VISHAY SI1904EDH

Si1904EDH
New Product
Vishay Siliconix
Dual N-Channel 25-V (D-S) MOSFET
FEATURES
D TrenchFETr Power MOSFETS: 2.5-V Rated
D ESD Protected: 1800 V
D Thermally Enhanced SC-70 Package
PRODUCT SUMMARY
VDS (V)
rDS(on) (W)
ID (A)
0.810 @ VGS = 4.5 V
0.73
APPLICATIONS
1.04 @ VGS = 2.5 V
0.65
D Load Switching
D PA Switch
D Level Switch
25
D1
SOT-363
SC-70 (6-LEADS)
1
6
D1
G1
2
5
G2
D2
3
4
S2
Marking Code
CB
XX
2 kW
2 kW
G1
YY
S1
D2
G2
Lot Traceability
and Date Code
Part # Code
Top View
S1
S2
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
VDS
25
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)
_ a
TA = 25_C
V
0.73
0.64
0.53
0.46
ID
TA = 85_C
Pulsed Drain Current
IDM
Continuous Diode Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
Unit
TA = 85_C
Operating Junction and Storage Temperature Range
PD
A
2
0.61
0.48
0.74
0.57
0.38
0.30
TJ, Tstg
W
_C
–55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 5 sec
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
130
170
170
220
80
100
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71445
S-03929—Rev. B, 21-May-01
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Si1904EDH
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VDS = VGS, ID = 250 mA
0.6
Typ
Max
Unit
VDS = 0 V, VGS = "4.5 V
"1
mA
VDS = 0 V, VGS = "8 V
"1
mA
Static
Gate Threshold Voltage
VGS(th)
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
VDS = 20 V, VGS = 0 V
1
VDS = 20 V, VGS = 0 V, TJ = 85_C
5
VDS = 5 V, VGS = 4.5 V
rDS(on)
V
2
m
mA
A
VGS = 4.5 V, ID = 0.64 A
0.630
0.810
VGS = 2.5 V, ID = 0.2 A
0.830
1.04
gfs
VDS = 10 V, ID = 0.64 A
1.1
VSD
IS = 0.48 A, VGS = 0 V
0.80
1.2
0.66
1.0
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
0.26
Turn-On Delay Time
td(on)
42
65
Rise Time
VDS = 15 V, VGS = 4.5 V, ID = 0.64 A
tr
Turn-Off Delay Time
VDD = 15 V, RL = 30 W
ID ^ 0.5 A, VGEN = 4.5 V, RG = 6 W
td(off)
Fall Time
0.14
tf
nC
85
130
200
300
160
240
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Gate-Current vs. Gate-Source Voltage
Gate Current vs. Gate-Source Voltage
2.0
10,000
I GSS – Gate Current (mA)
I GSS – Gate Current (mA)
1,000
1.6
1.2
0.8
100
10
TJ = 150_C
1
0.1
TJ = 25_C
0.01
0.4
0.001
0.0
0.0001
0
3
6
9
VGS – Gate-to-Source Voltage (V)
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2
12
0
3
6
9
12
VGS – Gate-to-Source Voltage (V)
Document Number: 71445
S-03929—Rev. B, 21-May-01
Si1904EDH
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
2.0
2.0
3V
TC = –55_C
VGS = 5 thru 3.5 V
25_C
1.5
2.5 V
I D – Drain Current (A)
I D – Drain Current (A)
1.5
1.0
2V
0.5
1V
125_C
1.0
0.5
1.5 V
0.0
0.0
0
1
2
3
4
0
1
VDS – Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
4
Capacitance
80
1.6
C – Capacitance (pF)
r DS(on) – On-Resistance ( W )
3
VGS – Gate-to-Source Voltage (V)
2.0
1.2
VGS = 2.5 V
VGS = 4.5 V
0.8
60
Ciss
40
Coss
Crss
20
0.4
0.0
0.0
0
0.5
1.0
1.5
0
2.0
5
Gate Charge
20
25
On-Resistance vs. Junction Temperature
r DS(on) – On-Resistance (W)
(Normalized)
VDS = 15 V
ID = 0.64 A
3
2
1
0
0.0
15
1.8
5
4
10
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
V GS – Gate-to-Source Voltage (V)
2
1.6
VGS = 4.5 V
ID = 0.64 A
1.4
1.2
1.0
0.8
0.2
0.4
0.6
Qg – Total Gate Charge (nC)
Document Number: 71445
S-03929—Rev. B, 21-May-01
0.8
0.6
–50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (_C)
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Si1904EDH
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
2.0
2
TJ = 150_C
r DS(on) – On-Resistance ( W )
I S – Source Current (A)
1
TJ = 25_C
1.6
ID = 0.2 A
1.2
ID = 0.64 A
0.8
0.4
0.0
0.1
0
0.6
0.3
0.9
1.2
0
1.5
VSD – Source-to-Drain Voltage (V)
2
3
4
5
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
0.2
5
ID = 250 mA
0.1
4
–0.0
3
Power (W)
V GS(th) Variance (V)
1
–0.1
2
1
–0.2
–0.3
–50
–25
0
25
50
75
100
125
150
0
0.01
0.1
1
10
100
600
Time (sec)
TJ – Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 170_C/W
0.02
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
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4
10–3
10–2
10–1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 71445
S-03929—Rev. B, 21-May-01
Si1904EDH
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
Document Number: 71445
S-03929—Rev. B, 21-May-01
10–3
10–2
10–1
Square Wave Pulse Duration (sec)
1
10
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