FAIRCHILD FDT86244

FDT86244
N-Channel Power Trench® MOSFET
150 V, 2.8 A, 128 mΩ
Features
General Description
„ Max rDS(on) = 128 mΩ at VGS = 10 V, ID = 2.8 A
This N-Channel MOSFET is produced using Fairchild
Semiconductor‘s advanced Power Trench® process that has
been optimized for rDS(on), switching performance and
ruggedness.
„ Max rDS(on) = 178 mΩ at VGS = 6 V, ID = 2.4 A
„ High performance trench technology for extremely low rDS(on)
„ High power and current handling capability in a widely used
surface mount package
Applications
„ Fast switching speed
„ Load Switch
„ 100% UIL Tested
„ Primary Switch
„ RoHS Compliant
D
D
S
D
SOT-223
G
G
D
S
MOSFET Maximum Ratings TC = 25 °C unless otherwise noted
Symbol
VDS
Drain to Source Voltage
Parameter
VGS
Gate to Source Voltage
Drain Current -Continuous
ID
(Note 1a)
-Pulsed
PD
TJ, TSTG
Units
V
±20
V
2.8
12
Single Pulse Avalanche Energy
EAS
Ratings
150
(Note 3)
12
Power Dissipation
TA = 25 °C
(Note 1a)
2.2
Power Dissipation
TA = 25 °C
(Note 1b)
1.0
Operating and Storage Junction Temperature Range
-55 to +150
A
mJ
W
°C
Thermal Characteristics
RθJC
Thermal Resistance, Junction to Case
RθJA
Thermal Resistance, Junction to Ambient
(Note 1)
12
(Note 1a)
55
°C/W
Package Marking and Ordering Information
Device Marking
86244
Device
FDT86244
©2011 Fairchild Semiconductor Corporation
FDT86244 Rev.C
Package
SOT-223
1
Reel Size
13 ’’
Tape Width
12 mm
Quantity
2500 units
www.fairchildsemi.com
FDT86244 N-Channel PowerTrench® MOSFET
May 2011
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 250 μA, VGS = 0 V
ΔBVDSS
ΔTJ
Breakdown Voltage Temperature
Coefficient
ID = 250 μA, referenced to 25 °C
IDSS
Zero Gate Voltage Drain Current
VDS = 120 V, VGS = 0 V
1
μA
IGSS
Gate to Source Leakage Current
VGS = ±20 V, VDS = 0 V
±100
nA
4.0
V
150
V
104
mV/°C
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = 250 μA
ΔVGS(th)
ΔTJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = 250 μA, referenced to 25 °C
VGS = 10 V, ID = 2.8 A
106
128
rDS(on)
Static Drain to Source On Resistance
VGS = 6 V, ID = 2.4 A
127
178
VGS = 10 V, ID = 2.8 A, TJ = 125 °C
196
237
VDS = 10 V, ID = 2.8 A
12
gFS
Forward Transconductance
2.0
3.1
-10
mV/°C
mΩ
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
VDS = 75 V, VGS = 0 V,
f = 1 MHz
295
395
pF
33
45
pF
2.4
5
pF
Ω
1.0
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
Qg(TOT)
5.3
11
1.3
10
ns
9.8
20
ns
2.4
10
ns
4.9
7
nC
VDD = 75 V, ID = 2.8 A,
VGS = 10 V, RGEN = 6 Ω
Total Gate Charge
VGS = 0 V to 10 V
Qg(TOT)
Total Gate Charge
VGS = 0 V to 5 V
2.8
4
Qgs
Total Gate Charge
Qgd
Gate to Drain “Miller” Charge
VDD = 75 V,
ID = 2.8 A
ns
nC
1.4
nC
1.3
nC
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VGS = 0 V, IS = 2.8 A
IF = 2.8 A, di/dt = 100 A/μs
(Note 2)
0.82
1.3
V
48
77
ns
44
70
nC
NOTES:
1. RθJA is determined with the device mounted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by
the user's board design.
a) 55 °C/W when mounted on a
1 in2 pad of 2 oz copper
b) 118 °C/W when mounted on
a minimum pad of 2 oz copper
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. Starting TJ = 25 °C; N-ch: L = 1 mH, IAS = 5 A, VDD = 135 V, VGS = 10 V.
