VISHAY SI3458DV

Si3458DV
New Product
Vishay Siliconix
N-Channel 60-V (D-S) MOSFET
VDS (V)
60
rDS(on) ()
ID (A)
0.10 @ VGS = 10 V
3.2
0.13 @ VGS = 4.5 V
2.8
(1, 2, 5, 6) D
TSOP-6
Top View
3 mm
1
6
2
5
3
4
(3) G
(4) S
2.85 mm
N-Channel MOSFET
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
60
Gate-Source Voltage
VGS
20
Continuous Drain Current (TJ = 150C)
150 C)a, b
ID
2.5
TA = 70C
IDM
15
Single Avalanche Current
IAS
10
TA = 25C
TA = 70C
Operating Junction and Storage Temperature Range
V
3.2
TA = 25C
Pulsed Drain Current
Maximum Power Dissipationa, b
Unit
A
2
PD
W
1.3
TJ, Tstg
C
–55 to 150
Parameter
Maximum Junction-to-Ambienta
Symbol
t 5 sec
Steady State
Maximum Junction-to-Lead
Steady State
Typical
Maximum
Unit
62.5
RthJA
RthJL
106
C/W
35
Notes
a. Surface Mounted on FR4 Board.
b. t 5 sec.
Document Number: 70859
S-61517—Rev. B, 12-Apr-99
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2-1
Si3458DV
New Product
Vishay Siliconix
Parameter
Symbol
Test Condition
Min
V(BR)DSS
VDS = 0 V, ID = 250 mA
60
VGS(th)
VDS = VGS, ID = 250 mA
1
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain Source On-State
Drain-Source
On State Resistancea
rDS(on)
DS( )
Forward Transconductancea
gfs
V
VDS = 0 V, VGS = "20 V
"100
VDS = 48 V, VGS = 0 V
1
VDS = 48 V, VGS = 0 V, TJ = 150C
50
VDS = 5 V, VGS = 10 V
10
nA
mA
A
VGS = 10 V, ID = 3.2 A
0.085
0.10
VGS = 4.5 V, ID = 2.8 A
0.110
0.13
VDS = 4.5 V, ID = 3.2 A
8
VDS = 30 V,
V VGS = 10 V
V, ID = 3
3.2
2A
4.0
W
S
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
8
16
nC
C
Gate-Drain Charge
Qgd
2.0
Turn-On Delay Time
td(on)
10
20
tr
10
20
20
40
10
20
Rise Time
Turn-Off Delay Time
Fall Time
td(off)
VDD = 30 V
V,, RL = 30 W
ID ^ 1 A,
A VGEN = 10 V
V, RG = 6 W
tf
ns
Source-Drain Rating Characteristicsb
Continuous Current
IS
1.7
Pulsed Current
ISM
15
Diode Forward Voltagea
VSD
IS = 1.7 A, VGS = 0 V
trr
IF = 1.7 A, di/dt = 100 A/ms
A
Source-Drain Reverse Recovery Time
50
1.2
V
90
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
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Document Number: 70859
S-61517—Rev. B, 12-Apr-99
Si3458DV
New Product
Vishay Siliconix
Output Characteristics
Transfer Characteristics
15
15
VGS = 10 thru 5 V
12
9
I D – Drain Current (A)
I D – Drain Current (A)
12
4V
6
3
9
6
TC = 125C
3
25C
3V
0
0
0
1
2
3
4
0
1
VDS – Drain-to-Source Voltage (V)
2
3
4
5
VGS – Gate-to-Source Voltage (V)
Capacitance
On-Resistance vs. Drain Current
0.20
600
500
0.16
C – Capacitance (pF)
r DS(on) – On-Resistance ( )
–55C
VGS = 4.5 V
0.12
VGS = 10 V
0.08
0.04
Ciss
400
300
200
Coss
100
Crss
0
0
0
3
6
9
12
15
0
10
ID – Drain Current (A)
r DS(on) – On-Resistance ()
(Normalized)
V GS – Gate-to-Source Voltage (V)
2.0
VDS = 30 V
ID = 3.2 A
8
6
4
2
0
0
2
4
6
Qg – Total Gate Charge (nC)
Document Number: 70859
S-61517—Rev. B, 12-Apr-99
30
40
50
60
VDS – Drain-to-Source Voltage (V)
Gate Charge
10
20
8
On-Resistance vs. Junction Temperature
VGS = 10 V
ID = 3.2 A
1.6
1.2
0.8
0.4
–50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (C)
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Si3458DV
New Product
Vishay Siliconix
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
10
0.16
r DS(on) – On-Resistance ( W )
0.20
I S – Source Current (A)
20
TJ = 150C
TJ = 25C
0.12
0.08
ID = 3.2 A
0.04
0
1
0.00
0.2
0.4
0.6
0.8
1.0
0
1.2
VSD – Source-to-Drain Voltage (V)
2
6
8
10
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
0.4
25
ID = 250 mA
0.2
20
–0.0
Power (W)
V GS(th) Variance (V)
4
–0.2
15
10
–0.4
5
–0.6
–0.8
–50
0
–25
0
25
50
75
100
125
150
0.001
0.01
TJ – Temperature (C)
0.1
10
1
100
600
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
t1
t2
1. Duty Cycle, D =
0.05
t1
t2
2. Per Unit Base = RthJA = 106C/W
0.02
3. TJM – TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10–4
10–3
10–2
10–1
1
10
100
600
Square Wave Pulse Duration (sec)
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Document Number: 70859
S-61517—Rev. B, 12-Apr-99