)
1.0
0.16
1200
C – Capacitance (pF)
r DS(on)– On-Resistance ( )
1500
VGS = 2.7 V
0.08
2.5
3.0
3.5
Capacitance
On-Resistance vs. Drain Current
VGS = 2.5 V
2.0
VGS – Gate-to-Source Voltage (V)
0.20
0.12
1.5
VGS = 4.5 V
Ciss
900
600
0.04
300
0
0
Coss
Crss
0
4
8
12
16
20
0
4
Gate Charge
VDS = 10 V
ID = 4.4 A
r DS(on)– On-Resistance ( )
(Normalized)
V GS – Gate-to-Source Voltage (V)
1.6
4
3
2
1
0
0
2
4
6
Qg – Total Gate Charge (nC)
Document Number: 70713
S-54948—Rev. B, 29-Sep-97
12
16
20
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
5
8
8
10
1.4
On-Resistance vs. Junction Temperature
VGS = 4.5 V
ID = 4.4 A
1.2
1.0
0.8
0.6
–50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (C)
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Si3443DV
Vishay Siliconix
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.20
r DS(on)– On-Resistance ( W )
20
I S – Source Current (A)
10
TJ = 150C
TJ = 25C
0.16
0.12
ID = 4.4 A
0.08
0.04
0
1
0
0.25
0.50
0.75
1.00
1.25
0
1.50
VSD – Source-to-Drain Voltage (V)
Threshold Voltage
3
4
5
Single Pulse Power
25
0.4
20
ID = 250 mA
Power (W)
V GS(th) Variance (V)
2
VGS – Gate-to-Source Voltage (V)
0.6
0.2
1
0.0
–0.2
15
10
5
–0.4
–50
–25
0
25
50
75
100
125
150
0
0.01
0.10
TJ – Temperature (C)
1.00
10.00
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 62.5C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
10–3
10–2
10–1
1
10
Square Wave Pulse Duration (sec)
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Document Number: 70713
S-54948—Rev. B, 29-Sep-97
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Document Number: 91000
Revision: 18-Jul-08
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