©2011 Fairchild Semiconductor Corporation
FDT86244 Rev.C
2
www.fairchildsemi.com
FDT86244 N-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25 °C unless otherwise noted
12
VGS = 6 V
VGS = 10 V
ID, DRAIN CURRENT (A)
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
4
9
VGS = 5.5 V
6
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
3
VGS = 5 V
0
0
1
2
3
4
VGS = 5 V
VGS = 5.5 V
3
VGS = 6 V
2
1
0
5
0
3
Figure 1. On Region Characteristics
9
12
Figure 2. Normalized On-Resistance
vs Drain Current and Gate Voltage
500
ID = 2.8 A
VGS = 10 V
2.2
2.0
rDS(on), DRAIN TO
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
-75
SOURCE ON-RESISTANCE (mΩ)
2.4
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
6
ID, DRAIN CURRENT (A)
VDS, DRAIN TO SOURCE VOLTAGE (V)
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
400
300
200
TJ = 125 oC
100
TJ = 25 oC
4
-25
0
25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (oC)
IS, REVERSE DRAIN CURRENT (A)
9
TJ = 150 oC
6
TJ = 25 oC
3
TJ = -55 oC
0
3
4
5
6
6
7
8
9
20
10
1
TJ = 150 oC
TJ = 25 oC
0.1
TJ = -55 oC
0.01
0.001
0.2
7
VGS = 0 V
0.4
0.6
0.8
1.0
VGS, GATE TO SOURCE VOLTAGE (V)
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics
Figure 6. Source to Drain Diode
Forward Voltage vs Source Current
©2011 Fairchild Semiconductor Corporation
FDT86244 Rev.C
10
Figure 4. On-Resistance vs Gate to
Source Voltage
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
VDS = 5 V
5
VGS, GATE TO SOURCE VOLTAGE (V)
12
2
ID = 2.8 A
0
-50
Figure 3. Normalized On Resistance
vs Junction Temperature
ID, DRAIN CURRENT (A)
VGS = 10 V
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
3
1.2
www.fairchildsemi.com
FDT86244 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25 °C unless otherwise noted
1000
ID = 2.8 A
VDD = 50 V
8
Ciss
CAPACITANCE (pF)
VGS, GATE TO SOURCE VOLTAGE (V)
10
VDD = 75 V
6
VDD = 100 V
4
100
Coss
10
2
f = 1 MHz
VGS = 0 V
0
0
1
2
3
4
5
1
8
6
6
5
= 25 oC
TJ
= 100 oC
2
TJ = 125
oC
VGS = 10 V
4
VGS = 6 V
3
2
o
RθJC = 12 C/W
1
1
0.01
0.1
0
25
1
50
100
125
150
o
Figure 10. Maximum Continuous Drain
Current vs Case Temperature
Figure 9. Unclamped Inductive
Switching Capability
500
P(PK), PEAK TRANSIENT POWER (W)
20
10
100 us
1
1 ms
0.1
75
TC, CASE TEMPERATURE ( C)
tAV, TIME IN AVALANCHE (ms)
ID, DRAIN CURRENT (A)
100
Figure 8. Capacitance vs Drain
to Source Voltage
ID, DRAIN CURRENT (A)
IAS, AVALANCHE CURRENT (A)
Figure 7. Gate Charge Characteristics
TJ
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
Qg, GATE CHARGE (nC)
4
Crss
1
0.1
THIS AREA IS
LIMITED BY rDS(on)
0.01
0.005
0.1
10 ms
100 ms
SINGLE PULSE
TJ = MAX RATED
1s
RθJA = 118 oC/W
10 s
TA = 25 oC
1
DC
10
100
10
SINGLE PULSE
RθJA = 118 oC/W
TA = 25 oC
1
-4
500
10
-3
10
-2
10
-1
10
1
10
100
1000
t, PULSE WIDTH (sec)
VDS, DRAIN to SOURCE VOLTAGE (V)
Figure 11. Forward Bias Safe
Operating Area
©2011 Fairchild Semiconductor Corporation
FDT86244 Rev.C
100
Figure 12. Single Pulse Maximum
Power Dissipation
4
www.fairchildsemi.com
FDT86244 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25 °C unless otherwise noted
2
NORMALIZED THERMAL
IMPEDANCE, ZθJA
1
0.1
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
PDM
t1
t2
0.01
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TA
SINGLE PULSE
o
RθJA = 118 C/W
0.001
-4
10
-3
10
-2
10
-1
10
1
10
100
1000
t, RECTANGULAR PULSE DURATION (sec)
Figure 13. Junction-to-Ambient Transient Thermal Response Curve
©2011 Fairchild Semiconductor Corporation
FDT86244 Rev.C
5
www.fairchildsemi.com
FDT86244 N-Channel PowerTrench® MOSFET
Typical Characteristics TJ = 25 °C unless otherwise noted
tm
tm
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
www.Fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild
Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and
warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I54
©2011 Fairchild Semiconductor Corporation
FDT86244 Rev.C
6
www.fairchildsemi.com
FDT86244 N-Channel PowerTrench® MOSFET
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower™
FPS™
Power-SPM™
The Power Franchise®
Auto-SPM™
The Right Technology for Your Success™
F-PFS™
PowerTrench®
®
PowerXS™
AX-CAP™*
FRFET®
®
SM
BitSiC
Global Power Resource
Programmable Active Droop™
Build it Now™
Green FPS™
QFET®
TinyBoost™
QS™
CorePLUS™
Green FPS™ e-Series™
TinyBuck™
CorePOWER™
Gmax™
Quiet Series™
TinyCalc™
CROSSVOLT™
GTO™
RapidConfigure™
TinyLogic®
™
CTL™
IntelliMAX™
TINYOPTO™
Current Transfer Logic™
ISOPLANAR™
TinyPower™
DEUXPEED®
Saving our world, 1mW/W/kW at a time™
MegaBuck™
TinyPWM™
Dual Cool™
SignalWise™
MICROCOUPLER™
TinyWire™
EcoSPARK®
SmartMax™
MicroFET™
TranSiC®
EfficentMax™
SMART START™
MicroPak™
TriFault Detect™
®
ESBC™
SPM
MicroPak2™
TRUECURRENT®*
STEALTH™
MillerDrive™
®
μSerDes™
®
SuperFET
MotionMax™
SuperSOT™-3
Motion-SPM™
Fairchild®
SuperSOT™-6
mWSaver™
Fairchild Semiconductor®
UHC®
SuperSOT™-8
OptiHiT™
FACT Quiet Series™
®
Ultra FRFET™
SupreMOS®
OPTOLOGIC
FACT®
UniFET™
OPTOPLANAR®
SyncFET™
FAST®
®
VCX™
Sync-Lock™
FastvCore™
VisualMax™
®*
FETBench™
XS™
FlashWriter® *
PDP SPM™